Photovoltaic Cell And Method Of Forming The Same

• US 20140345685A1
• Filed: 12/13/2012
• Published: 11/27/2014
• Est. Priority Date: 12/13/2011
• Status: Abandoned Application

• Current Assignee: Dow Corning Corporation (Dow, Inc.)
• Original Assignee: Dow Corning Corporation (Dow, Inc.)
• Inventors: Beaucarne, Guy Damien Serge, Powell, Nicholas E., Zambova, Adriana Petkova, Albaugh, John D.
• Application Number:
  US14/364,794
• Publication Number:
  US 20140345685A1
• Time in Patent Office: Days
• US Class Current: 136/256
• CPC Class Codes: H01L 31/022425 for solar cells
• CPC Class Codes: H01L 31/022458 for emitter wrap-through [EWT] type solar cells, e.g. interdigitated emitter-base back-contacts
• CPC Class Codes: H01L 31/0512 made of a particular material or composition of materials
• CPC Class Codes: Y02E 10/50 Photovoltaic [PV] energy
• CPC Class Codes: Y02E 10/547 Monocrystalline silicon PV cells

Abstract

A photovoltaic cell comprises a base substrate comprising silicon and including a rear region. A first electrode is disposed on, and is in electrical communication with, the rear region, and comprises a first metal present in the first electrode in a majority amount. A second electrode is spaced from the rear region such that the rear region is free of physical contact with the second electrode. The second electrode is in electrical contact with the first electrode. The second electrode comprises a polymer, a second metal present in the second electrode in a majority amount, and a third metal different from the first and second metals. The third metal has a melting temperature of no greater than about 300° C. The rear region is in electrical communication with the second electrode via the first electrode. A method of forming the PV cell is also provided.

Claims

1. A photovoltaic cell comprising:

a base substrate comprising silicon and including a rear region;

a first electrode disposed on said rear region of said base substrate and having an outer surface, with said first electrode in electrical contact with said rear region of said base substrate and comprising a first metal present in said first electrode in a majority amount; and

a second electrode spaced from said rear region of said base substrate such that said rear region of said base substrate is free of physical contact with said second electrode, with said second electrode in electrical contact with said first electrode;

wherein said second electrode comprises;

a polymer,

a second metal present in said second electrode in a majority amount, and

a third metal different from said first metal of said first electrode and said second metal of said second electrode with said third metal having a melting temperature of no greater than about 300°

C.; and

wherein said rear region of said base substrate is in electrical communication with said second electrode via said first electrode.

2. The photovoltaic cell as set forth in claim 1,

wherein said second electrode is formed at a temperature of no greater than about 300°

C. from a composition enabling said second electrode to be formed at said temperature, with said composition comprising;

said polymer,

said second metal, and

said third metal.

4. The photovoltaic cell as set forth in claim 1, wherein said rear region is further defined as a rear doped region.

5. The photovoltaic cell as set forth in claim 4, wherein said base substrate further includes an upper doped region opposite said rear doped region.

6. The photovoltaic cell as set forth in claim 1, wherein said rear region of said base substrate is an n-type doped region and/or a p-type doped region.

7. The photovoltaic cell as set forth in claim 1, further comprising a passivation layer disposed on said region(s) of said base substrate with said passivation layer comprising SiO_X, ZnS, MgF_X, SiN_X, SiCN_X, AlO_X, TiO₂, a transparent conducting oxide (TCO), or combinations thereof.

8. The photovoltaic cell as set forth in claim 1, wherein said first metal of said first electrode comprises aluminum and/or silver, said second metal of said second electrode comprises copper or silver, alternatively copper, and said third metal of said second electrode comprises solder.

9. The photovoltaic cell as set forth in claim 1, wherein said first metal of said first electrode comprises aluminum and/or silver and said second metal of said second electrode comprises copper.

