MEMS SENSORS

• US 20140331769A1
• Filed: 04/30/2014
• Published: 11/13/2014
• Est. Priority Date: 04/30/2013
• Status: Active Grant

• Current Assignee: Atlantic Inertial Systems Ltd (Rtx Corporation)
• Original Assignee: Atlantic Inertial Systems Ltd (Rtx Corporation)
• Inventors: Fell, Chris
• Granted Patent: US 9,709,401 B2
• Time in Patent Office: Days
• US Class Current: 73/504.12
• CPC Class Codes: G01C 19/5684 the devices involving a micromechanical structure
• CPC Class Codes: G01C 19/5719 using planar vibrating masses driven in a translation vibration along an axis
• CPC Class Codes: G01C 19/5769 Manufacturing; Mounting; Housings
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.

Abstract

A MEMS sensor comprises a vibrating sensing structure formed from a semiconductor substrate layer (50). The semiconductor substrate layer (50) is mounted on a pedestal comprising an electrically insulating substrate layer (52) bonded to the semiconductor substrate (50) to form a rectangular sensor chip. The pedestal further comprises an electrically insulating spacer layer (54) for mounting the sensor chip to a housing. The electrically insulating spacer layer (54) is octagonal. When the vibrating sensing structure is excited into a cos 2θ vibration mode pair, the quadrature bias arising from any mode frequency split is not affected by changes in temperature as a result of the octagonal spacer layer (54).

Claims

1. A MEMS sensor comprising:

a vibrating sensing structure formed from a semiconductor substrate layer, the semiconductor substrate layer being mounted on a pedestal comprising an electrically insulating substrate layer bonded to the semiconductor substrate to form a rectangular sensor chip; and

the pedestal further comprising at least one electrically insulating spacer layer for mounting the sensor chip to a housing, wherein the electrically insulating spacer layer is octagonal.

2. The MEMS sensor of claim 1, wherein the octagonal spacer layer is thicker than the electrically insulating substrate layer that directly mounts the semiconductor substrate layer.

3. The MEMS sensor of claim 1, wherein the octagonal spacer layer is formed with voids before it is mounted to the electrically insulating substrate layer and the substrate layers are cut to form the pedestal.

4. The MEMS sensor of claim 1, wherein the octagonal spacer layer is formed separately and then mounted to the rectangular sensor chip.

5. The MEMS sensor of claim 1, wherein the octagonal spacer layer has an asymmetric shape.

6. The MEMS sensor of claim 1, comprising a drive transducer arranged to cause the vibrating sensing structure to vibrate in a primary in-plane resonance mode that is a cos 2θ

resonance mode.

7. The MEMS sensor of claim 1, wherein the sensor is a vibrating structure gyroscope and the vibrating sensing structure comprises:

a substantially planar annular resonator; and

a plurality of flexible support members arranged to support the annular resonator spaced from the semiconductor substrate and to allow the annular resonator to oscillate in one or more in-plane resonance modes.

8. The MEMS sensor of claim 7 comprising:

a sensing transducer to detect oscillation of the annular resonator resulting from an orthogonal secondary in-plane resonance mode generated in response to an angular velocity applied around an axis substantially perpendicular to the plane of the annular resonator.

14. The MEMS sensor or method of claim 1, wherein the semiconductor substrate layer is formed of silicon.

15. The MEMS sensor or method of claim 1, wherein the electrically insulating substrate layer(s) is/are formed of glass.

9. A method of making a MEMS sensor die comprising:

forming a vibrating sensing structure on a semiconductor substrate layer;

mounting the semiconductor substrate layer to an electrically insulating substrate layer so that rectangular sensor dies can be defined by orthogonal x and y cutting lines in the plane of the substrate layers;

mounting the electrically insulating substrate layer to a spacer layer that has voids formed at at least some junctions of the x and y cutting lines; and

dicing the layers to form sensor dies comprising a rectangular sensor chip mounted on an octagonal spacer layer.

10. The method of claim 9, comprising:

forming voids in the spacer layers at each junction of the x and y cutting lines; and

dicing the layers along the x and y cutting lines to form sensor dies comprising a rectangular sensor chip mounted on the octagonal spacer layer.

11. The method of claim 9, further comprising:

selecting one of the sensor dies and bonding the spacer layer to a sensor package to form a packaged sensor.

12. The method of any of claim 9, wherein the octagonal spacer layer is thicker than an electrically insulating substrate layer that directly mounts the semiconductor substrate layer.

13. The method of any of claim 9, wherein the vibrating sensing structure is a substantially planar annular resonator for a vibrating structure gyroscope.