ELECTRONIC MODULE ALLOWING FINE TUNING AFTER ASSEMBLY

• US 20140334120A1
• Filed: 07/24/2014
• Published: 11/13/2014
• Est. Priority Date: 05/17/2012
• Status: Active Grant

• Current Assignee: Eagantu, Ltd.
• Original Assignee: Eagantu, Ltd.
• Inventors: Dakhiya, Michael, Shaked, Eran
• Granted Patent: US 9,155,198 B2
• Time in Patent Office: Days
• US Class Current: 361/761
• CPC Class Codes: H01C 17/22 adapted for trimming
• CPC Class Codes: H01L 22/14 for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: H01L 2223/6655 Matching arrangements, e.g. arrangement of inductive and capacitive components
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/81439 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/81447 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/8149 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/81493 with a principal constituent of the material being a solid not provided for in groups H01L2224/814 - H01L2224/81491, e.g. allotropes of carbon, fullerene, graphite, carbon-nanotubes, diamond
• CPC Class Codes: H01L 2225/1023 the support being an insulating substrate
• CPC Class Codes: H01L 2225/1047 Details of electrical connections between containers
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 23/15 Ceramic or glass substrates H01L23/142, H01L23/145, H01L23/147 take precedence
• CPC Class Codes: H01L 23/5381 Crossover interconnections, e.g. bridge stepovers
• CPC Class Codes: H01L 23/5383 Multilayer substrates H01L23/5385 takes precedence; multilayer metallisation on monolayer substrates H01L23/538
• CPC Class Codes: H01L 23/5384 Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors H01L23/5383, H01L23/5385 take precedence; pins attached to insulating substrates H01L23/49811
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 25/0652 : the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/105 : the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15156 : Side view
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15313 : being a land array, e.g. LGA
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/1579 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/1627 : stacked type assemblies, e.g. stacked multi-cavities
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H05K 1/183 : Components mounted in and supported by recessed areas of the printed circuit board
• CPC Class Codes: H05K 2203/16 : Inspection; Monitoring; Aligning
• CPC Class Codes: H05K 2203/171 : Tuning, e.g. by trimming of printed components or high frequency circuits
• CPC Class Codes: H05K 3/32 : electrically connecting electric components or wires to printed circuits
• CPC Class Codes: Y10T 29/49004 : including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/53022 : with means to test work or product
• CPC Class Codes: Y10T 29/53174 : Means to fasten electrical component to wiring board, base, or substrate

Abstract

An electronic module includes a substrate, which includes a dielectric material having multiple sides, including first and second sides, and first and second cavities indented respectively within the first and second sides. First and second conductive contacts within the first and second cavities are configured for contact with at least first and second electronic components that are mounted respectively in the first and second cavities. Conductive traces within the substrate are in electrical communication with the first and second conductive contacts.

Claims

1. An electronic module, comprising:

a substrate comprising a dielectric material having multiple sides, including first and second sides, and first and second cavities indented respectively within the first and second sides;

first and second conductive contacts within the first and second cavities, configured for contact with at least first and second electronic components that are mounted respectively in the first and second cavities; and

conductive traces within the substrate in electrical communication with the first and second conductive contacts.

2. The module according to claim 1, wherein the second side is parallel to and opposite the first side, whereby the first and second cavities open in mutually-opposing directions.

3. The module according to claim 2, wherein the substrate has a third side, non-parallel to the first and second sides, with a third cavity indented within the third side, and wherein the module comprises third conductive contacts within the third cavity for contact with at least a third electronic component that is mounted in the third cavity.

4. The module according to claim 1, wherein the second side is non-parallel to the first side.

5. The module according to claim 1, and comprising a plurality of contact pads disposed on at least two different exterior surfaces of the substrate and connected to the conductive traces, wherein the contact pads are configured for contacting at least one of a printed circuit board and another module.

6. The module according to claim 1, wherein the substrate comprises multiple layers of the dielectric material, which are graduated in size and comprise at least one layer having a central opening, and wherein the layers are joined together so as to define the cavities in the substrate.

7. The module according to claim 1, wherein one or more of the conductive traces and contacts comprise graphene.

8. The module according to claim 1, and comprising a trimmable conductive element formed on a surface of the substrate in proximity to at least one of the cavities, wherein the trimmable conductive element is connected to the conductive traces so as to define an electrical circuit that comprises the first and second electronic components and the trimmable conductive element.

9. A method for producing an electronic module, the method comprising:

providing a substrate comprising a dielectric material having a cavity formed therein and conductive contacts within the cavity, a trimmable conductive element formed on a surface of the substrate in proximity to the cavity, and conductive traces within the substrate so as to define an electrical circuit that comprises the conductive contacts and the trimmable conductive element;

mounting an electronic component within the cavity in contact with the conductive contacts; and

trimming the trimmable conductive element so as to adjust an electrical property of the circuit including the electronic component that is mounted within the cavity.

