SEMICONDUCTOR DEVICE
First Claim
1. A semiconductor device comprising:
- a semiconductor module comprising a fitting portion; and
a module storage case configured to accommodate a plurality of the semiconductor modules and comprising a plurality of positioning guide members configured to position the semiconductor modules at selectable distances between the plurality of semiconductor modules,wherein the fitting portion is fitted to a positioning guide member of the plurality of positioning guide members.
1 Assignment
0 Petitions
Accused Products
Abstract
A semiconductor device includes: a plurality of semiconductor modules, each of which includes a semiconductor circuit having a circuit board on which at least one or more semiconductor chips are mounted; and a module storage case that accommodates the plurality of semiconductor modules which are arranged in parallel. In the module storage case, a plurality of pairs of positioning guide members, which position and guide the semiconductor modules, are formed on opposite surfaces forming a module storage region for accommodating the semiconductor modules so as to protrude inward and to face each other, so that a distance between the plurality of semiconductor modules in a longitudinal direction can be selected. A pair of fitting concave portions, which are fitted to the pair of positioning guide members, are formed at both ends of each semiconductor module in the longitudinal direction.
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Citations
10 Claims
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1. A semiconductor device comprising:
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a semiconductor module comprising a fitting portion; and a module storage case configured to accommodate a plurality of the semiconductor modules and comprising a plurality of positioning guide members configured to position the semiconductor modules at selectable distances between the plurality of semiconductor modules, wherein the fitting portion is fitted to a positioning guide member of the plurality of positioning guide members. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A semiconductor device comprising:
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a semiconductor module comprising a fitting portion; and a module storage case accommodating the semiconductor module and comprising a plurality of positioning guide members, the semiconductor module being movably coupled with the module storage case via the fitting portion such that the semiconductor module is disposed in a first location when coupled with a first positioning guide member and is disposed in a second location different from the first location when coupled with a second positioning guide member different from the first positioning guide member. - View Dependent Claims (8, 9, 10)
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Specification