PHOTOELECTRIC CONVERSION MODULE AND OPTICAL TRANSMISSION UNIT

• US 20140361153A1
• Filed: 08/22/2014
• Published: 12/11/2014
• Est. Priority Date: 02/28/2012
• Status: Active Grant

• Current Assignee: Olympus Corporation
• Original Assignee: Olympus Corporation
• Inventors: MOTOHARA, Hiroyuki
• Granted Patent: US 9,625,664 B2
• Time in Patent Office: Days
• US Class Current: 250/227.11
• CPC Class Codes: G01J 1/0219 Electrical interface; User interface
• CPC Class Codes: G01J 1/0425 using optical fibers
• CPC Class Codes: G02B 6/4202 for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
• CPC Class Codes: G02B 6/4239 Adhesive bonding; Encapsulation with polymer material
• CPC Class Codes: G02B 6/4245 Mounting of the opto-electronic elements
• CPC Class Codes: G02B 6/4253 by embedding housing components in an adhesive or a polymer material G02B6/4212 takes precedence
• CPC Class Codes: G02B 6/4257 having a supporting carrier or a mounting substrate or a mounting plate G02B6/3648 takes precedence
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2924/15151 the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H01S 5/02234 Resin-filled housings; the housings being made of resin
• CPC Class Codes: H01S 5/02251 using optical fibres
• CPC Class Codes: H01S 5/0234 Up-side down mountings, e.g. Flip-chip, epi-side down mountings or junction down mountings
• CPC Class Codes: H01S 5/0237 by soldering
• CPC Class Codes: H01S 5/183 having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]

Abstract

A photoelectric conversion module includes: a substrate having a wiring layer and a through hole; a photoelectric conversion element having a light emitting unit or light receiving unit and mounted on the substrate such that the light emitting unit or light receiving unit faces the through hole; a protruding portion that has a hole portion communicating with the through hole, and protrudes from one of principal surfaces of one of the substrate and the photoelectric conversion element, one of the principal surfaces facing the other one of the substrate and the photoelectric conversion element; and an adhesive that is filled in a part of a region between the substrate and the photoelectric conversion element, the region being a region outside an inner peripheral surface of the hole portion, and that bonds the substrate to the photoelectric conversion element.

Claims

1. A photoelectric conversion module, comprising:

a substrate having a wiring layer and a through hole;

a photoelectric conversion element having a light emitting unit or light receiving unit and mounted on the substrate such that the light emitting unit or light receiving unit faces the through hole;

a protruding portion that has a hole portion communicating with the through hole and protrudes from one of principal surfaces of one of the substrate and the photoelectric conversion element, the one of the principal surfaces facing the other one of the substrate and the photoelectric conversion element; and

an adhesive that is filled in a part of a region between the substrate and the photoelectric conversion element, the region being a region outside an inner peripheral surface of the hole portion, in order to bond the substrate to the photoelectric conversion element, wherein

the adhesive is filled by injection along a direction towards a center of the through hole from an end portion of the substrate, and

at least a part of an upstream portion of an outer edge of the protruding portion becomes gradually wider along the direction, the upstream portion being upstream of the center of the through hole in the direction, and a part of a downstream portion of the outer edge of the protruding portion is positioned outside a mounting area of the photoelectric conversion element projected on a principal surface of the substrate, the downstream portion being downstream of the center of the through hole in the direction.

2. The photoelectric conversion module according to claim 1, wherein the protruding portion has a hollow portion for exposing a part of the mounting area.

3. The photoelectric conversion module according to claim 2, wherein the protruding portion covers, on the principal surface of the substrate, an area excluding portions respectively exposed by the hole portion and the hollow portion.

4. The photoelectric conversion module according to claim 1, wherein the protruding portion abuts against a principal surface of the other one of the substrate and the photoelectric conversion element.

5. The photoelectric conversion module according to claim 1, wherein the protruding portion is formed on the wiring layer.

6. The photoelectric conversion module according to claim 1, wherein a diameter of the hole portion is equal to a diameter of the through hole.

7. The photoelectric conversion module according to claim 1, wherein inner peripheral surfaces of the hole portion and the through hole are smoothly continuous with each other, and the hole portion and the through hole have a tapered cross section having a diameter that gradually increases towards the through hole from the hole portion.

8. The photoelectric conversion module according to claim 1, wherein the protruding portion is formed by a resist.

9. An optical transmission unit, comprising:

the photoelectric conversion module according to claim 1; and

an optical fiber with one of end faces thereof facing the light emitting unit or the light receiving unit in a three dimensional region including the through hole and extending along a central axis of the through hole.