REMELTING METHOD AND SUBSEQUENT REFILLING AND COMPONENT

• US 20140339206A1
• Filed: 09/14/2012
• Published: 11/20/2014
• Est. Priority Date: 11/11/2011
• Status: Abandoned Application

• Current Assignee: Siemens AG
• Original Assignee: Siemens AG
• Inventors: Ott, Michael, Piegert, Sebastian, Reinkensmeier, Ingo
• Application Number:
  US14/354,228
• Publication Number:
  US 20140339206A1
• Time in Patent Office: Days
• US Class Current: 219/121.66
• CPC Class Codes: B23K 1/0056 soldering by means of beams, e.g. lasers, E.B.
• CPC Class Codes: B23K 2101/001 Turbines
• CPC Class Codes: B23K 2103/08 Non-ferrous metals or alloys
• CPC Class Codes: B23K 2103/26 Alloys of Nickel and Cobalt and Chromium
• CPC Class Codes: B23K 2103/50 Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
• CPC Class Codes: B23K 26/32 taking account of the properties of the material involved
• CPC Class Codes: B23K 26/342 Build-up welding
• CPC Class Codes: B23K 35/0244 Powders, particles or spheres; Preforms made therefrom
• CPC Class Codes: B23K 35/3033 Ni as the principal constituent
• CPC Class Codes: B23K 35/3046 Co as the principal constituent
• CPC Class Codes: B23P 6/007 using only additive methods, e.g. build-up welding
• CPC Class Codes: B23P 6/045 of turbine components, e.g. moving or stationary blades, rotors, etc.
• CPC Class Codes: F01D 5/005 Repairing methods or devices
• CPC Class Codes: Y10T 29/49746 by applying fluent material, e.g., coating, casting

Abstract

A method for re-melting and refilling a defect (7) in a surface (19) of a substrate (4) by re-melting the defect (7) causing a hollow (28) to be produced above the re-melt, and the hollow (28) is refilled. A nickel- or cobalt-based substrate (4) is re-melted by a laser re-melting method. Subsequently, the hollow (28) that is produced is refilled by a laser application method, in particular by soldering. Also, a component having a re-melted region (25) and a solder region (31) thereover is disclosed.

Claims

1. A process for re-melting and filling a defect in a surface of a substrate comprising:

re-melting the substrate at the defect for filling the defect filled by the re-melded material of the substrate, wherein a depression is formed by the re-melting at an outward side of the filled defect;

filling the depression which has formed using a soldering or welding process forming a filling region in the depression.

2. The process as claimed in claim 1, wherein the substrate which is re-melted comprises a metallic substrate.

3. The process as claimed in claim 1, wherein the re-melting is performed by a laser re-melting process.

4. The process as claimed in claim 1, further comprising:

the filling of the depression which has formed is filled by a build-up process.

5. The process as claimed in claim 1, further comprising, filling the depression immediately after the defect has been re-melted.

7. The process as claimed in claim 1, wherein the material for filling the depression comprises a mixture of a material of the substrate with a solder material which has a lower melting point than the material of the substrate.

8. The process as claimed in claim 1, wherein the defect in the substrate comprises oxides.

9. The process as claimed in claim 1, further comprising re-working the filling region.

10. The process as claimed in claim 1, further comprising removing the oxides after the re-melting process.

12. The process as claimed in claim 1, wherein the process for filling the depression is a soldering process.

13. The process as claimed in claim 2, wherein the metallic substrate comprises a nickel-based or cobalt-based substrate.

14. The process as claimed in claim 4, wherein the build-up process is a laser build-up process.

15. The process as claimed in claim 7, wherein the melting point of the solder material has a lower melting point of at least 10 K than the melting point of the substrate.

16. The process as claimed in claim 7, further comprising not subjecting the defect to oxide removal treatment before the re-melting.

6. (canceled)

11. A component comprising a substrate with a defect in a surface of the substrate having a re-melted region and a soldered region in and at the defect.