STABILIZATION STRUCTURE INCLUDING SHEAR RELEASE POSTS
First Claim
Patent Images
1. A stabilization structure comprising:
- a carrier substrate;
a stabilization layer on the carrier substrate, the stabilization layer including an array of staging cavities; and
an array of micro devices within the array of staging cavities, wherein each micro device is laterally attached to a shear release post laterally extending from a sidewall of a staging cavity.
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Abstract
A stabilization structure includes a stabilization layer on a carrier substrate. The stabilization layer includes an array of staging cavities. An array of micro devices are within the array of staging cavities. Each micro device is laterally attached to a shear release post laterally extending from a sidewall of a staging cavity. A pressure is applied to the array of micro devices from the array of transfer heads to shear the array of micro devices off the shear release posts. The sheared off micro devices are picked up from the carrier substrate using the array of transfer heads.
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Citations
30 Claims
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1. A stabilization structure comprising:
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a carrier substrate; a stabilization layer on the carrier substrate, the stabilization layer including an array of staging cavities; and an array of micro devices within the array of staging cavities, wherein each micro device is laterally attached to a shear release post laterally extending from a sidewall of a staging cavity. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method of forming a stabilization structure comprising:
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forming an array of micro devices over a handle substrate; depositing a sacrificial release layer over the array of micro devices; etching the sacrificial release layer to expose side surface portions of the array of micro devices; and forming a stabilization layer over the sacrificial release layer to contact the exposed side surface portions of the array of micro devices. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23)
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24. A method of transferring an array of micro devices comprising:
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contacting an array of micro devices within an array of staging cavities on a carrier substrate with an array of transfer heads, wherein each micro device is laterally attached to a shear release post laterally extending from a sidewall of a corresponding staging cavity; applying a pressure to the array of micro devices from the array of transfer heads to shear the array of micro devices off the shear release posts; and picking up the array of micro devices from the carrier substrate using the array of transfer heads. - View Dependent Claims (25, 26, 27, 28, 29, 30)
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Specification