FEEDTHROUGH ASSEMBLY INCLUDING A CAPACITIVE FILTER ARRAY

• US 20140360748A1
• Filed: 08/22/2014
• Published: 12/11/2014
• Est. Priority Date: 09/01/2011
• Status: Abandoned Application

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Iyer, Rajesh V., Goldman, Simon E., Miltich, Thomas P.
• Application Number:
  US14/465,879
• Publication Number:
  US 20140360748A1
• Time in Patent Office: Days
• US Class Current: 174/50.53
• CPC Class Codes: A61N 1/3754 Feedthroughs
• CPC Class Codes: A61N 1/3968 Constructional arrangements, e.g. casings A61N1/375 takes precedence
• CPC Class Codes: H03H 2001/0042 Wound, ring or feed-through type capacitor
• CPC Class Codes: H03H 7/0138 Electrical filters or coupling circuits
• CPC Class Codes: H05K 13/00 Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
• CPC Class Codes: Y10T 29/43 Electric condenser making
• CPC Class Codes: Y10T 29/435 Solid dielectric type
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base
• CPC Class Codes: Y10T 29/49171 with encapsulating
• CPC Class Codes: Y10T 29/49208 by assembling plural parts

Abstract

A feedthrough assembly may include a ferrule defining a ferrule opening, a feedthrough at least partially disposed within the ferrule opening, and a capacitive filter array at least partially disposed within the ferrule opening. The feedthrough may include at least one feedthrough conductive pathway and the capacitive filter array may include at least one filter array conductive pathway. In some examples, the feedthrough assembly includes a thick film conductive paste electrically connecting the at least one feedthrough conductive pathway and the at least one filter array conductive pathway. In some examples, the capacitive feedthrough array includes a perimeter conductive contact and a capacitive filter electrically coupling the at least one filter array conductive pathway and the perimeter conductive contact. In some of these examples, the feedthrough assembly includes a thick film conductive paste electrically connecting the perimeter conductive contact and the ferrule.

Claims

1. A feedthrough assembly comprising:

a ferrule defining a ferrule opening;

a feedthrough at least partially disposed within the ferrule opening and having a perimeter wall attached to an interior wall of the ferrule to form a hermetic seal between the feedthrough and the ferrule, wherein the feedthrough includes at least one feedthrough conductive pathway;

a capacitive filter array at least partially disposed within the ferrule opening and having a perimeter wall attached to an interior wall of the ferrule, the capacitive filter array defining at least one passageway extending between an internally-facing capacitor filter array side and externally-facing capacitor filter array side, wherein the capacitive filter array includes at least one capacitor filter array conductive pathway; and

a thick film conductive paste within the at least one passageway electrically connecting the at least one feedthrough conductive pathway and the at least one capacitor filter array conductive pathway.

2. The feedthrough assembly of claim 1, wherein the thick film conductive paste comprises a silver and palladium mixture or alloy.

3. The feedthrough assembly of claim 2, wherein the thick film conductive paste further comprises glass frit.

4. The feedthrough assembly of claim 1, wherein the capacitive filter further comprises a perimeter conductive contact and a capacitive filter electrically coupling the at least one filter array conductive pathway and the perimeter conductive contact, wherein the thick film conductive paste comprises a first thick film conductive paste, and wherein the feedthrough assembly further comprises a second thick film conductive paste electrically connecting the perimeter conductive contact and the ferrule.

5. The feedthrough assembly of claim 1, wherein the at least one feedthrough conductive pathway comprises an externally-facing feedthrough conductive pad positioned on or near an externally-facing side of the feedthrough, an internally-facing feedthrough conductive pad positioned on or near an internally-facing side of the feedthrough, and a feedthrough conductive via extending between the externally-facing feedthrough conductive pad and the internally-facing feedthrough conductive pad.

