THREE-DIMENSIONAL MULTILAYER SOLENOID TRANSFORMER
First Claim
1. A method comprising:
- providing a substrate having a first surface and a second surface opposite the first surface;
forming a plurality of vias in the substrate that each extend at least from the first surface to the second surface through the substrate;
plating or filling the plurality of vias with a conductive material to form a plurality of conductive vias, the plurality of conductive vias including a first set of vias, a second set of vias, a third set of vias, and a fourth set of vias;
depositing a first conductive layer over the first surface to form a first set of conductive traces over the first surface that each connect a via from the first set of vias with a via from the second set of vias;
depositing one or more first dielectric layers over portions of the first set of traces;
depositing a second conductive layer over the first dielectric layers to form a second set of conductive traces that each connect a via from the third set of vias with a via from the fourth set of vias;
depositing a third conductive layer over the second surface to form a third set of conductive traces that each connect a via from the third set of vias with a via from the fourth set of vias;
depositing one or more second dielectric layers over portions of the third set of traces; and
depositing a fourth conductive layer over the second dielectric layers to form a fourth set of conductive traces that each connect a via from the first set of vias with a via from the second set of vias.
2 Assignments
0 Petitions
Accused Products
Abstract
This disclosure provides implementations of inductors, transformers, and related processes. In one aspect, a device includes a substrate having first and second surfaces. A first inducting arrangement includes a first set of vias, a second set of vias, a first set of traces arranged over the first surface connecting the first and second vias, and a second set of traces arranged over the second surface connecting the first and second vias. A second inducting arrangement is inductively-coupled and interleaved with the first inducting arrangement and includes a third set of vias, a fourth set of vias, a third set of traces arranged over the first surface connecting the third and fourth vias, and a fourth set of traces arranged over the second surface connecting the third and fourth vias. One or more sets of dielectric layers insulate portions of the traces from one another.
4 Citations
15 Claims
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1. A method comprising:
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providing a substrate having a first surface and a second surface opposite the first surface; forming a plurality of vias in the substrate that each extend at least from the first surface to the second surface through the substrate; plating or filling the plurality of vias with a conductive material to form a plurality of conductive vias, the plurality of conductive vias including a first set of vias, a second set of vias, a third set of vias, and a fourth set of vias; depositing a first conductive layer over the first surface to form a first set of conductive traces over the first surface that each connect a via from the first set of vias with a via from the second set of vias; depositing one or more first dielectric layers over portions of the first set of traces; depositing a second conductive layer over the first dielectric layers to form a second set of conductive traces that each connect a via from the third set of vias with a via from the fourth set of vias; depositing a third conductive layer over the second surface to form a third set of conductive traces that each connect a via from the third set of vias with a via from the fourth set of vias; depositing one or more second dielectric layers over portions of the third set of traces; and depositing a fourth conductive layer over the second dielectric layers to form a fourth set of conductive traces that each connect a via from the first set of vias with a via from the second set of vias. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method comprising:
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providing a substrate having a first surface and a second surface opposite the first surface; forming a plurality of vias in the substrate that each extend at least from the first surface to the second surface through the substrate; plating or filling the plurality of vias with a conductive material to form a plurality of conductive vias, the plurality of conductive vias including a first set of vias, a second set of vias, a third set of vias, and a fourth set of vias; depositing a first conductive layer over the first surface to form a first set of conductive traces over the first surface that each connect a via from the first set of vias with a via from the second set of vias; depositing one or more first dielectric layers over portions of the first set of traces; depositing a second conductive layer over the first dielectric layers to form a second set of conductive traces that each connect a via from the third set of vias with a via from the fourth set of vias; depositing a third conductive layer over the second surface to form a third set of conductive traces that each connect a via from the first set of vias with a via from the second set of vias; depositing one or more second dielectric layers over portions of the third set of traces; and depositing a fourth conductive layer over the second dielectric layers to form a fourth set of conductive traces that each connect a via from the third set of vias with a via from the fourth set of vias. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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Specification