SURFACE MOUNTABLE ELECTRONIC COMPONENT
First Claim
1. A surface mountable electronic component free of connecting wires having a semiconductor substrate, wherein a plurality of solderable connection areas are arranged at the an underside of the component,whereinat least one recess is formed in a region of the edges bounding the underside;
- and wherein the recess is covered with an insulating layer.
1 Assignment
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Accused Products
Abstract
A surface mountable electronic component free of connecting wires comprises a semiconductor substrate, wherein a plurality of solderable connection areas are arranged at the underside of the component. The component comprises at least one recess is formed in the region of the edges bounding the underside; and in that the recess is covered with an insulating layer. A method for the manufacture of such a component comprises the formation of corresponding recesses.
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Citations
24 Claims
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1. A surface mountable electronic component free of connecting wires having a semiconductor substrate, wherein a plurality of solderable connection areas are arranged at the an underside of the component,
wherein at least one recess is formed in a region of the edges bounding the underside; - and wherein the recess is covered with an insulating layer.
- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 19, 20, 21, 22, 23, 24)
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13. A method for the manufacture of surface mountable electronic components free of connecting wires, which each have a semiconductor substrate, and each have a plurality of solderable connection areas arranged at their respective underside,
comprising the steps of: -
forming recesses at a first surface of a wafer composed of a semiconductor substrate material, wherein the recesses extend along separation lines which separate a component from an adjacent component; applying an insulation layer on the wafer which covers at least the recesses; and separating the components along the separation lines. - View Dependent Claims (14, 15, 16, 17)
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18. A method for connecting a surface mountable electronic component to a circuit board, wherein the surface mountable electronic component is free of connection wires and has a semiconductor substrate, wherein a plurality of solderable connection areas are arranged at an underside of the component, wherein at least one recess is formed in a region of the edges bounding the underside and wherein the recess is covered with an insulating layer, and wherein the circuit board has a plurality of contacting surfaces which are associated with respective connection areas of the component, comprising the steps of:
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applying a solder at at least one of the connection areas and at the contacting surfaces; positioning the component at the circuit board; and melting the solder so that each connection area is connected to the associated contacting surface by means of the solder.
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Specification