ELECTRONIC DEVICE

• US 20140328036A1
• Filed: 05/01/2013
• Published: 11/06/2014
• Est. Priority Date: 05/01/2013
• Status: Active Grant

• Current Assignee: TE Connectivity Solutions GmbH (TE Connectivity Ltd. (United Kingdom))
• Original Assignee: Tyco Electronics Corporation (TE Connectivity Ltd. (United Kingdom))
• Inventors: Sarraf, David Bruce, Malstrom, Charles Randall
• Granted Patent: US 9,474,152 B2
• Time in Patent Office: Days
• US Class Current: 361/760
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01R 12/728 Coupling devices without an insulating housing provided on the edge of the PCB
• CPC Class Codes: H05K 1/092 Dispersed materials, e.g. conductive pastes or inks
• CPC Class Codes: H05K 1/11 Printed elements for providing electric connections to or between printed circuits
• CPC Class Codes: H05K 2201/0311 Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
• CPC Class Codes: H05K 2201/0999 Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
• CPC Class Codes: H05K 2201/10295 Metallic connector elements partly mounted in a hole of the PCB
• CPC Class Codes: H05K 2201/1034 Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB tab H05K2201/0397
• CPC Class Codes: H05K 2201/10386 Clip leads; Terminals gripping the edge of a substrate
• CPC Class Codes: H05K 3/12 using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
• CPC Class Codes: H05K 3/32 electrically connecting electric components or wires to printed circuits
• CPC Class Codes: H05K 3/4015 using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

An electronic device includes a dielectric substrate having a first surface, a conductive circuit deposited on the first surface and having a printed conductive ink trace on the first surface, and a conductive interposer mechanically coupled to the substrate. The conductive interposer is electrically coupled to the conductive circuit. The conductive interposer has a separable contact interface configured to be mechanically and electrically connected to a removable contact. Optionally, the conductive interposer may include a main body and a flexible element extending between the main body and the conductive circuit. The flexible element electrically connects the conductive circuit with the main body.

Claims

1. An electronic device comprising:

a dielectric substrate having a first surface;

a conductive circuit deposited on the first surface, the conductive circuit comprising a printed conductive ink trace on the first surface; and

a conductive interposer mechanically coupled to the substrate, the conductive interposer being electrically coupled to the conductive circuit, the conductive interposer having a separable contact interface configured to be mechanically and electrically connected to a removable contact.

2. The electronic device of claim 1, wherein the conductive interposer comprises a post extending through the conductive circuit into the substrate, the post fixing the relative position between the conductive interposer and the substrate.

3. The electronic device of claim 2, wherein the conductive interposer comprises an arm extending from the post along the first surface, the conductive circuit being positioned between the arm and the first surface, the arm defining the separable contact interface.

4. The electronic device of claim 1, wherein the conductive interposer comprises a main body and a flexible element extending between the main body and the conductive circuit, the flexible element electrically connecting the conductive circuit with the main body, the main body defining the separable contact interface with the removable contact.

5. The electronic device of claim 1, wherein the conductive interposer comprises a flexible, conductive gasket directly engaging and being electrically connected to the conductive circuit.

6. The electronic device of claim 1, wherein the conductive interposer comprises a flexible spring beam directly engaging and being electrically connected to the conductive circuit.

7. The electronic device of claim 1, wherein the conductive interposer is connected to the conductive circuit along a wiping contact surface, the conductive interposer allowing non-damaging wiping to occur between the conductive interposer and the conductive circuit.

8. The electronic device of claim 1, wherein the printed conductive ink trace is applied to the first surface and to the conductive interposer.

9. The electronic device of claim 1, wherein the conductive circuit comprises an antenna, the contact comprises a feed line attached to the antenna by the conductive interposer.

10. The electronic device of claim 1, wherein the substrate comprises a case of the electronic device, the conductive circuit being applied directly to the case, the case being configured to hold electronic components therein.

11. The electronic device of claim 1, wherein the first surface is non-planar having at least one transition, the printed conductive ink trace being applied to the non-planar first surface across the at least one transition.

12. An electronic device comprising:

a dielectric substrate having a first surface;

a conductive circuit deposited on the first surface, the conductive circuit comprising a printed conductive ink trace on the first surface; and

a conductive interposer mechanically coupled to the substrate, the conductive interposer having a main body and a flexible element extending between the main body and the conductive circuit, the flexible element electrically connecting the conductive circuit and the main body, the main body having a separable contact interface configured to be mechanically and electrically connected to a removable contact.

13. The electronic device of claim 12, wherein the main body comprises an arm extending along the first surface, the conductive circuit being positioned between the arm and the first surface, the flexible element extending between the arm and the conductive circuit.

14. The electronic device of claim 12, wherein the flexible element comprises a flexible, conductive gasket directly engaging and being electrically connected to the conductive circuit.

15. The electronic device of claim 12, wherein the flexible element comprises a flexible spring beam integral with the main body and directly engaging and being electrically connected to the conductive circuit.

16. The electronic device of claim 12, wherein the flexible element defines a wiping contact surface, the flexible element allowing non-damaging wiping to occur between the conductive interposer and the conductive circuit.

17. A method of manufacturing an electronic device, the method comprising:

printing a conductive ink trace on the substrate to form a conductive circuit on the substrate;

coupling a conductive interposer to the substrate, the conductive interposer being electrically coupled to the conductive circuit, the conductive interposer having a separable contact interface; and

removably coupling a contact to the conductive interposer at the separable contact interface.

18. The method of claim 17, wherein said coupling a conductive interposer comprises coupling a conductive interposer having a main body and a flexible element to the substrate such that the flexible element engages and electrically connects the conductive circuit to the main body.

19. The method of claim 17, further comprising providing a substrate having a base wall and a side wall extending from the base wall, the base wall and the side wall meeting at a corner, the base wall and the side wall defining a non-planar surface spanning the corner, said printing a conductive ink trace comprises printing a conductive ink trace on the non-planar surface such that the conductive circuit spans the corner with at least part of the conductive circuit on the base wall and at least part of the conductive circuit on the side wall.

20. The method of claim 17, further comprising plating the printed conductive ink trace to form the conductive circuit.