ELECTRONIC PART, ELECTRONIC APPARATUS, AND MOVING OBJECT

• US 20140345928A1
• Filed: 05/22/2014
• Published: 11/27/2014
• Est. Priority Date: 05/27/2013
• Status: Abandoned Application

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: KOYAMA, Yugo
• Application Number:
  US14/285,021
• Publication Number:
  US 20140345928A1
• Time in Patent Office: Days
• US Class Current: 174/260
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05009 Bonding area integrally formed with a via connection of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05022 the internal layer being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/05124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05563 Only on parts of the surface of the internal layer
• CPC Class Codes: H01L 2224/05572 the external layer extending out of an opening
• CPC Class Codes: H01L 2224/056 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/06131 being uniform, i.e. having a uniform pitch across the array
• CPC Class Codes: H01L 2224/1134 Stud bumping, i.e. using a wire-bonding apparatus
• CPC Class Codes: H01L 2224/13013 being rectangular or square
• CPC Class Codes: H01L 2224/13015 comprising protrusions or indentations
• CPC Class Codes: H01L 2224/13027 the bump connector being offset with respect to the bonding area, e.g. bond pad
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/1403 Bump connectors having different sizes, e.g. different diameters, heights or widths
• CPC Class Codes: H01L 2224/14051 Bump connectors having different shapes
• CPC Class Codes: H01L 2224/1411 the bump connectors being bonded to at least one common bonding area
• CPC Class Codes: H01L 2224/16013 the bump connector being larger than the bonding area, e.g. bond pad
• CPC Class Codes: H01L 2224/16238 the bump connector connecting to a bonding area protruding from the surface of the item
• CPC Class Codes: H01L 2224/17107 : the bump connectors connecting two common bonding areas
• CPC Class Codes: H01L 2224/81191 : wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81203 : Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
• CPC Class Codes: H01L 23/49811 : Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/06 : of a plurality of bonding areas
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/14 : of a plurality of bump connectors
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/17 : of a plurality of bump connectors
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/3512 : Cracking
• CPC Class Codes: H05K 3/3436 : having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: H05K 3/4007 : Surface contacts, e.g. bumps H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3457

Abstract

An electronic part includes amount substrate, a circuit substrate, a pad disposed on the circuit substrate, a bump that connects the mount substrate and the pad to each other, and a surface protection film that extends from a surface of the pad via an outer circumferential edge of the pad to a surface of the circuit substrate and has at least two openings adjacent to each other on the pad. The length equal to one-half the shortest distance from an end of one of the adjacent openings to an end of the other opening is smaller than the length of the shortest distance from the outer circumferential edge of the pad to the end of each of the openings, and the bump is provided in each of the two openings and layered on the surface protection film in a plan view.

Claims

1. An electronic part comprising:

a mount substrate;

a circuit substrate;

a pad disposed on the circuit substrate;

a bump that connects the mount substrate and the pad to each other; and

a surface protection film that extends from a surface of the pad via an outer circumferential edge of the pad to a surface of the circuit substrate and has at least two openings adjacent to each other on the pad,

wherein the length equal to one-half the shortest distance from an end of one of the adjacent openings to an end of the other opening is smaller than the shortest distance from the outer circumferential edge of the pad to the end of each of the openings, and

the bump is provided in each of the two openings and layered on the surface protection film in a plan view.

2. The electronic part according to claim 1,

wherein the bumps have a rectangular shape and are so arranged that the distance between the outer circumferential edge of the pad and a corner of each of the openings is minimized.

3. The electronic part according to claim 1,

wherein the bumps are provided in a plating process.

4. The electronic part according to claim 1,

wherein the bumps adjacent to each other are in contact with each other.

5. The electronic part according to claim 1,

wherein the openings have sizes different from each other.

6. The electronic part according to claim 1,

wherein the openings are located in at least three positions.

7. The electronic part according to claim 1, further comprising an resonator element,

wherein the resonator element is disposed on the mount substrate and electrically connected to the circuit substrate.

8. An electronic apparatus comprising the electronic part according to claim 1.

9. A moving object comprising the electronic part according to claim 1.