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Application of Fluids to Substrates

  • US 20140335699A1
  • Filed: 05/10/2013
  • Published: 11/13/2014
  • Est. Priority Date: 05/10/2013
  • Status: Active Grant
First Claim
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1. An apparatus comprising:

  • a substrate holder;

    a fluid application device configured to apply a fluid to a substrate on said substrate holder;

    a heating mechanism configured to locally heat said fluid; and

    a controller configured to control said heating mechanism to apply a local heating in order to obtain a desired thickness profile of said fluid on said substrate.

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