DYNAMIC THERMAL INTERFACE MATERIAL

• US 20140345843A1
• Filed: 08/03/2012
• Published: 11/27/2014
• Est. Priority Date: 08/03/2011
• Status: Abandoned Application

• Current Assignee: Anchor Science, LLC
• Original Assignee: Anchor Science, LLC
• Inventors: Sinha, Saion K., Kirkor, Ewa S., Schricker, April Dawn, Scheeline, Alexander
• Application Number:
  US14/236,681
• Publication Number:
  US 20140345843A1
• Time in Patent Office: Days
• US Class Current: 165/185
• CPC Class Codes: C09K 5/14 Solid materials, e.g. powdery or granular
• CPC Class Codes: F28F 21/02 of carbon, e.g. graphite
• CPC Class Codes: F28F 23/00 Features relating to the use of intermediate heat-exchange materials, e.g. selection of compositions heat-transfer, heat-exchange or heat-storage materials C09K5/00
• CPC Class Codes: H01L 23/373 Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
• CPC Class Codes: H01L 23/433 Auxiliary members in containers characterised by their shape, e.g. pistons
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/2039 characterised by the heat transfer by conduction from the heat generating element to a dissipating body arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00

Abstract

Aspects of the invention provide compositions that include carbon nanotubes dispersed within nanographite particles, and that have useful thermal properties. Certain compositions have high thermal conductivities (e.g., high thermal conductivities at ambient temperature). Certain compositions have a temperature dependent thermal conductivity that reversibly increases with temperature. Certain compositions are useful for heat transfer and can be used as thermal interface material, for example, in the context of computer and/or power generating devices.

Claims

1. A thermal interface composition comprising:

carbon nanotubes, and

nano-graphite particles,

wherein the carbon nanotubes are dispersed among the nano-graphite particles and the composition demonstrates a positive thermal dependence of thermal conductivity.

2. The composition of claim 1, wherein the nano-graphite particles are graphene or graphite nanoplatelets.

3. The composition of claim 1, wherein the average lateral dimension of the nanoplatelets is less than 1 micron.

6. The composition of claim 1, wherein the average thickness of the nanoplatelets is at least 10 times smaller than average lateral diameter of the nanoplatelets.

7. The composition of claim 1, wherein the average length of the nanotubes is less than 30 times the average lateral dimension of the nanoplatelets.

34. A method for promoting heat transfer from a first surface, the method comprising contacting the first surface with a composition of claim 1.

35. The method of claim 34, wherein the first surface is the surface of a computer component.

36. The method of claim 35, wherein the computer component surface is selected from semiconductors, alumina, magnesia, silica, silicon, and silicon carbide based ceramic, copper, or gold or nickel, or polymer metal laminates.

37. The method of claim 34, wherein the first surface is the surface of a power generating component.

38. The method of claim 37, wherein the power generating component is selected from solar power collecting devices, wind turbines, hydroelectric turbines or heat turbines or engines.

40. A computer component comprising a composition of claim 1 in contact with at least one surface.

41. A power generating component comprising a composition of claim 1 in contact with at least one surface.

4-5. -5. (canceled)

8-33. -33. (canceled)

39. (canceled)

42-53. -53. (canceled)