APPARATUS FOR USE IN OPTOELECTRONICS

• US 20140334773A1
• Filed: 01/31/2012
• Published: 11/13/2014
• Est. Priority Date: 01/31/2012
• Status: Abandoned Application

• Current Assignee: Hewlett Packard Enterprise Development LP (Hewlett-Packard Enterprise Company)
• Original Assignee: Hewlett Packard Enterprise Development LP (Hewlett-Packard Enterprise Company)
• Inventors: Mathai, Sagi Varghese, Ty Tan, Michael Renne, Rosenberg, Paul Kessier, Sorin, Wayne Victor
• Application Number:
  US14/371,509
• Publication Number:
  US 20140334773A1
• Time in Patent Office: Days
• US Class Current: 385/14
• CPC Class Codes: G02B 6/12004 Combinations of two or more optical elements
• CPC Class Codes: G02B 6/12019 characterised by the optical interconnection to or from the AWG devices, e.g. integration or coupling with lasers or photodiodes coupling integrated waveguide to fibre G02B6/30, to optoelectronic element G02B6/42; monolithic integration of integrated waveguides with other optical elements G02B6/12004
• CPC Class Codes: G02B 6/13 Integrated optical circuits characterised by the manufacturing method
• CPC Class Codes: G02B 6/3881 using grooves to align ferrule ends
• CPC Class Codes: G02B 6/4202 for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
• CPC Class Codes: G02B 6/4228 Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements G02B6/4234 takes precedence
• CPC Class Codes: G02B 6/423 using guiding surfaces for the alignment
• CPC Class Codes: G02B 6/4238 Soldering
• CPC Class Codes: G02B 6/4239 Adhesive bonding; Encapsulation with polymer material
• CPC Class Codes: G02B 6/4244 Mounting of the optical elements
• CPC Class Codes: G02B 6/4245 Mounting of the opto-electronic elements
• CPC Class Codes: G02B 6/4292 the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements

Abstract

An apparatus for use in optoelectronics includes a first alignment element and a first wafer comprising a through optical via. The first alignment element is bonded to the first wafer, such that the through optical via is uncovered by the first alignment element. In addition, the first wafer further comprises a plurality of bond pads upon which an optoelectronic component having an optical element is to be attached, in which the first alignment element is to mate with a mating alignment element on an optical transmission medium, and wherein the optical transmission medium is to be passively aligned with the optical element through the through optical via when the first alignment element is mated with the mating alignment element on the optical transmission medium.

Claims

1. An apparatus for use in optoelectronics, said apparatus comprising:

a first alignment element; and

a first wafer comprising a through optical via, wherein the first alignment element is bonded to the first wafer, such that the through optical via is uncovered by the first alignment element, wherein the first wafer further comprises a plurality of bond pads upon which an optoelectronic component having an optical element is to be attached, wherein the first alignment element is to mate with a mating alignment element on an optical transmission medium, and wherein the optical transmission medium is to be passively aligned with the optical element through the through optical via when the first alignment element mated with the mating alignment element on the optical transmission medium.

2. The apparatus according to claim 1, further comprising:

a second wafer, wherein the second wafer comprises the first alignment element, wherein the second wafer is bonded to the first wafer, and wherein the second wafer comprises an opening or an at least partially transparent cover over the through optical via.

3. The apparatus according to claim 1, wherein the second wafer comprises a second alignment element, wherein the second alignment element is to mate with a second mating alignment element on the optical transmission medium.

4. The apparatus according to claim 1, wherein the first alignment element comprises a relatively rigid layer to interface with the mating alignment element on the optical transmission medium.

5. The apparatus according to claim 1, wherein the plurality of bond pads are positioned at predetermined and aligned locations with respect to the through optical via.

6. The apparatus according to claim 1, further comprising:

an optically transparent filler positioned within the through optical via.

7. A method for fabricating an apparatus to passively align an optical element in an optoelectronic component to an optical transmission medium, said method comprising:

forming a first alignment element;

forming a first wafer including a through optical via;

bonding the first alignment element to a first surface of the first wafer such that the through optical via is uncovered by the first alignment element;

attaching a plurality of bond pads on a second surface of the first wafer, opposite the first surface, wherein the plurality of bond pads are to attach to an optoelectronic component having an optical element; and

wherein the first alignment element is to mate with a mating alignment element on an optical transmission medium, and wherein the optical transmission medium is to be passively aligned with the optical element when the first alignment element is mated with the mating alignment element on the optical transmission medium.

8. The method according to claim 7, wherein forming the first wafer further comprises forming the first wafer to include electrical traces.

9. The method according to claim 7, wherein forming the first alignment element further comprises forming the first alignment element through a forming technique selected from the group consisting of photolithography, deep reactive ion etching, and electroplating.

10. The method according to claim 7, further comprising:

forming a second wafer, wherein forming the first alignment element further comprises forming the first alignment element into the second wafer; and

wherein bonding the first alignment element to the first wafer further comprises bonding the second wafer to the first wafer.

11. The method according to claim 10, wherein bonding the second wafer to the first wafer further comprises bonding the second wafer to the first wafer using a bonding operation selected from a group of bonding operations consisting of low temperature metal to metal thermocompression bonding, eutectic bonding, adhesive bonding, anodic bonding, and fusion bonding.

12. The method according to claim 7, wherein forming the plurality of bond pads on the second surface of the first wafer further comprises aligning the plurality of bond pads with respect to the through optical via to cause the optical element in the optoelectronic component to be precisely aligned with the through optical via when the optoelectronic component is attached to the plurality of bond pads.

13. The method according to claim 7, wherein forming the first alignment element further comprises forming the first alignment element through a fabrication operation selected from a group of fabrication operations consisting of electroplating a post and forming a hole through a block of material.

14. An optoelectronic system comprising:

an apparatus having,

a first wafer having a through optical via and a plurality of bond pads attached to a first surface of the first wafer;

a first alignment element bonded to a second surface of the first wafer such that the through optical via is uncovered by the first alignment element; and

an optoelectronic component attached to the plurality of bond pads, wherein the first alignment element is to mate with a mating alignment element on an optical transmission medium, and wherein the optical transmission medium is to be passively aligned with an optical element of the optoelectronic component through the through optical via when the first alignment element is mated with the mating alignment element on the optical transmission medium.

15. The optoelectronic system according to claim 14, further comprising:

a second wafer, wherein the second wafer comprises the first alignment element, wherein the second wafer is bonded to the first wafer, and wherein the second wafer comprises an opening over the through optical via.