METHOD FOR PREFERENTIAL SHRINK AND BIAS CONTROL IN CONTACT SHRINK ETCH

• US 20140357080A1
• Filed: 06/03/2014
• Published: 12/04/2014
• Est. Priority Date: 06/04/2013
• Status: Abandoned Application

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: LISI, Anthony D., COTTLE, Hongyun
• Application Number:
  US14/294,253
• Publication Number:
  US 20140357080A1
• Time in Patent Office: Days
• US Class Current: 438/675
• CPC Class Codes: H01L 21/0332 characterised by their composition, e.g. multilayer masks, materials
• CPC Class Codes: H01L 21/0337 characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
• CPC Class Codes: H01L 21/0338 Process specially adapted to improve the resolution of the mask
• CPC Class Codes: H01L 21/31116 by dry-etching
• CPC Class Codes: H01L 21/31138 by dry-etching
• CPC Class Codes: H01L 21/31144 using masks
• CPC Class Codes: H01L 21/76816 Aspects relating to the layout of the pattern or to the size of vias or trenches layout of the interconnections per se H01L23/528; CAD of ICs G06F30/00

Abstract

A method for providing a shrink etch in which the features to be etched in a target layer have major and minor dimensions with the major dimension larger than the minor dimension. In the shrink etch of a mask, the dimensions are reduced from that of a patterned resist of the mask, however, with conventional techniques, the shrink etch undesirably shrinks by a greater amount in the major axis dimension. By treating the resist prior to the shrink etch, the shrinking is made more uniform, and if desired in accordance with processes herein, the amount of shrinkage in the major axis can be the same as or less than that in the minor axis direction.

Claims

1. A method of etching a target layer comprising:

providing a substrate having the target layer thereon and a mask above the target layer, wherein a top portion of the mask is patterned with features having first and second dimensions in which the first dimension is larger than the second dimension, and wherein portions of the mask below the top portion are not patterned such that the mask is a partially opened mask;

performing a plasma deposition on the partially opened mask with a hydrocarbon gas;

after the plasma deposition, etching through remaining portions of the mask layer to form an open mask, and wherein during at least a portion of the etching through remaining portions of the mask a taper etch profile is formed such that openings at a bottom of the open mask have a first mask bottom dimension and a second mask bottom dimension wherein the first mask bottom dimension is larger than the second mask bottom dimension, and wherein at least one of;

(a) the first mask bottom dimension is smaller than the first dimension, or (b) the second mask bottom dimension is smaller than the second dimension; and

etching the target layer through the open mask.

2. A method according to claim 1, wherein the top portion of the mask comprises a resist layer, and wherein the remaining portions of the mask comprise an ARC layer, and wherein the taper etch profile is formed in the ARC layer.

3. A method according to claim 2, wherein etching of the ARC layer is performed in two steps at two different etch rates and two different plasma chemistries.

4. A method according to claim 3, wherein the two steps are performed in a process chamber, wherein the two steps include a first step followed by a second step, and wherein a larger amount of hydrogen is fed to the process chamber during one of the first and second steps than during the other of the first and second steps.

5. A method according to claim 4, wherein the process chamber comprises an upper electrode and wherein the method further comprises, during performing the plasma deposition on the partially opened mask, applying a negative voltage direct current power to the upper electrode.

6. A method according to claim 5, wherein after etching of the target layer etched features in the target layer have a first target layer dimension and a second target layer dimension, wherein the first target layer dimension is larger than the second target layer dimension, and wherein a first shrink amount is said first dimension minus said first target layer dimension, and a second shrink amount is said second dimension minus said second target layer dimension, and further wherein a ratio of said second shrink amount to said first shrink amount is 1:

≦

1.

7. A method according to claim 6, wherein during the plasma deposition, C_xH_yF_z and H2 are supplied to the process chamber.

8. A method according to claim 7, wherein a flow rate ratio of H2 to C_xH_yF_z is from 4:

1 to 10;

1.

9. A method according to claim 1, wherein after etching of the target layer etched features in the target layer have a first target layer dimension and a second target layer dimension wherein the first target layer dimension is larger than the second target dimension, and wherein a first shrink amount is said first dimension minus said first target layer dimension, and a second shrink amount is said second dimension minus said second target layer dimension, and further wherein a ratio of said second shrink amount to said first shrink amount is 1:

≦

1.

10. A method according to claim 9, further including filling etched features in the target layer with a conductive metal.

11. A method according to claim 1, wherein the top portion of the mask comprises a patterned resist layer, and wherein during the plasma deposition H2 and C_xH_yF_z are supplied at a flow rate ratio of H2 to C_xH_yF_z of from 4:

1 to 10;

1, and further wherein the remaining portions of the mask comprise a SiARC layer, and wherein the taper etch profile is formed in the SiARC layer.