11. The photovoltaic cell as set forth in claim 1, wherein said second electrode is formed from a composition comprising;

a copper powder as said second metal,

a solder powder which melts at lower temperature than melting temperature of said copper powder, as said third metal, and

said polymer, or a monomer which is polymerisable to yield said polymer.

12. The photovoltaic cell as set forth in claim 1, wherein said second electrode is:

i) a pad or a busbar;

ii) directly solderable;

or

iii) both i) and ii).

14. The photovoltaic cell as set forth in claim 1, wherein said first electrode defines a least one hole and said second electrode is disposed over and at least partially within said at least one hole for electrical contact with said base substrate.

15. The photovoltaic cell as set forth in claim 1, further defined as an emitter-wrap through (EWT) photovoltaic cell wherein said base substrate defines a plurality of contact holes and said second electrode is further defined as a plurality of second electrodes with a second electrode disposed in each of said contact holes.

16. The photovoltaic cell as set forth in claim 1, further defined as a metal-wrap through (MWT) photovoltaic cell wherein said base substrate defines a plurality of contact holes and said second electrode is further defined as a plurality of second electrodes with a second electrode disposed in each of said contact holes and in contact with a plurality of fingers disposed opposite said base substrate.

17. A photovoltaic cell module comprising a plurality of said photovoltaic cells as set forth in claim 1, and further comprising at least one ribbon in physical contact with said second electrodes of said photovoltaic cells such that said photovoltaic cells are in electrical communication with each other via said ribbon.

3. A photovoltaic cell comprising:

a base substrate comprising silicon and including a rear region selected from an n-type doped region and/or a p-type doped region;

a first electrode disposed on said rear region of said base substrate and having an outer surface, with said first electrode in electrical contact with said rear region of said base substrate and comprising a first metal comprising aluminum and/or silver present in said first electrode in a majority amount; and

a second electrode spaced from said rear region of said base substrate such that said rear region of said base substrate is free of physical contact with said second electrode, with said second electrode in electrical contact with said first electrode;

wherein said second electrode comprises;

a polymer comprising an epoxy, an acrylic, or a combination thereof,

a second metal comprising copper or silver present in said second electrode in a majority amount, and

a third metal comprising solder with said solder having a melting temperature of no greater than about 300°

C.; and

wherein said rear region of said base substrate is in electrical communication with said second electrode via said first electrode.

10. The photovoltaic cell as set forth in claim 3, wherein said solder of said second electrode comprises a tin alloy and said polymer of said second electrode comprises an epoxy, an acrylic, or a combination thereof.

13. (canceled)

18. A method of forming a photovoltaic cell comprising a base substrate comprising silicon and including a rear region, a first electrode disposed on the rear region of the base substrate and having an outer surface, with the first electrode in electrical contact with the rear region of the base substrate and comprising a first metal present in the first electrode in a majority amount, and a second electrode spaced from the rear region and in electrical contact with the first electrode, said method comprising the steps of:

applying a composition to the outer surface of the first electrode to form a layer such that the rear region of the base substrate is free of physical contact with the layer; and

heating the layer to a temperature of no greater than about 300°

C. to form the second electrode;

wherein the composition comprises;

a polymer,

a second metal present in the composition in a majority amount, and

a third metal different from the first metal of the first electrode and the second metal of the composition; and

wherein the rear region of the base substrate is in electrical communication with the second electrode via the first electrode.

19. The method as set forth in claim 18, wherein the first metal of the first electrode comprises aluminum and/or silver, the second metal of the composition comprises copper or silver, alternatively copper, and the third metal of the composition comprises solder.

20. The method as set forth in claim 18, wherein applying the composition is further defined as:

i) printing the composition on the outer surface of the first electrode to define the second electrode;

or

ii) electrochemically depositing the composition on the outer surface of the first electrode to define the second electrode.

22. The method as set forth in claim 18, wherein the composition comprises;

a copper powder as the second metal,

a solder powder which melts at lower temperature than melting temperature of the copper powder, as the third metal, and

the polymer, or a monomer which is polymerisable to yield the polymer.

21. (canceled)