10. The method according to claim 9, wherein the cavity is indented within a first side of the substrate, and the surface on which the trimmable conductive element is formed is located on a second side of the substrate, different from the first side.

11. The method according to claim 9, wherein trimming the trimmable conductive element comprises measuring a frequency response of the circuit, and removing material from the trimmable conductive element until the measured frequency response meets a predefined specification.

12. The method according to claim 11, wherein measuring the frequency response comprises, after the electronic module has been assembled, mounting the electronic module on a test fixture, which is connected to a measurement circuit for measuring the frequency response of the circuit while removing the material from the trimmable conductive element.

13. The method according to claim 9, wherein trimming the trimmable conductive element comprises measuring an impedance of the circuit, and removing material from the trimmable conductive element until the measured impedance meets a predefined specification.

14. The method according to claim 9, wherein providing the substrate comprises connecting together first and second dielectric substrates, wherein the trimmable conductive element is formed on the surface of the first dielectric substrate, while the electrical circuit comprises at least one electronic component that is mounted on the second dielectric substrate.

15. The method according to claim 9, wherein providing the substrate comprises embedding an array of circuit components in the substrate, and wherein trimming the trimmable conductive element comprises disconnecting one or more of the circuit components from the array.

16. The method according to claim 9, wherein providing the electronic module comprises embedding one or more discrete circuit components within the dielectric substrate, and wherein trimming the trimmable conductive element comprises adjusting a value of at least one of the embedded components.

17. A method for producing an electronic module, the method comprising:

providing a substrate comprising a dielectric material having multiple sides, including first and second sides, and first and second cavities indented respectively within the first and second sides, the substrate having first and second conductive contacts within the first and second cavities and conductive traces within the substrate in electrical communication with the first and second conductive contacts; and

mounting at least first and second electronic components in the first and second cavities, respectively, in contact with the first and second contacts.

18. The method according to claim 17, wherein the second side is parallel to and opposite the first side, whereby the first and second cavities open in mutually-opposing directions.

19. The method according to claim 18, wherein the substrate has a third side, non-parallel to the first and second sides, with a third cavity indented within the third side, and wherein the method comprises mounting at least a third electronic component in contact with third conductive contacts in the third cavity.

20. The method according to claim 17, wherein the second side is non-parallel to the first side.

21. The method according to claim 17, wherein providing the substrate comprises attaching the substrate to at least one of a printed circuit board and another module using a plurality of contact pads disposed on at least two different exterior surfaces of the substrate and connected to the conductive traces.

22. The method according to claim 17, wherein providing the substrate comprises joining together multiple layers of the dielectric material, which are graduated in size and comprise at least one layer having a central opening, so as to define the cavities in the substrate.

23. The method according to claim 17, wherein a trimmable conductive element is formed on a surface of the substrate in proximity to at least one of the cavities and is connected to the conductive traces so as to define an electrical circuit that comprises at least one of the first and second electronic components and the trimmable conductive element, and

wherein the method comprises trimming the trimmable conductive element so as to adjust an electrical property of the circuit.

24. A system for producing electronic devices, the system comprising:

a module, which comprises;

a substrate comprising a dielectric material having a cavity formed therein and conductive contacts within the cavity;

a trimmable conductive element formed on a surface of the substrate in proximity to the cavity;

conductive traces within the substrate so as to define an electrical circuit that comprises the conductive contacts and the trimmable conductive element; and

an electronic component within the cavity in contact with the conductive contacts;

a test fixture configured to hold the module; and

a trimming device, which is configured to trim the trimmable conductive element on the module held by the mount so as to adjust an electrical property of the circuit including the electronic component that is mounted within the cavity.

25. The system according to claim 24, wherein the cavity is indented within a first side of the substrate, and the surface on which the trimmable conductive element is formed is located on a second side of the substrate, different from the first side.

26. The system according to claim 24, and comprising a measurement circuit, which is configured to measure a frequency response of the electrical circuit while the module is held by the test fixture,

wherein the trimming device is configured to remove material from the trimmable conductive element until the measured frequency response meets a predefined specification.

27. The system according to claim 24, and comprising a measurement circuit, which is configured to measure an impedance of the electrical circuit,

wherein the trimming device is configured to remove material from the trimmable conductive element until the measured impedance meets a predefined specification.

28. The system according to claim 24, wherein the module comprises first and second dielectric substrates that are connected together, wherein the trimmable conductive element is formed on the surface of the first dielectric substrate, while the electrical circuit comprises at least one electronic component that is mounted on the second dielectric substrate.

29. The system according to claim 24, wherein the module comprises an array of circuit components embedded in the substrate, and wherein the trimming device is configured to trim the trimmable conductive element so as to disconnect one or more of the circuit components from the array.

30. The system according to claim 24, wherein the module comprises one or more discrete circuit components embedded within the dielectric substrate, and wherein the trimming device is configured to trim the trimmable conductive element so as to adjust a value of at least one of the embedded components.