Packaging Process Tools and Packaging Methods for Semiconductor Devices

• US 20140331462A1
• Filed: 07/23/2014
• Published: 11/13/2014
• Est. Priority Date: 10/11/2011
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Lu, Wen-Hsiung, Cheng, Ming-Da, Lin, Wei-Hung, Huang, Kuei-Wei, Lin, Chun-Cheng, Liu, Chung-Shi, Lin, Chih-Wei
• Granted Patent: US 9,218,999 B2
• Time in Patent Office: Days
• US Class Current: 29/25.01
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/68372 used to support a device or wafer when forming electrical connections thereto when forming bonding pads H01L24/03; when forming bump connectors H01L24/11; when forming layer connectors H01L24/27
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05027 the internal layer extending out of an opening
• CPC Class Codes: H01L 2224/05124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05552 in top view
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05572 the external layer extending out of an opening
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/11444 in gaseous form
• CPC Class Codes: H01L 2224/1145 Physical vapour deposition [PVD], e.g. evaporation, or sputtering
• CPC Class Codes: H01L 2224/11452 Chemical vapour deposition [CVD], e.g. laser CVD
• CPC Class Codes: H01L 2224/11462 Electroplating
• CPC Class Codes: H01L 2224/13082 Two-layer arrangements
• CPC Class Codes: H01L 2224/13083 Three-layer arrangements
• CPC Class Codes: H01L 2224/13111 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/13116 Lead [Pb] as principal constituent
• CPC Class Codes: H01L 2224/13124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/13139 : Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/13144 : Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13147 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/13155 : Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/13169 : Platinum [Pt] as principal constituent
• CPC Class Codes: H01L 2224/14135 : Covering only the peripheral area of the surface to be connected, i.e. peripheral arrangements
• CPC Class Codes: H01L 2224/16225 : the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16238 : the bump connector connecting to a bonding area protruding from the surface of the item
• CPC Class Codes: H01L 2224/2919 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32225 : the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 : the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/75754 : Guiding structures
• CPC Class Codes: H01L 2224/7698 : specially adapted for batch processes
• CPC Class Codes: H01L 2224/81 : using a bump connector
• CPC Class Codes: H01L 2224/81001 : involving a temporary auxiliary member not forming part of the bonding apparatus
• CPC Class Codes: H01L 2224/81136 : involving guiding structures, e.g. spacers or supporting members
• CPC Class Codes: H01L 2224/81191 : wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81203 : Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
• CPC Class Codes: H01L 2224/81815 : Reflow soldering
• CPC Class Codes: H01L 2224/81907 : Intermediate bonding, i.e. intermediate bonding step for temporarily bonding the semiconductor or solid-state body, followed by at least a further bonding step
• CPC Class Codes: H01L 2224/83102 : using surface energy, e.g. capillary forces
• CPC Class Codes: H01L 2224/9205 : Intermediate bonding steps, i.e. partial connection of the semiconductor or solid-state body during the connecting process
• CPC Class Codes: H01L 2224/92125 : the second connecting process involving a layer connector
• CPC Class Codes: H01L 2224/95001 : involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate
• CPC Class Codes: H01L 2224/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3128 : the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/562 : Protection against mechanical damage H01L23/02, H01L23/28 take precedence
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/11 : Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/14 : of a plurality of bump connectors
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/75 : Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/013 : Alloys
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/351 : Thermal stress
• CPC Class Codes: H01L 2924/3511 : Warping
• CPC Class Codes: H01L 2924/3512 : Cracking
• CPC Class Codes: H01L 2924/3841 : Solder bridging

Abstract

Packaging process tools and packaging methods for semiconductor devices are disclosed. In one embodiment, a packaging process tool for semiconductor devices includes a mechanical structure including a frame. The frame includes a plurality of apertures adapted to retain a plurality of integrated circuit dies therein. The frame includes at least one hollow region.

Claims

1. A packaging tool for semiconductor devices comprising:

a mechanical structure comprising a frame including a plurality of apertures adapted to retain a plurality of integrated circuit dies therein, wherein the frame comprises at least one enclosed hollow region.

2. The packaging tool according to claim 1, further comprising:

a first support for a packaging substrate; and

a second support for the mechanical structure proximate the first support for the packaging substrate.

3. The packaging tool according to claim 1, wherein the frame of the mechanical structure includes a first side, a second side opposite the first side, and a plurality of connecting members coupled between the first side and the second side at edges of the first side and the second side.

4. The packaging tool according to claim 3, wherein the first side, the second side, and the plurality of connecting members of the frame comprise a thickness of about 0.1 mm to about 10 mm.

5. The packaging tool according to claim 3, wherein the first side, the second side, and the plurality of connecting members of the frame comprise stainless steel, aluminum, ceramic, rubber, epoxy, a plastic polymer, or combinations thereof.

6. The packaging tool according to claim 3, wherein the frame further comprises at least one support member coupled between the first side and the second side or between opposing connecting members.

7. The packaging tool according to claim 6, wherein the at least one support member of the frame is disposed substantially perpendicular to the first side and the second side or to the opposing connecting members.

8. The packaging tool according to claim 6, wherein the at least one support member of the frame is disposed non-perpendicular relative to the first side or the second side or to the opposing connecting members.

9. A packaging tool for semiconductor devices comprising:

a jig having one or more enclosed regions, the jig having a plurality of apertures adapted to retain integrated circuit dies;

a packaging substrate support adapted to support a packaging substrate during processing; and

a jig support adapted to support the jig in position relative to the packaging substrate.

10. The packaging tool according to claim 9, wherein the jig comprises:

a first member having a first plurality of openings;

a second member having a second plurality of openings, the first plurality of openings being aligned with the second plurality of openings; and

sidewalls connecting the first member and the second member such that the first member is spaced apart from the second member.

11. The packaging tool according to claim 10, wherein the jig further comprises one or more support members extending between the first member and the second member, the one or more support members being interposed between the sidewalls.

12. The packaging tool according to claim 11, wherein the support members are perpendicular to the first member and the second member.

13. The packaging tool according to claim 11, wherein the support members are non-perpendicular to the first member and the second member.

14. The packaging tool according to claim 10, wherein the first member and the second member each have a thickness of about 0.1 mm to about 10 mm.

15. The packaging tool according to claim 9, wherein the jig comprises stainless steel, aluminum, ceramic, rubber, epoxy, a plastic polymer, or combinations thereof.

16. A packaging tool for semiconductor devices comprising:

a jig, the jig comprising;

a first member having a first plurality of openings;

a second member parallel to the first member, the second member having a second plurality of openings; and

sidewall members interposed between the first member along the first plurality of openings and the second member along the second plurality of openings, thereby forming apertures extending from the first member to the second member.

17. The packaging tool according to claim 16, further comprising:

a first support for a packaging substrate; and

a second support for the jig proximate the first support for the packaging substrate.

18. The packaging tool according to claim 16, wherein at least one of the first member and the second member have a thickness of about 0.1 mm to about 10 mm.

19. The packaging tool according to claim 16, wherein the jig comprises stainless steel, aluminum, ceramic, rubber, epoxy, a plastic polymer, or combinations thereof.

20. The packaging tool according to claim 16, wherein the jig has a thickness of about 1 mm to about 100 mm.