MODULAR BIOMEDICAL IMPLANTS

• US 20140350652A1
• Filed: 09/28/2011
• Published: 11/27/2014
• Est. Priority Date: 09/28/2011
• Status: Active Grant

• Current Assignee: Advanced Bionics AG (Sonova Holding AG)
• Original Assignee: Advanced Bionics AG (Sonova Holding AG)
• Inventors: Suwito, Wanijinarjo
• Granted Patent: US 9,511,216 B2
• Time in Patent Office: Days
• US Class Current: 607/116
• CPC Class Codes: A61N 1/05 for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence
• CPC Class Codes: A61N 1/0541 Cochlear electrodes
• CPC Class Codes: A61N 1/36038 Cochlear stimulation
• CPC Class Codes: A61N 1/372 Arrangements in connection with the implantation of stimulators
• CPC Class Codes: A61N 1/3752 Details of casing-lead connections
• CPC Class Codes: H01R 13/2414 conductive elastomers
• CPC Class Codes: H01R 13/5224 for medical use
• CPC Class Codes: H01R 13/622 Screw-ring or screw-casing H01R13/623 takes precedence
• CPC Class Codes: H01R 2201/12 for medicine and surgery

Abstract

A modular biomedical implant includes a processor, an electrode array, and a cable. The first end of the cable is attached to the electrode array and a second end of the cable terminates in a first array of contacts. A second array of contacts is electrically connected to the processor. A separate anisotropic conductor is disposed between the first array of contacts and the second array of contacts and forms electrical connections between the first array of contacts and the second array of contacts. A method for replacing a processor of a modular biomedical implant is also provided.

Claims

1. A modular biomedical implant comprising:

a processor;

an electrode array;

a cable, a first end of the cable attached to the electrode array and a second end of the cable terminating in a first array of contacts;

a second array of contacts electrically connected to the processor; and

a separate anisotropic conductor disposed between the first array of contacts and the second array of contacts, the anisotropic conductor forming electrical connections between the first array of contacts and the second array of contacts.

2. The implant of claim 1, in which the second array of contacts are pressed against the anisotropic conductor.

3. The implant of claim 2, further comprising a compression spring configured to press the second array of contacts against the anisotropic conductor.

4. The implant of claim 3, further comprising a compression plate overlying the anisotropic conductor, in which the compression spring is compressed by screwing a cap onto a base.

5. The implant of claim 1, in which the anisotropic conductor comprises a deformable matrix with embedded deformable conductors.

6. The implant of claim 1, in which the anisotropic conductor is an anisotropic conductive elastomer.

7. The implant of claim 1, in which the anisotropic conductor comprises conductive balls imbedded in an elastomer.

8. The implant of claim 1, in which the first array of contacts comprises folded metal sheets passing through a substantially impermeable substrate, signal wires connected to the folded metal sheets on a first surface of the substantially impermeable substrate, and the anisotropic conductor being pressed against the folded metal sheets on a second opposing surface of the substantially impermeable substrate.

9. The implant of claim 1, in which contacts in the first array of contacts are each formed from a folded metal sheet having a first leg, a second leg, and a center portion, the first leg and second leg passing through a substantially impermeable substrate such that the center portion is parallel to and directly contacts a first surface of the substantially impermeable substrate, in which the first leg is folded against a second surface of the substantially impermeable substrate and a signal wire is welded to the first leg, and the second leg is folded over the first leg and the signal wire.

10. The implant of claim 8, in which the substantially impermeable substrate comprises a ridge seal, the anisotropic conductor being pressed against the ridge seal to create a seal that impedes fluid and gas flow to the first array of contacts and the second array of contacts.

11. The implant of claim 1, in which the second array of contacts comprises folded metal sheets passing through a second substantially impermeable substrate.

12. The implant of claim 1, further comprising a base with cavity in which the first array of contacts, the second array of contacts and the anisotropic conductor are contained within the cavity and aligned by protrusions within the cavity.

13. The implant of claim 1, further comprising an inline connector, the inline connector comprising the first array of contacts, anisotropic conductor, and second array of contacts.

14. The implant of claim 1, further comprising a base with cavity in which the processor, the first array of contacts, anisotropic conductor and second array of contacts are contained within the cavity.

15. The implant of claim 14, in which the processor is contained within a hermetically sealed case, the second array of contacts comprising pads on an exterior of a hermetic electrical feedthrough in the case.

16. The implant of claim 15, further comprising an implanted antenna hardwired to the processor and configured to be removed with the processor.

17. The implant of claim 15, further comprising an implanted antenna hardwired to a base and configured to remain in place when the processor is removed.

18. The implant of claim 15, further comprising a base comprising:

a cavity configured to receive the case; and

a threaded portion configured to receive a cap such that when the cap is screwed onto the threaded portion, the hermetic electrical feedthrough is pressed against the anisotropic conductor.

19. The implant of claim 18, further comprising a lubricious conductor disposed between the cap and the case.

20. The implant of claim 18, in which the cap comprises a threaded ring.

21. The implant of claim 1, in which the processor is retained within a base by a snap ring.

22. A method for replacing a processor of a modular biomedical device comprising:

surgically exposing a connector between a processor and an electrode array;

removing a locking device of the connector to separate a first array of contacts connected to the processor from an anisotropic conductor, the anisotropic conductor being sandwiched between the first array of contacts and a second array of contacts connected to the electrode array;

removing the processor and the anisotropic conductor;

replacing the processor with a new processor and a new anisotropic conductor; and

replacing the locking device to press contacts connected to the new processor against the anisotropic conductor.

23. The method of claim 22, in which removing the processor further comprises removing an antenna.

24. The method of claim 22, in which removing a locking device comprises:

grasping a base of the connector on two opposing sides with a surgical tool to hold the base stationary; and

grasping a cap of the connector with the surgical tool and rotating the cap with the surgical tool while holding the base stationary.

25. The method of claim 22, in which surgically exposing the connector comprises reopening the original incision;

the surgical tool being inserted horizontally into the original incision and grasping the base and cap from the side.

26. The method of claim 22, in which surgically exposing the connector comprises making a new incision midline of the modular biomedical device and inserting the surgical tool vertically through the new incision to access the base and cap from the top.

27. A modular biomedical implant system comprising:

a modular implant comprising;

a processor;

a base with a cavity that receives the processor; and

a cap that attaches to the base and retains the processor within the cavity;

a surgical tool comprising;

a gripping portion that grips the base; and

an engagement portion that disengages the cap from the base so that the processor can be removed from the cavity.

28. The system of claim 27, in which the base comprises threads, and the cap screws onto the base by engaging the threads.

29. The system of claim 27, in which the surgical tool engages the modular implant from the side, the gripper portion comprises two opposing scissored arms that engage exterior features on the base, and the engagement portion comprises a ratchet mechanism that engages the cap and unscrews the cap from the base.

30. The system of claim 27, in which the surgical tool engages the modular implant from above the cap, the gripper portion fits around the base and engages external features of the base, and the engagement portion comprises a torque driver that engages the cap and unscrews the cap from the base.