6. The feedthrough assembly of claim 5, wherein the at least one filter array conductive pathway comprises an externally-facing filter conductive pad positioned on or near an externally-facing side of the capacitive filter array, an internally-facing filter conductive pad positioned on or near an internally-facing side of the capacitive filter array, and a filter conductive via extending between the externally-facing filter conductive pad and the internally-facing filter conductive pad.

7. The feedthrough assembly of claim 6, wherein the thick film conductive paste electrically connects the externally-facing filter conductive pad and the internally-facing feedthrough conductive pad.

8. The feedthrough assembly of claim 1, wherein the at least one feedthrough conductive pathway comprises an externally-facing feedthrough conductive pad positioned on or near an externally-facing side of the feedthrough, an internally-facing feedthrough conductive pad positioned on or near an internally-facing side of the feedthrough, and a feedthrough conductive via extending between the externally-facing feedthrough conductive pad and the internally-facing feedthrough conductive pad, and wherein the externally-facing end of the thick film conductive paste contacts the internally-facing feedthrough conductive pad.

9. The feedthrough assembly of claim 1, further comprising an electrically insulating material disposed between an internally-facing feedthrough side and an externally-facing filter array side.

10. The feedthrough assembly of claim 9, wherein the electrically insulating material comprises at least one of a non-conductive polyimide, an epoxy, a glass, or a high temperature cofired ceramic.

11. The feedthrough assembly of claim 1, wherein at least one of the feedthrough, the ferrule, or the capacitive filter array defines an underfill access channel.

12. A feedthrough assembly comprising:

a ferrule defining a ferrule opening;

a feedthrough at least partially disposed within the ferrule opening, wherein the feedthrough includes at least one feedthrough conductive pathway;

a capacitive filter array at least partially disposed within the ferrule opening, wherein the capacitive filter array includes at least one filter array conductive pathway, a perimeter conductive contact, and a capacitive filter electrically coupling the at least one filter array conductive pathway and the perimeter conductive contact; and

a thick film conductive paste electrically connecting the perimeter conductive contact and the ferrule.

13. The feedthrough assembly of claim 12, wherein the thick film conductive paste comprises a silver and palladium mixture or alloy.

14. The feedthrough assembly of claim 13, wherein the thick film conductive paste further comprises glass frit.

15. The feedthrough assembly of claim 12, wherein the thick film conductive paste comprises a first thick film conductive paste,

wherein the at least one feedthrough conductive pathway comprises:

an externally-facing feedthrough conductive pad positioned on or near an externally-facing side of the feedthrough,

an internally-facing feedthrough conductive pad positioned on or near an internally-facing side of the feedthrough, and

a feedthrough conductive via extending between the externally-facing feedthrough conductive pad and the internally-facing feedthrough conductive pad,

wherein the at least one filter array conductive pathway comprises;

an externally-facing filter conductive pad positioned on or near an externally-facing side of the capacitive filter array,

an internally-facing filter conductive pad positioned on or near an internally-facing side of the capacitive filter array,

and a filter conductive via extending between the externally-facing filter conductive pad and the internally-facing filter conductive pad, and

wherein the feedthrough assembly further comprises a second thick film conductive paste electrically connecting the externally-facing filter conductive pad and the internally-facing feedthrough conductive pad.

16. The feedthrough assembly of claim 12, wherein the at least one filter array conductive pathway comprises the thick film conductive paste, and wherein the thick film conductive paste extends from an externally-facing side of the capacitive filter array to an internally-facing side of the capacitive filter array.

17. The feedthrough assembly of claim 16, wherein an externally-facing end of the thick film conductive paste contacts the at least one feedthrough conductive pathway.

18. The feedthrough assembly of claim 12, further comprising an electrically insulating material disposed between an internally-facing feedthrough side and an externally-facing filter array side.

19. The feedthrough assembly of claim 18, wherein the electrically insulating material comprises at least one of a non-conductive polyimide, an epoxy, a glass, or a high temperature cofired ceramic.

20. The feedthrough assembly of claim 12, wherein at least one of the feedthrough, the ferrule, or the capacitive filter array defines an underfill access channel.