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SMARTCARD WITH COUPLING FRAME AND METHOD OF INCREASING ACTIVATION DISTANCE OF A TRANSPONDER CHIP MODULE

  • US 20140361086A1
  • Filed: 08/21/2014
  • Published: 12/11/2014
  • Est. Priority Date: 01/18/2013
  • Status: Active Grant
First Claim
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1. Smartcard (SC) comprising:

  • a metal layer (ML); and

    an opening (MO) in the metal layer for receiving a transponder chip module (TCM);

    characterized by;

    a slit (S) extending into the metal layer, from the opening to a periphery of the metal layer, whereby the metal layer comprises an open-loop coupling frame (CF) having two ends.

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