APPARATUS FOR ADVANCED PACKAGING APPLICATIONS

• US 20140357089A1
• Filed: 05/29/2013
• Published: 12/04/2014
• Est. Priority Date: 05/29/2013
• Status: Active Grant

• Current Assignee: Novellus Systems Incorporated (Lam Research Corporation)
• Original Assignee: Novellus Systems Incorporated (Lam Research Corporation)
• Inventors: BUCKALEW, Bryan L., MAYER, Steven T., PONNUSWAMY, Thomas A., PORTER, David
• Granted Patent: US 9,449,808 B2
• Time in Patent Office: Days
• US Class Current: 438/745
• CPC Class Codes: C25D 5/022 using masking means
• CPC Class Codes: C25D 7/123 Semiconductors first coated with a seed layer or a conductive layer
• CPC Class Codes: C25D 7/126 for solar cells
• CPC Class Codes: G03F 7/42 Stripping or agents therefor
• CPC Class Codes: G03F 7/425 containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
• CPC Class Codes: G03F 7/426 containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides
• CPC Class Codes: H01L 21/02052 Wet cleaning only H01L21/02085 takes precedence
• CPC Class Codes: H01L 21/30604 Chemical etching
• CPC Class Codes: H01L 21/31133 by chemical means
• CPC Class Codes: H01L 21/6708 using mainly spraying means, e.g. nozzles
• CPC Class Codes: H01L 21/6838 with gripping and holding devices using a vacuum; Bernoulli devices

Abstract

The embodiments disclosed herein pertain to novel methods and apparatus for removing material from a substrate. In certain embodiments, the method and apparatus are used to remove negative photoresist, though the disclosed techniques may be implemented to remove a variety of materials. In practicing the disclosed embodiments, a stripping solution may be introduced from an inlet to an internal manifold, sometimes referred to as a cross flow manifold. The solution flows laterally through a relatively narrow cavity between the substrate and the base plate. Fluid exits the narrow cavity at an outlet, which is positioned on the other side of the substrate, opposite the inlet and internal manifold. The substrate spins while in contact with the stripping solution to achieve a more uniform flow over the face of the substrate. In some embodiments, the base plate includes protuberances which operate to increase the flow rate (and thereby increase the local Re) near the face of the substrate.

Claims

1. A method of removing material from a substrate, comprising:

(a) receiving a substrate having material for removal thereon;

(b) positioning and sealing the substrate in a substrate holder such that the material for removal is exposed;

(c) positioning the substrate holder in a removal position, thereby forming a gap defined on one side by the substrate, defined on the opposite side by a base plate, and defined around the edges by a flow distributor,

wherein the gap has a dimension between about 2-10 mm as measured in a direction perpendicular to a face of the substrate

wherein the flow distributor comprises;

(i) an internal manifold spanning between about 90-180°

around the flow distributor, wherein the internal manifold is a cavity in the flow distributor through which fluid may flow,

(ii) one or more inlets for delivering fluid from one or more fluid supply lines to the internal manifold, and

(iii) an outlet manifold spanning between about 90-180°

around the flow distributor, and positioned opposite the internal manifold;

(d) rotating the substrate in the substrate holder; and

(e) flowing stripping solution from the one or more inlets, through the internal manifold, into the gap and over the face of the substrate, and out through the outlet manifold, to thereby remove from the substrate at least some of the material for removal.

2. The method of claim 1, wherein sealing the substrate in the substrate holder forms a fluid tight seal between the substrate and the substrate holder.

3. The method of claim 1, further comprising:

positioning the substrate holder in an open position such that the substrate may be removed from the substrate holder and removing the substrate.

4. The method of claim 1, wherein the material for removal comprises photoresist material.

5. The method of claim 4, wherein the photoresist material comprises negative photoresist material.

6. The method of claim 1, wherein the stripping solution is flowed at a rate between about 20-40 LPM.

7. The method of claim 1, wherein the stripping solution comprises a DMSO- and/or TMAH-based solution.

8. The method of claim 1, wherein the substrate has features thereon, and wherein the features have a principal dimension between about 5-120 μ

m.

9. The method of claim 1, wherein the material for removal is substantially completely removed within about 4 minutes after beginning to flow the stripping solution over the face of the substrate.

10. An apparatus for removing material from a substrate, comprising:

a removal cell comprising;

(a) a substrate holder configured to hold and rotate a disc-shaped substrate in a substrate plane,

(b) a base plate positioned substantially parallel to the substrate plane such that a gap is formed between the base plate and the substrate when the substrate is present in the substrate holder, wherein the distance between the base plate and the substrate in the substrate holder is between about 2-10 mm, and

(c) a flow distributor at least partially positioned between the baseplate and substrate holder, comprising;

(i) an internal manifold spanning between about 90-180°

around the flow distributor, wherein the internal manifold is a cavity in the flow distributor through which fluid may flow,

(ii) one or more inlets for delivering fluid from a fluid supply line to the internal manifold, and

(iii) an outlet manifold spanning between about 90-180°

around the flow distributor, and positioned opposite the internal manifold.

11. The apparatus of claim 10, further comprising a plurality of fins positioned in the gap that operate to direct fluid to flow in a substantially linear flow pattern from the internal manifold to the outlet manifold.

12. The apparatus of claim 10, further comprising a rinsing element designed or configured to deliver rinsing fluid to the surface of the substrate.

13. The apparatus of claim 12, wherein the rinsing element is designed or configured to be used in the removal cell.

14. The apparatus of claim 12, wherein the rinsing element is positioned in a spin rinse drying module that is separate from the removal cell.

15. The apparatus of claim 10, wherein the substrate has a diameter of about 300 or 450 mm.

16. The apparatus of claim 10, wherein the internal manifold comprises a plurality of showerhead outlet holes designed or configured to deliver fluid to the gap.

17. The apparatus of claim 16, wherein the showerhead outlet holes are positioned between the substrate holder and the base plate, and radially outside of the peripheral edge of the substrate.

18. The apparatus of claim 10, wherein a gap between the flow distributor and the substrate holder, when engaged, is between about 0.25-8 mm.

19. The apparatus of claim 10, wherein the internal manifold comprises a plurality of angularly distinct sections.

20. The apparatus of claim 19, wherein the flow to at least one angularly distinct section of the internal manifold may be controlled independently of at least one other angularly distinct section of the internal manifold.