Application of Fluids to Substrates
First Claim
Patent Images
1. An apparatus comprising:
- a substrate holder;
a fluid application device configured to apply a fluid to a substrate on said substrate holder;
a heating mechanism configured to locally heat said fluid; and
a controller configured to control said heating mechanism to apply a local heating in order to obtain a desired thickness profile of said fluid on said substrate.
1 Assignment
0 Petitions
Accused Products
Abstract
Various embodiments relate to application of a fluid to a substrate. The fluid is locally heated, for example, to obtain a desired thickness profile.
-
Citations
24 Claims
-
1. An apparatus comprising:
-
a substrate holder; a fluid application device configured to apply a fluid to a substrate on said substrate holder; a heating mechanism configured to locally heat said fluid; and a controller configured to control said heating mechanism to apply a local heating in order to obtain a desired thickness profile of said fluid on said substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
-
-
11. A method comprising:
-
applying a fluid to a substrate; dispersing the fluid on the substrate; and applying a predetermined local heating to said fluid to obtain a desired thickness profile. - View Dependent Claims (12, 13, 14, 15, 16, 17)
-
-
18. A method comprising:
-
applying a fluid to a substrate; dispersing the fluid over the substrate; measuring a fluid thickness of the fluid over the substrate; and adjusting a local heating of the fluid to obtain a desired thickness profile of said fluid. - View Dependent Claims (19, 20, 21, 22, 23, 24)
-
Specification