SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE DEVICE BY FORMING MONOCRYSTALLINE SEMICONDUCTOR LAYERS ON A DIELECTRIC LAYER OVER ISOLATION REGIONS
First Claim
1. A method comprising:
- forming a pair of first openings extending vertically through a sacrificial layer, a dielectric layer, and a first semiconductor layer and into a semiconductor substrate;
performing an etch process that laterally expands and merges said first openings within said semiconductor substrate only so as to create a trench;
depositing dielectric material on said sacrificial layer to fill upper portions of said first openings above said trench, thereby creating a trench isolation region;
removing said sacrificial layer;
forming a second semiconductor layer on said dielectric layer, said second semiconductor layer being any one of amorphous and polycrystalline;
forming a second opening extending vertically through said second semiconductor layer and said dielectric layer to expose a monocrystalline portion of said first semiconductor layer between said first openings; and
epitaxially depositing a third semiconductor layer on said second semiconductor layer and in said second opening such that said third semiconductor layer has polycrystalline section on said second semiconductor layer and a monocrystalline section on said monocrystalline portion of said first semiconductor layer in said second opening.
7 Assignments
0 Petitions
Accused Products
Abstract
Disclosed are devices and methods of forming the devices wherein pair(s) of first openings are formed through a dielectric layer and a first semiconductor layer into a substrate and, within the substrate, the first openings of each pair are expanded laterally and merged to form a corresponding trench. Dielectric material is deposited, filling the upper portions of the first openings and creating trench isolation region(s). A second semiconductor layer is deposited and second opening(s) are formed through the second semiconductor and dielectric layers, exposing monocrystalline portion(s) of the first semiconductor layer between the each pair of first openings. A third semiconductor layer is epitaxially deposited with a polycrystalline section on the second semiconductor layer and monocrystalline section(s) on the exposed monocrystalline portion(s) of the first semiconductor layer. A crystallization anneal is performed and a device (e.g., a bipolar device) is formed incorporating the resulting monocrystalline second and third semiconductor layers.
47 Citations
20 Claims
-
1. A method comprising:
-
forming a pair of first openings extending vertically through a sacrificial layer, a dielectric layer, and a first semiconductor layer and into a semiconductor substrate; performing an etch process that laterally expands and merges said first openings within said semiconductor substrate only so as to create a trench; depositing dielectric material on said sacrificial layer to fill upper portions of said first openings above said trench, thereby creating a trench isolation region; removing said sacrificial layer; forming a second semiconductor layer on said dielectric layer, said second semiconductor layer being any one of amorphous and polycrystalline; forming a second opening extending vertically through said second semiconductor layer and said dielectric layer to expose a monocrystalline portion of said first semiconductor layer between said first openings; and epitaxially depositing a third semiconductor layer on said second semiconductor layer and in said second opening such that said third semiconductor layer has polycrystalline section on said second semiconductor layer and a monocrystalline section on said monocrystalline portion of said first semiconductor layer in said second opening. - View Dependent Claims (2, 3, 4, 5)
-
-
6. A method of forming a bipolar device, said method comprising:
-
forming at least two pairs of first openings extending vertically through a sacrificial layer, a dielectric layer and an intrinsic base layer into a semiconductor substrate such that one pair of said first openings is on one side of a collector region in said semiconductor substrate and another pair of said first openings is on an opposite side of said collector region; performing an etch process that laterally expands and merges said first openings of each of said pairs within said semiconductor substrate only so as to create trenches on opposing sides of said collector region; depositing dielectric material on said sacrificial layer to fill upper portions of said first openings above said trenches to create trench isolation regions; removing said sacrificial layer; forming a first extrinsic base layer on said dielectric layer, said first extrinsic base layer being any one of amorphous and polycrystalline; forming second openings extending vertically through said first extrinsic base layer and said dielectric layer so as to expose monocrystalline portions of said intrinsic base layer between said first openings of each of said pairs; epitaxially depositing a second extrinsic base layer on said first extrinsic base layer and on said monocrystalline portions of said intrinsic base layer in said second openings such that said second extrinsic base layer has a polycrystalline section on said first extrinsic base layer and monocrystalline sections on said monocrystalline portions of said intrinsic base layer in said second openings. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13)
-
-
14. A bipolar device comprising:
-
a semiconductor substrate comprising trench isolation regions and a collector region positioned laterally between said trench isolation regions; an intrinsic base layer on said semiconductor substrate above said collector region and extending laterally onto said trench isolation regions; a dielectric layer on said intrinsic base layer; pairs of first openings extending vertically through said dielectric layer and said intrinsic base layer, each pair being aligned above a trench isolation region and being filled with dielectric material; a first extrinsic base layer on said dielectric layer; second openings extending vertically through said first extrinsic base layer and said dielectric layer to monocrystalline portions of said intrinsic base layer between said first openings of each of said pairs; and a second extrinsic base layer on said first extrinsic base layer and on said monocrystalline portions of said intrinsic base layer within said second openings. - View Dependent Claims (15, 16, 17, 18, 19, 20)
-
Specification