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HIGH PERFORMANCE PRINTED CIRCUIT BOARD

  • US 20140326495A1
  • Filed: 08/27/2012
  • Published: 11/06/2014
  • Est. Priority Date: 08/25/2011
  • Status: Abandoned Application
First Claim
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1. A printed circuit board comprising:

  • an insulating portion;

    a plurality of conductive traces disposed in a plurality of planes, the plurality of conductive traces being supported by the insulating portion; and

    conductive vias electrically interconnecting predetermined conductive traces of the plurality of conductive traces, wherein the conductive traces connect to respective conductive vias in breakout regions and wherein at least one parameter of a breakout region is configured to provide a desired electrical characteristic.

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