DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME

• US 20140354143A1
• Filed: 09/27/2013
• Published: 12/04/2014
• Est. Priority Date: 06/03/2013
• Status: Active Grant

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Inventors: Jung, Young-Bae, Kim, Dong-Wook
• Granted Patent: US 10,028,339 B2
• Time in Patent Office: Days
• US Class Current: 313/511
• CPC Class Codes: G06F 3/041 Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• CPC Class Codes: H05B 33/02 Details
• CPC Class Codes: H05B 33/10 Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
• CPC Class Codes: H10K 59/131 Interconnections, e.g. wiring lines or terminals
• CPC Class Codes: H10K 77/111 Flexible substrates
• CPC Class Codes: Y02E 10/549 Organic PV cells
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A display panel includes: a substrate including a first area, a second area forming a predetermined angle with the first area, and a first bending area between the first area and the second area; a first display unit and a first embedded circuit unit in the first area of the substrate; and a second display unit and a second embedded circuit unit in the second area of the substrate.

Claims

1. A display panel comprising:

a substrate comprising

a first area,

a second area forming a first predetermined angle with the first area, and

a first bending area between the first area and the second area;

a first display unit and a first embedded circuit unit in the first area of the substrate; and

a second display unit and a second embedded circuit unit in the second area of the substrate.

2. The display panel of claim 1, wherein the substrate comprises a flexible substrate.

3. The display panel of claim 1, wherein the substrate further comprises:

a third area at an opposite side of the first area than the second area and forming a second predetermined angle with the first area, and

a second bending area between the third area and the first area.

4. The display panel of claim 3, further comprising conductive lines on the substrate excluding the first bending area and the second bending area of the substrate.

5. The display panel of claim 4, further comprising an organic insulating layer on the substrate,

wherein the first bending area and the second bending area of the substrate comprises only the organic insulating layer.

6. The display panel of claim 3, further comprising a third display unit and a third embedded circuit unit in the third area of the substrate.

7. The display panel of claim 6, wherein each of the first, second and third embedded circuit units comprises a scan driver and an emission driver.

8. The display panel of claim 6, further comprising:

a first pad portion in the first area of the substrate,

a second pad portion in the second area of the substrate, and

a third pad portion in the third area of the substrate.

9. The display panel of claim 8, further comprising a flexible printed circuit board which is electrically connected to the first pad portion, the second pad portion and the third pad portion.

10. The display panel of claim 3, wherein a size of the second area is substantially equal to a size of the third area.

11. The display panel of claim 10, wherein a distance between the first bending area and the second bending area is greater than a distance between the first bending area and a distal edge of the substrate opposite to the first area.

12. A method of manufacturing a display panel, the method comprising:

preparing a substrate which is flexible and comprises;

a first area, a second area, and a first bending area between the first area and the second area;

providing a display unit, conductive lines and an embedded circuit unit on the substrate; and

bending the substrate at the first bending area to dispose the first area and the second area of the substrate at a predetermined angle with respect to each other,

wherein the conductive lines are on the substrate excluding the first bending area of the substrate.

13. The method of claim 12, further comprising providing an inorganic insulating layer on the substrate excluding the first bending area of the substrate.

14. The method of claim 12, wherein the substrate comprises a single, unitary, indivisible member.

15. The method of claim 12,

further comprising:

providing a first pad portion in the first area of the substrate, and a second pad portion in the second area of the substrate, and

connecting a first portion and a second portion of a flexible printed circuit board to the first pad portion and the second pad portion of the substrate, respectively,

wherein the first and second portions of the flexible printed circuit board form the predetermined angle with respect to each other.