ELECTRONIC DEVICE ASSEMBLY WITH COMPRESSION GASKET

• US 20140334081A1
• Filed: 05/13/2013
• Published: 11/13/2014
• Est. Priority Date: 05/13/2013
• Status: Active Grant

• Current Assignee: Google Technology Holdings LLC (Alphabet Inc.)
• Original Assignee: Motorola Mobility LLC (Lenovo Group Ltd.)
• Inventors: Pierce, Amber M., Bowers, Morris B., Cole, Adam R., Thiruppukuzhi, Srikanth V.
• Granted Patent: US 9,411,385 B2
• Time in Patent Office: Days
• US Class Current: 361/679.3
• CPC Class Codes: G06F 1/1658 related to the mounting of internal components, e.g. disc drive or any other functional module
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: H05K 9/0026 integrally formed from metal sheet

Abstract

An assembly (1000) includes a substrate (1002) and a heat emissive electrical component (1001) disposed on the substrate. A shield (1003) is disposed on the substrate, thereby enclosing the heat emissive electrical component. A display assembly (101) is disposed above the shield. A compressible pad (1004) is disposed between the shield and the display assembly. The compressible pad defines an aperture (1005) above the heat emissive electrical component. The aperture can have dimensions that are a function of a shield area and a heat emissive electrical component area.

Claims

1. An assembly, comprising

a substrate;

a heat emissive electrical component disposed on the substrate;

a shield disposed on the substrate enclosing the heat emissive electrical component;

a display assembly; and

a compressible pad disposed between the shield and the display assembly;

the compressible pad defining an aperture above the heat emissive electrical component, the aperture having dimensions that are a function of a shield area and a heat emissive electrical component area.

2. The assembly of claim 1, the aperture having a major aperture dimension greater than 0.9 times a major component dimension.

3. The assembly of claim 2, the major aperture dimension greater than the major component dimension.

4. The assembly of claim 2, the major aperture dimension less than 1.2 times the major component dimension.

5. The assembly of claim 4, the heat emissive electrical component having a power dissipation greater than one watt.

6. The assembly of claim 4, the heat emissive electrical component having a major dimension greater than ten millimeters.

7. The assembly of claim 2, a major shield dimension greater than the major aperture dimension.

8. The assembly of claim 7, the major shield dimension more than one millimeter greater than the major aperture dimension.

9. The assembly of claim 7, the major shield dimension less than 1.2 times the major component dimension.

10. The assembly of claim 7, a loading force applied by the compressible pad between the display assembly and the shield a function of a difference between the major shield dimension and the major aperture dimension.

11. The assembly of claim 10, the loading force further a function of a compression coefficient of the compressible pad.

12. The assembly of claim 1, further comprising a first housing member and a second housing member disposed opposite the assembly to compress the compressible pad between the shield and the display assembly.

13. The assembly of claim 1, the compressible pad comprising a reflective layer disposed adjacent to the shield.

14. The assembly of claim 1, the display assembly comprising an organic light emitting display.

15. An assembly, comprising:

a heat dissipation device enclosed by a shield and a circuit board;

a device element; and

a compression gasket disposed between the shield and the device element, the compression gasket defining a chamber axially aligned with the heat dissipation device.

16. The assembly of claim 15, the device element comprising a display.

17. The assembly of claim 15, the chamber being wider along a first dimension than the heat dissipation device and narrower along a second dimension, orthogonal to the first dimension, than the heat dissipation device.

18. The assembly of claim 15, the chamber having a first perimeter shape, the heat dissipation device having a second perimeter shape, the first perimeter shape and the second perimeter shape being different.

19. The assembly of claim 15, the chamber having a common dimension with the heat dissipation device and a different dimension, orthogonal to the common dimension, than the heat dissipation device.

20. The assembly of claim 15, the chamber having a non-rectangular perimeter.