HEAT-REDUCTION METHODS AND SYSTEMS RELATED TO MICROFLUIDIC DEVICES

• US 20140342352A1
• Filed: 05/23/2014
• Published: 11/20/2014
• Est. Priority Date: 02/14/2001
• Status: Active Grant

• Current Assignee: HandyLab Incorporated (Becton Dickinson & Co)
• Original Assignee: HandyLab Incorporated (Becton Dickinson & Co)
• Inventors: HANDIQUE, KALYAN
• Granted Patent: US 9,051,604 B2
• Time in Patent Office: Days
• US Class Current: 435/6.1
• CPC Class Codes: B01L 2300/0816 Cards, e.g. flat sample carriers usually with flow in two horizontal directions
• CPC Class Codes: B01L 2300/1822 using Peltier elements
• CPC Class Codes: B01L 2300/1827 using resistive heater
• CPC Class Codes: B01L 2300/1883 using thermal insulation
• CPC Class Codes: B01L 2300/1894 Cooling means; Cryo cooling
• CPC Class Codes: B01L 2400/0442 thermal energy, e.g. vaporisation, bubble jet
• CPC Class Codes: B01L 3/5027 by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip B01L3/5023 takes precedence; micromixers B01F33/30; microreactors for synthesis B01J19/0093; microcapillary devices in general B81B1/00
• CPC Class Codes: B01L 7/00 Heating or cooling apparatus autoclaves B01J3/04; Heat insulating devices
• CPC Class Codes: C12Q 1/6806 Preparing nucleic acids for analysis, e.g. for polymerase chain reaction [PCR] assay C12Q1/6804 takes precedence
• CPC Class Codes: H05B 3/22 non-flexible
• CPC Class Codes: H05K 3/10 in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

Systems and methods for preventing or reducing unwanted heat in a microfluidic device while generating heat in selected regions of the device are described. Current can be supplied to a heating element through electric leads that are designed so that the current density in the leads is substantially lower than the current density in the heating element. Unwanted heat in the microfluidic complex can be reduced by thermally isolating the electric leads from the microfluidic complex by, for example, running each lead directly away from the microfluidic complex. Unwanted heat can be removed from selected regions of the microfluidic complex using one or more cooling devices.

Claims

1. (canceled)

2. A method for generating heat in selection regions of a microfluidic complex, the method comprising:

providing a microfluidic complex comprising at least one thermally actuated component;

providing a thermally insulating substrate comprising a heating element configured to actuate the at least one thermally actuated component; and

supplying electrical current from a current source to the heating element through at least one conductive lead, the at least one conductive lead having a lower current density than the heating element.

3. The method of claim 2, further comprising thermally actuating the at least one thermally actuated component.

4. The method of claim 3, wherein thermally actuating comprises actuating at least one thermally actuated valve.

5. The method of claim 3, wherein thermally actuating comprises melting a material in the at least one thermally actuated component.

6. The method of claim 3, wherein thermally actuating comprises applying heat to at least one reaction chamber.

7. The method of claim 2, wherein the microfluidic complex comprises at least one thermally actuated component in each of a plurality of flow channels, and wherein the method further comprises thermally actuating a first thermally actuated component in a first flow channel with the heating element without thermally actuating a second thermally actuated component in an adjacent flow channel.

8. The method of claim 2, wherein the heating element and the at least one conductive lead each comprise a vertical thickness dimension in a direction orthogonal to a plane in which the thermally insulating substrate lies, and wherein the vertical thickness dimension of the at least one conductive lead is greater than the vertical thickness dimension of the heating element.

9. The method of claim 2, wherein the heating element and the at least one conductive lead each comprise a horizontal thickness dimension in a direction parallel to a plane in which the thermally insulating substrate lies, and wherein the horizontal thickness dimension of the at least one conductive lead is greater than the horizontal thickness dimension of the heating element.

10. The method of claim 2, wherein providing a microfluidic complex comprises providing a microfluidic complex comprising a plurality of flow channels, and wherein the method further comprises thermally actuating at least one thermally actuated component in each flow channel with at least one of a plurality of heating elements in the thermally insulating substrate.

11. A method for reducing transfer of heat generated by a heating element in a microfluidic processing system, the method comprising:

providing a substrate having at least one heating element;

providing a microfluidic complex comprising a first heating surface proximate to at least one thermally actuated component of the microfluidic complex;

placing the first heating surface of the microfluidic complex in thermal communication with the at least one heating element of the substrate; and

supplying electrical current to the at least one heating element through a conductive lead having a greater cross-sectional area in at least one dimension than the at least one heating element.

12. The method of claim 11, further comprising applying heat to the thermally actuated component through the first heating surface of the microfluidic complex.

13. The method of claim 12, further comprising manipulating a thermally actuated component in a first portion of the microfluidic complex without manipulating a thermally actuated component in a second portion of the microfluidic complex adjacent to the first portion.

14. The method of claim 12, further comprising melting a material in a first thermally actuated component of the microfluidic complex using the at least one heating element without melting a material in a second thermally actuated component of the microfluidic complex.

15. The method of claim 11, wherein the conductive lead has a greater cross-sectional area in a dimension orthogonal to a plane in which the substrate lies.

16. The method of claim 11, wherein the conductive lead has a greater cross-sectional area in a dimension parallel to a plane in which the substrate lies.

17. The method of claim 11, wherein the conductive lead and the at least one heating element each have a length taken along a dimension d_l and a width taken along a dimension d_w, the dimensions d_l and d_w being parallel to a plane in which the substrate lies, and wherein the width of the conductive lead is greater than the width of the at least one heating element.

18. The method of claim 11, wherein the conductive lead and the at least one heating element each have a length taken along a dimension d_l and a width taken along a dimension d_w, the dimensions d_l and d_w being parallel to a plane in which the substrate lies, and wherein the length of the conductive lead is greater than the length of the at least one heating element.

19. The method of claim 11, wherein the conductive lead has a greater cross-sectional area in a dimension orthogonal to a plane in which the substrate lies and in a dimension parallel to a plane in which the substrate lies.

20. A method of manufacturing a microfluidic processing system, the method comprising:

providing a substrate comprising a plurality of heating elements, each heating element configured to apply heat to a thermally actuated component; and

routing at least one conductive lead to each of the plurality of heating elements, at least one conductive lead having a greater cross-sectional area in at least one dimension than the heating element to which it is routed.

21. The method of claim 20, wherein routing at least one conductive lead comprises routing the at least one conductive lead through the substrate to each of the plurality of heating elements.