METHOD OF FABRICATING A SOLDER PARTICLE

• US 20140367375A1
• Filed: 11/25/2013
• Published: 12/18/2014
• Est. Priority Date: 06/18/2013
• Status: Abandoned Application

• Current Assignee: Electronics and Telecommunications Research Institute
• Original Assignee: Electronics and Telecommunications Research Institute
• Inventors: BAE, Hyun-cheol, EOM, Yong Sung, CHOI, KWANG-SEONG, LEE, Haksun
• Application Number:
  US14/089,442
• Publication Number:
  US 20140367375A1
• Time in Patent Office: Days
• US Class Current: 219/635
• CPC Class Codes: B23K 35/0222 for use in soldering, brazing B23K35/0205 takes precedence
• CPC Class Codes: B23K 35/0244 Powders, particles or spheres; Preforms made therefrom
• CPC Class Codes: B23K 35/3613 Polymers, e.g. resins
• CPC Class Codes: H01L 2224/111 Manufacture and pre-treatment of the bump connector preform
• CPC Class Codes: H01L 2224/1132 Screen printing, i.e. using a stencil
• CPC Class Codes: H01L 2224/13109 Indium [In] as principal constituent
• CPC Class Codes: H01L 24/11 Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0105 Tin [Sn]
• CPC Class Codes: H01L 2924/013 Alloys

Abstract

Provided is a method of fabricating a solder particle including adding a first magnetic bar in a first container including a mixture containing first solder particles formed through a mixing process, disposing the first container in a second container including a second magnetic bar, operating the first magnetic bar and the second magnetic bar, and applying heat to the first container to melt the first solder particles.

Claims

1. A method of fabricating a solder particle, the method comprising:

adding a first magnetic bar in a first container including a mixture containing first solder particles formed through a mixing process;

disposing the first container in a second container including a second magnetic bar;

operating the first magnetic bar and the second magnetic bar; and

applying heat to the first container to melt the first solder particles.

2. The method of fabricating a solder particle of claim 1, wherein the mixing process is conducted by mixing the first solder particles with a one-component polymer resin to obtain the mixture.

3. The method of fabricating a solder particle of claim 2, wherein the first solder particles are completely impregnated into the one-component polymer resin.

4. The method of fabricating a solder particle of claim 1, wherein silicon oil is included in the second container.

5. The method of fabricating a solder particle of claim 4, wherein the melting of the first solder particles is conducted by heating the silicon oil in the second container, thereby applying heat to the first container by a temperature of the silicon oil.

6. The method of fabricating a solder particle of claim 1, wherein a temperature of the mixture is maintained uniformly by the first magnetic bar and the second magnetic bar.

7. The method of fabricating a solder particle of claim 1, wherein the first solder particles are melted at from about 80°

C. to about 250°

C.

8. The method of fabricating a solder particle of claim 1, wherein the first solder particles have a diameter of from about 10 μ

m to about 1,000 μ

m.

9. The method of fabricating a solder particle of claim 2, wherein the one-component polymer resin comprises an epoxy resin or oil.

10. The method of fabricating a solder particle of claim 9, wherein the epoxy resin includes diglycidyl ether of bisphenol-A (DGEBA), tetraglycidyl-4,4-diaminodiphenylmethane (TGDDM), diglycidyl ether of para-aminophenol (TriGDDM), or Isocyanate group, or a Bismaleimide resin.

11. The method of fabricating a solder particle of claim 9, wherein the oil is epoxy modified silicone oil, amine modified silicone oil, carboxyl modified silicone oil, or a polyol resin.

12. The method of fabricating a solder particle of claim 2, wherein the first solder particles are mixed by from about 1 to about 60 parts by volume with respect to 100 parts by volume of the one-component polymer resin in the mixture.

13. The method of fabricating a solder particle of claim 1, wherein the first container has a round edge portion.

14. The method of fabricating a solder particle of claim 1, further comprising after melting the first solder particles:

conducting an ultrasonic wave process for forming second solder particles by applying ultrasonic wave to the mixture while operating the first magnetic bar and the second magnetic bar; and

conducting a cooling process for cooling the mixture including the second solder particles while operating the first magnetic bar and the second magnetic bar after conducting the ultrasonic wave process.

15. The method of fabricating a solder particle of claim 14, wherein the second solder particles has a diameter of from about 0.1 μ

m to less than about 10 μ

m.