INTEGRATED GESTURE SENSOR MODULE
First Claim
1. A gesture sensor module comprising:
- an optical emitter die having an emitter surface;
an optical sensor die having a sensor surface facing upwards; and
a package housing the LED emitter die and the optical sensor die in separate cavities.
1 Assignment
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Accused Products
Abstract
An integrated gesture sensor module includes an optical sensor die, an application-specific integrated circuit (ASIC) die, and an optical emitter die disposed in a single package. The optical sensor die and ASIC die can be disposed in a first cavity of the package, and the optical emitter die can be disposed in a second cavity of the package. The second cavity can be conical or step-shaped so that the opening defining the cavity increases with distance from the upper surface of the optical emitter die. The upper surface of the optical emitter die may be higher than the upper surface of the optical sensor die. An optical barrier positioned between the first and second cavities can include a portion of a pre-molded, laminate, or ceramic package, molding compound, and/or metallized vias.
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Citations
28 Claims
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1. A gesture sensor module comprising:
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an optical emitter die having an emitter surface; an optical sensor die having a sensor surface facing upwards; and a package housing the LED emitter die and the optical sensor die in separate cavities. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. An gesture sensor module comprising:
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a package comprising first and second cavities an optical emitter die positioned in the first cavity; an optical sensor die positioned in the second cavity; and an optical barrier positioned laterally between the optical emitter die and the optical sensor die. - View Dependent Claims (18, 19, 20, 21, 22)
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23. A method of manufacturing a gesture sensor module, the method comprising:
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providing a package substrate; disposing an optical sensor die on the package substrate; disposing an optical emitter die on the package substrate; and disposing an optical barrier between the optical sensor die and the optical emitter die. - View Dependent Claims (24, 25, 26, 27, 28)
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Specification