Opto-Electronic Modules, In Particular Flash Modules, and Method For Manufacturing The Same
First Claim
1. An opto-electronic module comprisinga substrate member;
- at least one emission member mounted on said substrate;
at least one detecting member mounted on said substrate;
at least one optics member comprising at least one passive optical component;
at least one spacer member arranged between said substrate member and said optics member.
2 Assignments
0 Petitions
Accused Products
Abstract
The opto-electronic module comprises a substrate member (P); at least one emission member (E1; E2) mounted on said substrate (P); at least one detecting member (D) mounted on said substrate (P); at least one optics member (O) comprising at least one passive optical component (L); at least one spacer member (S) arranged between said substrate member (P) and said optics member (O). The opto-electronic modules can be very small and can be produced in high quality in high volumes. In particular, at least two emission members (E1, E2), e.g., two LEDs, are provided, for emitting light of variable color. This can improve illumination of a scene.
46 Citations
27 Claims
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1. An opto-electronic module comprising
a substrate member; -
at least one emission member mounted on said substrate; at least one detecting member mounted on said substrate; at least one optics member comprising at least one passive optical component; at least one spacer member arranged between said substrate member and said optics member. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 26, 27)
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21. A method for manufacturing at least one opto-electronic module, said method comprising the steps of
a) providing a substrate wafer on which a multitude of detecting members and a multitude of emission members are arranged; -
b) providing a spacer wafer; c) providing an optics wafer, said optics wafer comprising a multitude of passive optical components, in particular wherein said passive optical components are lens elements; d) preparing a wafer stack in which said spacer wafer is arranged between said substrate wafer and said optics wafer, in particular such that said detecting members and said emission members are arranged between said substrate wafer and said optics wafer. - View Dependent Claims (22, 23, 24, 25)
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Specification