METHOD OF MANUFACTURING MEMS DEVICES WITH RELIABLE HERMETIC SEAL

• US 20140356989A1
• Filed: 05/29/2013
• Published: 12/04/2014
• Est. Priority Date: 05/29/2013
• Status: Active Grant

• Current Assignee: Analog Devices, Inc.
• Original Assignee: Analog Devices, Inc.
• Inventors: Chen, Li, Yang, Kuang L.
• Granted Patent: US 8,921,128 B2
• Time in Patent Office: Days
• US Class Current: 438/17
• CPC Class Codes: B81C 99/0045 End test of the packaged device

Abstract

Manufactured capped MEMS device wafers are tested for hermeticity on a vacuum prober at differing pressures or on a wafer prober at differing temperatures. Resonant frequency testing is conducted. Leaking MEMS devices are distinguished from the remaining MEMS devices on the basis of quality factor (“Q”) measurements obtained from the resonant frequency testing.

Claims

1. A method of manufacturing MEMS devices with a reliable seal comprising:

inserting at least one wafer with a plurality of capped MEMS devices formed thereon into a vacuum prober;

reducing ambient pressure in the vacuum prober below a pressure within a chamber of at least one of the capped MEMS devices;

conducting resonant frequency testing of each of the MEMS devices while the at least one wafer is in the vacuum prober at the reduced ambient pressure;

distinguishing leaking MEMS devices from the remaining MEMS devices based upon quality factor (“

Q”

) measurements obtained from the resonant frequency testing.

2. The method of claim 1 wherein distinguishing comprises identifying leaking MEMS devices as those exhibiting a high Q in the resonant frequency testing relative to the remaining MEMS devices.

3. The method of claim 1 further comprising singulating the at least one wafer into individual MEMS devices.

4. The method of claim 3 further comprising physically separating the leaking MEMS devices from the remaining MEMS devices.

5. The method of claim 3 further comprising packing any of the remaining MEMS devices for shipment.

6. The method of claim 1 wherein the MEMS devices comprise accelerometers.

7. The method of claim 1 wherein the MEMS devices comprise gyro sensors.

8. The method of claim 1 wherein reducing ambient pressure comprises reducing ambient pressure within the vacuum prober to below 200 mbar.

9. The method of claim 1 wherein each of the capped MEMS devices is capped with an ASIC.

10. The method of claim 1 wherein each of the capped MEMS devices is capped with a CMOS IC.

11. A method of manufacturing MEMS devices with a reliable seal comprising:

placing at least one wafer with a plurality of capped MEMS devices formed thereon onto a wafer prober;

conducting resonant frequency testing of each of the MEMS devices while the at least one wafer is at a first temperature on the wafer prober;

bringing the at least one wafer to a second temperature on the wafer prober;

conducting resonant frequency testing of each of the MEMS devices while the at least one wafer is at the second temperature on the wafer prober;

distinguishing leaking MEMS devices from the remaining MEMS devices based upon quality factor (“

Q”

) obtained from the resonant frequency testing at the first temperature and at the second temperature.

12. The method of claim 11 wherein distinguishing comprises identifying leaking MEMS devices as those exhibiting a little or no change in Q between the resonant frequency testing at a first temperature and the resonant frequency testing at a second temperature relative to the change in Q exhibited by the remaining MEMS devices.

13. The method of claim 11 further comprising singulating the at least one wafer into individual MEMS devices.

14. The method of claim 13 further comprising physically separating the leaking MEMS devices from the remaining MEMS devices.

15. The method of claim 13 further comprising packing any of the remaining MEMS devices for shipment.

16. The method of claim 11 wherein the MEMS devices comprise accelerometers.

17. The method of claim 11 wherein the MEMS devices comprise gyro sensors.

18. The method of claim 11 wherein each of the capped MEMS devices is capped with an ASIC.

19. The method of claim 11 wherein each of the capped MEMS devices is capped with a CMOS IC.