STRUCTURES AND METHODS FOR TESTING INTEGRATED CIRCUITS AND VIA CHAINS THEREIN
First Claim
1. A structure for testing an integrated circuit comprising:
- a semiconductor substrate;
a first via chain disposed over the semiconductor substrate, wherein the first via chain includes a first sequence of segments interconnected at N via regions by a first via arrangement, wherein the first via arrangement includes MN first vias at each respective via region in the first via chain;
a second via chain disposed over the semiconductor substrate, wherein the second via chain includes a second sequence of segments interconnected at N via regions by a second via arrangement different from the first via arrangement, wherein the second via arrangement includes MN+KN second vias at each via region in the second via chain, wherein KN≧
1 for at least one via region, and wherein the second sequence of segments is substantially the same as the first sequence of segments; and
a voltage sensing apparatus in electrical connection with each via chain and configured to drive a first constant current through the first via chain and to drive a second constant current through the second via chain to measure a differential voltage between the via chains.
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Abstract
An exemplary structure for testing an integrated circuit includes a semiconductor substrate and first and second via chains disposed over the substrate. The via chains include a substantially same sequence of segments interconnected at N via regions by a respective first and second via arrangement. The first via arrangement includes MN first vias at each respective via region and the second via arrangement includes MN+KN second vias at each respective via region. The first via arrangement is different than the second via arrangement and KN≧1 for at least one via region. The structure includes a voltage sensing apparatus in electrical connection with each via chain and configured to drive a first constant current through the first via chain and to drive a second constant current through the second via chain to measure a differential voltage between the via chains.
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Citations
20 Claims
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1. A structure for testing an integrated circuit comprising:
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a semiconductor substrate; a first via chain disposed over the semiconductor substrate, wherein the first via chain includes a first sequence of segments interconnected at N via regions by a first via arrangement, wherein the first via arrangement includes MN first vias at each respective via region in the first via chain; a second via chain disposed over the semiconductor substrate, wherein the second via chain includes a second sequence of segments interconnected at N via regions by a second via arrangement different from the first via arrangement, wherein the second via arrangement includes MN+KN second vias at each via region in the second via chain, wherein KN≧
1 for at least one via region, and wherein the second sequence of segments is substantially the same as the first sequence of segments; anda voltage sensing apparatus in electrical connection with each via chain and configured to drive a first constant current through the first via chain and to drive a second constant current through the second via chain to measure a differential voltage between the via chains. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A structure for testing a via chain comprising:
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a first via chain having N via regions, wherein each via region includes MN vias; a second via chain having N via regions, wherein each via region includes MN+KN vias and wherein; KN≧
2 for at least two via regions when MN=1;KN≧
1 for at least three via regions when MN=1;
orKN≧
1 for at least seven via regions when MN=2; anda voltage sensing apparatus in electrical connection with each via chain and configured to drive a first constant current through the first via chain and to drive a second constant current through the second via chain to measure a differential voltage between the first via chain and the second via chain. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
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19. A method for testing an integrated circuit, the method comprising:
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providing a semiconductor substrate disposed with a first via chain and a second via chain, wherein the first via chain includes a first sequence of segments interconnected at N via regions by a first via arrangement, wherein the first via arrangement includes a selected number of first vias at each respective via region in the first via chain, wherein the second via chain includes a second sequence of segments interconnected at N via regions by a second via arrangement different from the first via arrangement, wherein the second via arrangement includes a selected number of second vias at each respective via region in the second via chain, and wherein the second sequence of segments is substantially the same as the first sequence of segments; driving a first constant current through the first via chain; driving a second constant current through the second via chain, wherein the second constant current is equal to the first constant current; and calculating a resistance of the first vias in the first via chain. - View Dependent Claims (20)
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Specification