12. A process comprising:

providing a substrate having a target layer thereon;

providing a mask above the target layer, wherein the mask comprises a patterned resist layer and an ARC layer beneath the patterned resist layer, and wherein portions of the mask beneath the resist layer are not opened such that the mask is partially patterned mask and the target layer is not exposed, wherein the patterned resist includes features each having a first dimension and a second dimension, wherein the first dimension is larger than the second dimension;

processing the partially patterned mask with a hydrocarbon gas;

etching through portions of the mask beneath the resist layer to form a patterned mask and to expose the target layer, wherein during etching through portions of the mask beneath the resist layer an etch profile is formed and at least part of the etch profile includes a tapered profile such that openings at a bottom of the patterned mask have a first mask bottom dimension and a second mask bottom dimension, wherein the first mask bottom dimension is larger than the second mask bottom dimension, and wherein at least one of;

(a) the first mask bottom dimension is smaller than the first dimension, or (b) the second mask bottom dimension is smaller than the second dimension; and

etching the target layer through the patterned mask;

wherein after etching through the target layer etched features in the target layer have a first target layer dimension and a second target layer dimension, wherein the first target layer dimension is larger than the second target layer dimension, and wherein a first shrink amount is said first dimension minus said first target layer dimension, and a second shrink amount is said second dimension minus said second target layer dimension, and further wherein a ratio of said second shrink amount to said first shrink amount is 1;

≦

1.

13. A process according to claim 12, wherein the ARC layer is a SiARC layer, wherein the tapered profile is formed in the SiARC layer, and wherein during processing of the partially patterned mask with a hydrocarbon gas, H2 and C_xH_yF_z are supplied at a flow rate ratio of H2 to C_xH_yF_z of from 4:

1 to 10;

1.

14. A method according to claim 13, wherein etching of the SiARC layer is performed in two steps at two different etch rates and two different plasma chemistries.

15. A method according to claim 14, wherein the two steps include a first step followed by a second step, and wherein a larger amount of hydrogen is fed to a process chamber in which processing is performed during one of the first and second steps than during the other of the first and second steps.

16. A method according to claim 15, wherein the mask further includes an organic layer disposed beneath the SiARC layer, and further wherein during etching through portions of the mask beneath the resist layer the organic layer is etched, and further wherein during etching of at least a portion of the organic layer an oxidative etch is performed.

17. A method according to claim 16, wherein during processing of the partially patterned mask with a hydrocarbon gas, a plasma deposition process is performed and further wherein during said plasma deposition process a direct current power is applied, and further wherein the direct current power is a negative direct current power applied to an upper electrode.

18. A process comprising:

providing a substrate having a target layer thereon;

providing a mask above the target layer, wherein the mask comprises a patterned resist layer and a SiARC layer beneath the patterned resist layer, and wherein portions of the mask beneath the resist layer are not opened such that the mask is partially patterned mask and the target layer is not exposed, wherein the patterned resist includes features each having a first dimension and a second dimension, wherein the first dimension is larger than the second dimension;

processing the partially patterned mask with a hydrocarbon gas;

etching through portions of the mask beneath the resist layer to form a patterned mask and expose the target layer, wherein during etching through portions of the mask beneath the resist layer an etch profile is formed and at least part of the etch profile includes a tapered profile such that openings at a bottom of the open mask have a first mask bottom dimension and a second mask bottom dimension wherein the first mask bottom dimension is larger than the second mask bottom dimension, and wherein at least one of;

(a) the first mask bottom dimension is smaller than the first dimension, or (b) the second mask bottom dimension is smaller than the second dimension; and

etching the target layer through the patterned mask;

wherein during processing of the partially patterned mask with a hydrocarbon gas, a plasma deposition process is performed and further wherein during said plasma deposition process a direct current power is applied to the plasma.

19. A method according to claim 18, wherein during the plasma deposition, H2 and C_xH_yF_z are supplied at a flow rate ratio of H2 to C_xH_yF_z of from 4:

1 to 10;

1; and

wherein etching of the SiARC layer is performed in two steps at two different etch rates and two different plasma chemistries.

20. A method according to claim 18, wherein the direct current power is a negative voltage direct current power applied to an upper electrode during the plasma deposition, and wherein the negative voltage direct current power is not applied during etching of the SiARC layer;

and

wherein etched features in the target layer have a first target layer dimension and a second target layer dimension, wherein the first target layer dimension is larger than the second target layer dimension, and wherein a first shrink amount is said first dimension minus said first target layer dimension, and a second shrink amount is said second dimension minus said second target layer dimension, and further wherein a ratio of said second shrink amount to said first shrink amount is 1;

≦

1; and

wherein the method further includes filling of the etched features of the target layer with a conductive metal.