OPTICAL COMMUNICATION DEVICE

• US 20140341502A1
• Filed: 10/10/2013
• Published: 11/20/2014
• Est. Priority Date: 05/20/2013
• Status: Active Grant

• Current Assignee: Hon Hai Precision Industry Co., Ltd.
• Original Assignee: Hon Hai Precision Industry Co., Ltd.
• Inventors: TSENG, KUO-FONG
• Granted Patent: US 9,046,663 B2
• Time in Patent Office: Days
• US Class Current: 385/14
• CPC Class Codes: G02B 6/4204 the coupling comprising intermediate optical elements, e.g. lenses, holograms encapsulated active devices H01S5/02208, H01L33/52
• CPC Class Codes: G02B 6/4214 the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device G02B6/4246 takes precedence
• CPC Class Codes: G02B 6/43 Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation

Abstract

An optical communication device includes a planar optical waveguide, a circuit board, a light emitting element, and a light receiving element. The circuit board includes a mounting surface. Both the light emitting element and the light receiving element are supported on the mounting surface. The planar optical waveguide is buried in the circuit board. The planar optical waveguide includes a first sloped surface and a second sloped surface respectively on two opposite ends of the planar optical waveguide. The mounting surface defines a first light guide hole aligning with the first sloped surface and a second light guide hole aligning with the second sloped surface. The light emitting element is aligned with the first sloped surface through the first light guide hole. The light receiving element is aligned with the second sloped surface through the second light guide hole.

Claims

1. An optical communication device, comprising:

a circuit board comprising a mounting surface;

a light emitting element comprising a light emitting surface supported on the mounting surface;

a light receiving element comprising a light receiving surface supported on the mounting surface; and

a planar optical waveguide buried in the circuit board, the planar optical waveguide comprising a first sloped surface and a second sloped surface respectively on two opposite ends of the planar optical waveguide, wherein the mounting surface defines a first light guide hole aligning with the first sloped surface, and defines a second light guide hole aligning with the second sloped surface, the light emitting surface is aligned with the first sloped surface through the first light guide hole, the light receiving surface is aligned with the second sloped surface through the second light guide hole.

2. The optical communication device of claim 1, wherein the mounting surface faces the first sloped surface at about a 45 degree angle.

3. The optical communication device of claim 1, wherein the mounting surface faces the second sloped surface at about a 45 degree angle.

4. The optical communication device of claim 1, comprising a first controller and a processor, wherein the circuit board comprises a first connection pad, a second connection pad, a third connection pad, a fourth connection pad, the first connection pad, the second connection pad, the third connection pad, the fourth connection pad all are formed on one end of the mounting surface, the light emitting element is electrically connected to the first connection pad and the second connection pad, the first controller is supported on and electrically connected to the second connection pad and the third connection pad, the processor is supported on and electrically connected to the third connection pad and the fourth connection pad.

5. The optical communication device of claim 4, wherein the first light guide hole is located between the first connection pad and the second connection pad.

6. The optical communication device of claim 4, comprising a light condensing assembly, wherein the light condensing assembly is supported on and electrically connected to the first connection pad and the second connection pad, the light emitting element is supported on and electrically connected to the light condensing assembly.

7. The optical communication device of claim 6, comprising a second controller and a storing element, wherein the circuit board comprises a fifth connection pad, a sixth connection pad, a seventh connection pad, and an eighth connection pad, the fifth connection pad, the sixth connection pad, the seventh connection pad, the eighth connection pad all are formed on one end of the mounting surface, the light receiving element is electrically connected to the fifth connection pad and the sixth connection pad, the second controller is supported on and electrically connected to the sixth connection pad and the seventh connection pad, the storing element is supported on and electrically connected to the seventh connection pad and the eighth connection pad.

8. The optical communication device of claim 7, comprising an another light condensing assembly, wherein the another light condensing assembly is supported on and electrically connected to the fifth connection pad and the sixth connection pad, the light receiving element is supported on and electrically connected to the another light condensing assembly.

9. The optical communication device of claim 8, wherein each light condensing assembly comprises a main body, an electric guide portion coating on and covering the main body, and a light condensing ball, the main body defines a receiving portion receiving the light condensing ball, the light condensing ball of one light condensing assembly aligns with the first sloped surface, and the light condensing ball of another condensing assembly aligns with the second sloped surface.

10. The optical communication device of claim 9, wherein an angle between an optical axis of one of the light condensing balls and the first sloped surface is about 45 degrees, an angle between an optical axis of the other light condensing ball and the second sloped surface is about 45 degree.

11. The optical communication device of claim 9, wherein each main body comprises a first surface facing the mounting surface and a second surface facing away from the first surface, each main body defines a through hole running through the first surface and the second surface, the through hole communicates with the receiving portion, the through hole is circular, a diameter of the through hole is slightly smaller than a diameter of the light condensing ball.

12. The optical communication device of claim 7, wherein the circuit board comprises a bottom surface and a plurality of bottom connection pads formed on the bottom surface.

13. The optical communication device of claim 12, comprising a conductive element, wherein the circuit board defines a first receiving hole spatially corresponding to the third connection pad and a second receiving hole spatially corresponding to the seventh connection pad, both the first receiving hole and the second receiving hole run through the mounting surface and the bottom surface, both the first receiving hole and the second receiving hole are filled with the conductive element, one end of the conductive element received in first receiving hole is electrically connected to the third connection pad, while the other end of the conductive element received in the first receiving hole is electrically connected to a bottom connection pad, one end of the conductive element received in the second receiving hole is electrically connected to the seventh connection pad, while the other end of the conductive element received in the second receiving hole is electrically connected to the another bottom connection pad.

14. The optical communication device of claim 13, wherein the circuit board comprises a first side surface and a second side surface, the first side surface is substantially parallel with the second side surface, both the first side surface and the second side surface substantially perpendicularly connect to the mounting surface to the bottom surface, the first side surface defines a third receiving hole along a direction parallel with the mounting surface, and communicating with the first light guide hole and the first receiving hole, the second side surface defines a fourth receiving hole along a direction parallel with the mounting surface, and communicating with the second light guide hole and the second receiving hole, the third receiving hole and the fourth receiving hole are filled with the conductive element.

15. The optical communication device of claim 14, wherein the circuit board defines a fifth receiving hole running through the first side surface and the second side surface, the fifth connection pad is filled with the conductive element, the conductive element received in the first receiving hole is also electrically connected to the conductive element received in the third receiving hole and the conductive element received in the fifth receiving hole, the conductive element received in the second receiving hole is also electrically connected to the conductive element received in the fourth receiving hole and the conductive element received in the fifth receiving hole.

16. The optical communication device of claim 1, wherein the light emitting element is a laser diode, the light receiving element is a photo diode.