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THREE-DIMENSIONAL MULTILAYER SOLENOID TRANSFORMER

  • US 20140322435A1
  • Filed: 07/08/2014
  • Published: 10/30/2014
  • Est. Priority Date: 05/03/2012
  • Status: Active Grant
First Claim
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1. A method comprising:

  • providing a substrate having a first surface and a second surface opposite the first surface;

    forming a plurality of vias in the substrate that each extend at least from the first surface to the second surface through the substrate;

    plating or filling the plurality of vias with a conductive material to form a plurality of conductive vias, the plurality of conductive vias including a first set of vias, a second set of vias, a third set of vias, and a fourth set of vias;

    depositing a first conductive layer over the first surface to form a first set of conductive traces over the first surface that each connect a via from the first set of vias with a via from the second set of vias;

    depositing one or more first dielectric layers over portions of the first set of traces;

    depositing a second conductive layer over the first dielectric layers to form a second set of conductive traces that each connect a via from the third set of vias with a via from the fourth set of vias;

    depositing a third conductive layer over the second surface to form a third set of conductive traces that each connect a via from the third set of vias with a via from the fourth set of vias;

    depositing one or more second dielectric layers over portions of the third set of traces; and

    depositing a fourth conductive layer over the second dielectric layers to form a fourth set of conductive traces that each connect a via from the first set of vias with a via from the second set of vias.

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