RESIN COMPOSITION FOR SEALING

• US 20140323669A1
• Filed: 07/15/2014
• Published: 10/30/2014
• Est. Priority Date: 01/16/2012
• Status: Active Grant

• Current Assignee: Ajinomoto Co., Inc.
• Original Assignee: Ajinomoto Co., Inc.
• Inventors: KAGEYAMA, Yuichi
• Granted Patent: US 9,676,978 B2
• Time in Patent Office: Days
• US Class Current: 525/92.R
• CPC Class Codes: C08L 101/00 Compositions of unspecified macromolecular compounds
• CPC Class Codes: C08L 23/22 Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefins
• CPC Class Codes: C08L 53/005 Modified block copolymers
• CPC Class Codes: C08L 57/02 Copolymers of mineral oil hydrocarbons
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: C08L 91/00 Compositions of oils, fats or waxes; Compositions of derivatives thereof
• CPC Class Codes: C09K 2200/0617 Polyalkenes
• CPC Class Codes: C09K 2200/0632 Polystyrenes
• CPC Class Codes: C09K 3/1006 characterised by the chemical nature of one of its constituents
• CPC Class Codes: H10K 50/841 Self-supporting sealing arrangements
• CPC Class Codes: H10K 50/844 Encapsulations
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass

Abstract

Provided is a sealing resin composition simultaneously having good transparency, resistance to moisture permeability, and adhesiveness resistant to heat and humidity, and a sealing resin composition sheet obtained therefrom.

Using a resin composition containing (A) a styrene-isobutylene modified resin and (B) a tackifier resin as a sealing resin composition, a resin composition layer composed m of the resin composition is formed on a support to give a sealing resin composition sheet.

Claims

1. A sealing resin composition, comprising:

(A) at least one styrene-isobutylene modified resin; and

(B) at least one tackifier resin.

2. A sealing resin composition according to claim 1, wherein said (A) at least one styrene-isobutylene modified resin is a styrene-isobutylene-styrene modified resin.

3. A sealing resin composition according to claim 1, wherein said (A) at least one styrene-isobutylene modified resin is a block copolymer containing a polystyrene skeleton and a polyisobutylene skeleton, and having at least one functional group.

4. A sealing resin composition according to claim 3, wherein said functional group is one or more kinds selected from the group consisting of an acid anhydride group, an epoxy group, a carboxyl group, an amino group, a hydroxyl group, an isocyanate group, an oxazoline group, an oxetane group, a cyanate group, a phenol group, a hydrazide group, and an amide group.

5. A sealing resin composition according to claim 1, wherein the content of said (A) at least one styrene-isobutylene modified resin is 35 to 80 mass % when the non-volatile component in the resin composition is 100 mass %.

6. A sealing resin composition according to claim 1, wherein said (B) at least one tackifier resin is an alicyclic petroleum resin.

7. A sealing resin composition according to claim 1, wherein said (B) at least one tackifier resin is an alicyclic saturated hydrocarbon resin and/or an alicyclic unsaturated hydrocarbon resin.

8. A sealing resin composition according to claim 1, wherein said (B) at least one tackifier resin is a cyclohexane ring-containing saturated hydrocarbon resin and/or a dicyclopentadiene-modified hydrocarbon resin.

9. A sealing resin composition according to claim 1, wherein the content of said (B) at least one tackifier resin is 5 to 60 mass % when the non-volatile component in the resin composition is 100 mass %.

10. A sealing resin composition according to claim 1, further comprising (C) at least one epoxy resin.

11. A sealing resin composition according to claim 1, further comprising (D) at least one curing agent.

12. A sealing resin composition according to claim 1, wherein a cured product of said resin composition has a parallel light transmittance at 450 nm of 80 to 100%.

13. A sealing resin composition according to claim 1, wherein a cured product of said resin composition has a moisture-vapor transmission of 1 to 40 g/m², and an adhesion strength after environment test of 10 to 50 N/25 mm.

14. A sealing resin composition sheet, comprising a sealing resin composition according to claim 1.

15. A sealing resin composition sheet according to claim 14, wherein said sealing resin composition is formed on a support.

16. A sealing resin composition sheet according to claim 14, which is for sealing an organic EL element.

17. A method of sealing an organic EL element, comprising coating said organic EL element with a sealing resin composition according to claim 1.

18. A method of sealing an organic EL element, comprising laminating said organic EL element with a sealing resin composition sheet according to claim 15.

19. An organic EL device, comprising a sealing resin composition according to claim 1.

20. An organic EL device, which is prepared by a method according to claim 18.