Packaging Process Tools and Packaging Methods for Semiconductor Devices
First Claim
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1. A packaging tool for semiconductor devices comprising:
- a mechanical structure comprising a frame including a plurality of apertures adapted to retain a plurality of integrated circuit dies therein, wherein the frame comprises at least one enclosed hollow region.
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Abstract
Packaging process tools and packaging methods for semiconductor devices are disclosed. In one embodiment, a packaging process tool for semiconductor devices includes a mechanical structure including a frame. The frame includes a plurality of apertures adapted to retain a plurality of integrated circuit dies therein. The frame includes at least one hollow region.
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Citations
20 Claims
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1. A packaging tool for semiconductor devices comprising:
a mechanical structure comprising a frame including a plurality of apertures adapted to retain a plurality of integrated circuit dies therein, wherein the frame comprises at least one enclosed hollow region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A packaging tool for semiconductor devices comprising:
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a jig having one or more enclosed regions, the jig having a plurality of apertures adapted to retain integrated circuit dies; a packaging substrate support adapted to support a packaging substrate during processing; and a jig support adapted to support the jig in position relative to the packaging substrate. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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16. A packaging tool for semiconductor devices comprising:
a jig, the jig comprising; a first member having a first plurality of openings; a second member parallel to the first member, the second member having a second plurality of openings; and sidewall members interposed between the first member along the first plurality of openings and the second member along the second plurality of openings, thereby forming apertures extending from the first member to the second member. - View Dependent Claims (17, 18, 19, 20)
Specification