INTEGRATED GESTURE SENSOR MODULE

• US 20140340302A1
• Filed: 05/13/2014
• Published: 11/20/2014
• Est. Priority Date: 05/16/2013
• Status: Active Grant

• Current Assignee: Analog Devices, Inc.
• Original Assignee: Analog Devices, Inc.
• Inventors: Sengupta, Dipak, Deliwala, Shrenik, Zhao, Ying, Beckford, Woodrow, Fried, Bruce, Schoppee, William
• Granted Patent: US 10,884,551 B2
• Time in Patent Office: Days
• US Class Current: 345/156
• CPC Class Codes: G06F 3/017 Gesture based interaction, e.g. based on a set of recognized hand gestures interaction based on gestures traced on a digitiser G06F3/04883
• CPC Class Codes: G06F 3/042 by opto-electronic means
• CPC Class Codes: H01L 2224/48095 Kinked
• CPC Class Codes: H01L 2224/48145 the bodies being stacked
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: Y10T 29/49826 Assembling or joining

Abstract

An integrated gesture sensor module includes an optical sensor die, an application-specific integrated circuit (ASIC) die, and an optical emitter die disposed in a single package. The optical sensor die and ASIC die can be disposed in a first cavity of the package, and the optical emitter die can be disposed in a second cavity of the package. The second cavity can be conical or step-shaped so that the opening defining the cavity increases with distance from the upper surface of the optical emitter die. The upper surface of the optical emitter die may be higher than the upper surface of the optical sensor die. An optical barrier positioned between the first and second cavities can include a portion of a pre-molded, laminate, or ceramic package, molding compound, and/or metallized vias.

Claims

1. A gesture sensor module comprising:

an optical emitter die having an emitter surface;

an optical sensor die having a sensor surface facing upwards; and

a package housing the LED emitter die and the optical sensor die in separate cavities.

2. The gesture sensor module of claim 1, wherein the sensor surface is higher than the emitter surface.

3. The gesture sensor module of claim 2, wherein the package comprises an optical barrier positioned laterally between the optical emitter die and the optical sensor die, and

wherein the optical barrier, the emitter surface, and the sensor surface are configured such that less than about 5% of light emitted from the emitter surface is reflected from the cover glass to the sensor surface.

4. The gesture sensor module of claim 3, wherein the emitter surface is between 0.25 mm and 0.75 mm farther from a top surface of the package than the sensor surface.

5. The gesture sensor module of claim 1, wherein the package comprises an optical barrier positioned laterally between the optical emitter die and the optical sensor die.

6. The gesture sensor module of claim 1, further comprising a glass cover.

7. The gesture sensor module of claim 1, wherein the package comprises an opening over the emitter surface having a conical shape, such that a width of the opening increases with distance from the emitter surface.

8. The gesture sensor module of claim 7, wherein the surface of the opening is reflective.

9. The gesture sensor module of claim 8, wherein the surface of the opening is coated with a reflective metal layer.

10. The gesture sensor module of claim 7, wherein the opening defines a cone with walls defining an angle with the axis of the emitter of between about 1 and 30 degrees.

11. The gesture sensor module of claim 7, wherein the cone angle is between about 0°

and 30°

.

12. The gesture sensor module of claim 1, wherein the emitter surface is laterally spaced from the sensor surface by between about 0.25 mm and 3 mm.

13. The gesture sensor module of claim 1, further comprising an ASIC die in electrical communication with and positioned beneath the optical sensor.

14. The gesture sensor module of claim 1, wherein the package comprises at least one of:

laminate, ceramic, and pre-molded polymer.

15. The gesture sensor module of claim 1, wherein the total package height is between about 1 and 1.4 mm.

16. A mobile computing device comprising the gesture sensor module of claim 1.

17. An gesture sensor module comprising:

a package comprising first and second cavities

an optical emitter die positioned in the first cavity;

an optical sensor die positioned in the second cavity; and

an optical barrier positioned laterally between the optical emitter die and the optical sensor die.

18. The gesture sensor module of claim 17, wherein the package comprises a pre-molded or ceramic package, and wherein the optical barrier comprises a portion of the pre-molded or ceramic package.

19. The gesture sensor module of claim 17, wherein the optical barrier comprises a molding compound.

20. The gesture sensor module of claim 17, wherein the optical barrier comprises a metallized via in a laminate or pre-molded plastic cover.

21. The gesture sensor module of claim 17, wherein an emitter surface of the optical emitter die is lower than an upper surface of the optical sensor die.

22. A mobile computing device comprising the gesture sensor module of claim 17.

23. A method of manufacturing a gesture sensor module, the method comprising:

providing a package substrate;

disposing an optical sensor die on the package substrate;

disposing an optical emitter die on the package substrate; and

disposing an optical barrier between the optical sensor die and the optical emitter die.

24. The method of claim 23, wherein the package comprises first and second cavities, and wherein the optical sensor die is disposed in the first cavity, and the optical emitter die are disposed in the second cavity.

25. The method of claim 23, wherein disposing the optical sensor die and disposing the optical emitter die comprises arranging the optical sensor such that an upper surface of the optical sensor die is higher than an emitter surface of the optical emitter die.

26. The method of claim 23, further comprising disposing optical encapsulant in at least one of the first and second cavities.

27. The method of claim 23, further comprising disposing a laminate cover over the package substrate.

28. The method of claim 23, wherein disposing the optical sensor die comprises arranging the optical sensor die on top of an ASIC die.