Adhesive Substance, in Particular for Encapsulating an Electronic Assembly

• US 20140322526A1
• Filed: 10/19/2012
• Published: 10/30/2014
• Est. Priority Date: 10/21/2011
• Status: Abandoned Application

• Current Assignee: Tesa SE (maxingvest GmbH & Co. KGaA)
• Original Assignee: Tesa SE (maxingvest GmbH & Co. KGaA)
• Inventors: Dollase, Thilo, Krawinkel, Thorsten, Bai, Minyoung
• Application Number:
  US14/353,179
• Publication Number:
  US 20140322526A1
• Time in Patent Office: Days
• US Class Current: 428/337
• CPC Class Codes: B32B 17/10 of synthetic resin
• CPC Class Codes: C03C 27/10 with the aid of adhesive specially adapted for that purpose
• CPC Class Codes: C08L 2205/03 containing three or more polymers in a blend
• CPC Class Codes: C08L 35/02 Homopolymers or copolymers of esters C08L35/06, C08L35/08 take precedence
• CPC Class Codes: C08L 53/00 Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
• CPC Class Codes: C08L 93/00 Compositions of natural resins; Compositions of derivatives thereof of polysaccharides C08L1/00 - C08L5/00; of natural rubber C08L7/00
• CPC Class Codes: C09J 135/02 Homopolymers or copolymers of esters C09J135/06, C09J135/08 take precedence
• CPC Class Codes: C09J 153/00 Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
• CPC Class Codes: C09J 153/02 Vinyl aromatic monomers and conjugated dienes
• CPC Class Codes: C09J 193/00 Adhesives based on natural resins; Adhesives based on derivatives thereof
• CPC Class Codes: C09J 193/04 Rosin
• CPC Class Codes: C09J 7/22 Plastics; Metallised plastics
• CPC Class Codes: C09J 7/38 Pressure-sensitive adhesives [PSA]
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 428/266 of base or substrate
• CPC Class Codes: Y10T 428/2891 including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof

Abstract

The invention relates to an adhesive substance, in particular for encapsulating an electronic assembly against permeates, said substance comprising: (a) at least one copolymer containing at least isobutene or butene as comonomer types and at least one comonomer type which, when regarded as a hypothetical homopolymer, has a softening temperature greater than 40° C.; (b) at least one type of an at least partially hydrogenated adhesive resin; (c) at least one acrylate- or methacrylate-based type of reactive resin with a softening temperature less than 40° C., preferably less than 20° C.; and (d) at least one type of photoinitiator for initiating radical curing.

Claims

1. An adhesive for encapsulating an electronic arrangement with respect to permeants, comprising

(a) at least one copolymer comprising at least isobutylene or butylene as comonomer and at least one comonomer which has a softening temperature of greater than 40°

C.,

(b) at least one partly hydrogenated tackifier resin,

(c) at least one reactive resin based on acrylates or methacrylates having a softening temperature of less than 40°

C., and

(d) at least one kind of a photoinitiator for initiating free-radical curing.

2. The adhesive according to claim 1, wherein copolymer is random, alternating, block, star and/or graft copolymers having a molar mass M_w of 300 000 g/mol or less.

3. The adhesive according to claim 2, wherein the copolymer is block, star and/or graft copolymers which contain at least a first polymer block (“

soft block”

) having a softening temperature of less than −

20°

C. and at least a second polymer block (“

hard block”

) having a softening temperature of greater than +40°

C.

4. The adhesive according to claim 3, wherein the soft block is of apolar construction and comprises butylene or isobutylene as homopolymer block or copolymer block, the latter copolymerized with itself or with one another or with further comonomers.

5. The adhesive according to claim 3, wherein the hard block is constructed from styrene, styrene derivatives and/or from other aromatic or (cyclo)aliphatic hydrocarbon monomers or from methacrylates or from acrylates.

6. The adhesive according to claim 1, wherein the at least one block copolymer is a triblock copolymer constructed from two terminal hard blocks and one middle soft block.

7. The adhesive according to claim 1, wherein the tackifier resin or resins has or have a degree of hydrogenation of at least 70%.

8. The adhesive according to claim 1, wherein the adhesive comprises at least one resin which has a DACP of more than 30°

C. and a MMAP of more than 50°

C.

9. The adhesive according to claim 1, wherein the adhesive comprises at least one reactive resin which is aliphatic or cycloaliphatic in nature.

10. The adhesive according to claim 1, further comprising photoinitiators which absorb UV light below 350 nm and which permit free-radical curing.

11. The adhesive according to claim 10, wherein the photoinitiators absorb UV light above 250 nm and below 350 nm.

12. The adhesive according to claim 1, comprising one or more additives preferably selected from the group consisting of plasticizers, primary antioxidants, secondary antioxidants, process stabilizers, light stabilizers, processing assistants, endblock reinforcer resins, and polymers.

13. The adhesive according to claim 1, comprising one or more filler selected from the group consisting of nanoscale fillers, transparent fillers and/or getter and/or scavenger fillers.

14. The adhesive according to claim 1, wherein the adhesive is transparent in the visible light of the spectrum (wavelength range from about 400 nm to 800 nm).

15. The adhesive according to claim 1, wherein the adhesive exhibits a haze of less than 5.0%.

16. An adhesive tape comprising an adhesive according to claim 1, and a carrier, wherein the carrier has a permeation barrier of WVTR <

0.1 g/(m² d) and OTR <

0.1 cm³/(m² d bar).

17. The adhesive tape according to claim 16, wherein the carrier is a coated polymeric film.

18. The adhesive tape according to claim 16, wherein the carrier has a layer of a flexible thin glass with a layer thickness of not more than 1 mm, the carrier comprising a layer of a thin glass with a layer thickness of not more than 1 mm, and the thin glass is a borosilicate glass or an alkali-free aluminoborosilicate glass.

19. The adhesive tape according to claim 18, wherein the thin glass is present in tape-like geometry.

20. A method for encapsulating an (opto)electronic arrangement comprising encapsulating an (opto)electronic arrangement with an adhesive according to claim 1.

21. The method according to claim 20, wherein the pressure-sensitive adhesive and/or the regions of the electronic arrangement that are to be encapsulated are heated before, during and/or after the application of the pressure-sensitive adhesive.

22. The method according to claim 20, wherein the pressure-sensitive adhesive is cured partly or to completion on the electronic arrangement after application.