METHOD OF MANUFACTURING AN INTEGRATED TOUCH SENSOR WITH DECORATIVE COLOR GRAPHICS

• US 20140338191A1
• Filed: 05/15/2013
• Published: 11/20/2014
• Est. Priority Date: 05/15/2013
• Status: Abandoned Application

• Current Assignee: Uni-Pixel Displays Incorporated (Uni-Pixel Incorporated)
• Original Assignee: Uni-Pixel Displays Incorporated (Uni-Pixel Incorporated)
• Inventors: Petcavich, Robert J.
• Application Number:
  US13/894,616
• Publication Number:
  US 20140338191A1
• Time in Patent Office: Days
• US Class Current: 29/846
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
• CPC Class Codes: H05K 2203/0143 Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
• CPC Class Codes: H05K 2203/1545 Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
• CPC Class Codes: H05K 2203/1572 Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
• CPC Class Codes: H05K 3/1275 by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
• CPC Class Codes: H05K 3/182 characterised by the patterning method
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

A method of manufacturing includes printing a first plurality of patterned ink seed layers on a first side of a substrate. A second plurality of patterned ink seed layers are printed on a second side of the substrate. The first plurality of patterned ink seed layers and the second plurality of patterned ink seed layers are electroless plated with a first conductive material. A coating is printed over the first side of the substrate. A graphic design is printed on the second side of the substrate.

Claims

1. A method of manufacturing comprising:

printing a first plurality of patterned ink seed layers on a first side of a substrate;

printing a second plurality of patterned ink seed layers on a second side of the substrate;

electroless plating the first plurality of patterned ink seed layers and the second plurality of patterned ink seed layers with a first conductive material;

printing a coating over the first side of the substrate; and

printing a graphic design on the second side of the substrate.

2. The method of claim 1, further comprising:

cleaning the substrate with a high electric field ozone generator; and

cleaning the substrate with a web cleaner.

3. The method of claim 1, further comprising:

curing the substrate after printing the first plurality of patterned ink seed layers; and

curing the substrate after printing the second plurality of patterned ink seed layers.

4. The method of claim 1, further comprising:

electroless plating the plated first plurality of patterned ink seed layers and the plated second plurality of patterned ink seed layers with a second conductive material.

5. The method of claim 1, further comprising:

cleaning the substrate with a water treatment.

6. The method of claim 1, further comprising:

curing the substrate after printing the coating over the first side of the substrate.

7. The method of claim 1, wherein the first plurality patterned ink seed layers and the second plurality of patterned ink seed layers comprise catalytic ink.

8. The method of claim 1, wherein the substrate comprises polyethylene terephthalate.

9. The method of claim 1, wherein the first conductive material comprises copper.

10. The method of claim 4, wherein the second conductive material comprises nickel.

11. The method of claim 1, wherein the coating comprises a scratch and abrasion resistant coating material.

12. The method of claim 1, wherein the applied coating has a pencil hardness of at least 6H.

13. The method of claim 1, wherein one or more patterned ink seed layers of the first plurality of patterned ink seed layers and one or more patterned ink seed layers of the second plurality of patterned ink seed layers have a width less than approximately 10 micrometers.

14. The method of claim 1, wherein one or more patterned ink seed layers of the first plurality of patterned ink seed layers and one or more patterned ink seed layers of the second plurality of patterned ink seed layers have a width in a range between approximately 10 micrometers and approximately 100 micrometers.

15. The method of claim 1, wherein one or more flexographic printing stations print the first plurality of patterned ink seed layers on the first side of the substrate.

16. The method of claim 1, wherein one or more flexographic printing stations print the second plurality of patterned ink seed layers on the second side of the substrate.

17. The method of claim 1, wherein one or more flexographic printing stations print the graphic design on the second side of the substrate.

18. The method of claim 1, wherein the graphic design is disposed in a frame area surrounding the plated second plurality of patterned seed layers.

19. A method of manufacturing comprising:

printing a coating over a first side of a first substrate;

printing a graphic design on a second side of the first substrate;

printing a first plurality of patterned ink seed layers on a first side of a second substrate;

printing a second plurality of patterned ink seed layers on a second side of the second substrate;

electroless plating the first plurality of patterned ink seed layers and the second plurality of patterned ink seed layers of the second substrate with a first conductive material; and

laminating the first substrate to the second substrate.

20. A method of manufacturing comprising:

printing a coating over a first side of a first substrate;

printing a first plurality of patterned ink seed layers on a second side of the first substrate;

electroless plating the first plurality of patterned ink seed layers of the first substrate with a first conductive material;

printing a graphic design on the second side of the first substrate;

printing a second plurality of patterned ink seed layers on a first side of a second substrate;

electroless plating the second plurality of patterned ink seed layers of the second substrate with the first conductive material; and

laminating the first substrate to the second substrate.