FILM FORMING APPARATUS, FILM FORMING METHOD AND NON-TRANSITORY STORAGE MEDIUM
First Claim
1. A film forming apparatus configured to perform a film forming process on a substrate in a vacuum environment by sequentially supplying different kinds of mutually-reacting reaction gases into a reaction vessel, comprising:
- a first reaction gas supply unit configured to supply a first reaction gas into the reaction vessel under an environment of a first pressure;
a second reaction gas supply unit configured to supply a second reaction gas into the reaction vessel under an environment of a second pressure lower than the first pressure;
a first vacuum exhaust mechanism connected to the reaction vessel through a first exhaust path in order to create the environment of the first pressure within the reaction vessel;
a second vacuum exhaust mechanism connected to the reaction vessel through a second exhaust path in order to create the environment of the second pressure within the reaction vessel, the second vacuum exhaust mechanism being lower in an operation pressure zone than the first vacuum exhaust mechanism; and
a switching unit configured to switch exhaust destinations of the reaction vessel between the first exhaust path and the second exhaust path.
1 Assignment
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Accused Products
Abstract
A film forming apparatus includes a first supply unit configured to supply a first reaction gas into the reaction vessel under an environment of a first pressure, a second supply unit configured to supply a second reaction gas into the reaction vessel under an environment of a second pressure lower than the first pressure, a first vacuum exhaust mechanism connected to the reaction vessel through a first exhaust path in order to create the environment of the first pressure within the reaction vessel, a second vacuum exhaust mechanism connected to the reaction vessel through a second exhaust path in order to create the environment of the second pressure, the second vacuum exhaust mechanism being lower in an operation pressure zone than the first vacuum exhaust mechanism, and a switching unit configured to switch exhaust destinations of the reaction vessel between the first path and the second path.
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Citations
11 Claims
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1. A film forming apparatus configured to perform a film forming process on a substrate in a vacuum environment by sequentially supplying different kinds of mutually-reacting reaction gases into a reaction vessel, comprising:
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a first reaction gas supply unit configured to supply a first reaction gas into the reaction vessel under an environment of a first pressure; a second reaction gas supply unit configured to supply a second reaction gas into the reaction vessel under an environment of a second pressure lower than the first pressure; a first vacuum exhaust mechanism connected to the reaction vessel through a first exhaust path in order to create the environment of the first pressure within the reaction vessel; a second vacuum exhaust mechanism connected to the reaction vessel through a second exhaust path in order to create the environment of the second pressure within the reaction vessel, the second vacuum exhaust mechanism being lower in an operation pressure zone than the first vacuum exhaust mechanism; and a switching unit configured to switch exhaust destinations of the reaction vessel between the first exhaust path and the second exhaust path. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A film forming method for performing a film forming process on a substrate in a vacuum environment by sequentially supplying different kinds of mutually-reacting reaction gases into a reaction vessel, comprising:
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a first process in which a first reaction gas is supplied into the reaction vessel under an environment of a first pressure and in which the interior of the reaction vessel is evacuated by a first vacuum exhaust mechanism connected to the reaction vessel through a first exhaust path in order to create the environment of the first pressure within the reaction vessel; and a second process in which a second reaction gas is supplied into the reaction vessel under an environment of a second pressure lower than the first pressure and in which the interior of the reaction vessel is evacuated by a second vacuum exhaust mechanism connected to the reaction vessel through a second exhaust path and lower in an operation pressure zone than the first vacuum exhaust mechanism in order to create the environment of the second pressure within the reaction vessel, wherein the first process and the second process are repeatedly performed. - View Dependent Claims (8, 9, 10, 11)
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Specification