CHARGED PARTICLE BEAM SYSTEM AND METHOD OF OPERATING THEREOF
First Claim
1. A charged particle beam device, comprising:
- a charged particle beam source for emitting a charged particle beam;
a switchable multi-aperture for generating two or more beam bundles from the charged particle beam, wherein the switchable multi-aperture comprises;
two or more aperture openings, wherein each of the two or more aperture openings is provided for generating a corresponding beam bundle of the two or more beam bundles;
a beam blanker arrangement configured for individually blanking the two or more beam bundles; and
a stopping aperture for blocking beam bundles, which are blanked off by the beam blanker arrangement;
a control unit electrically connected to the beam blanker arrangement and configured to control the individual blanking of the two or more beam bundles for switching of the switchable multi-aperture; and
an objective lens configured for focusing the two or more beam bundles on a specimen or wafer, wherein the two or more beam bundles are tilted with respect to the specimen or wafer depending on the position of each of the two or more beam bundles relative to an optical axis defined by the objective lens, and wherein the objective lens is configured for focusing the charged particle beam source, a virtual source provided by the charged particle beam source or a crossover.
1 Assignment
0 Petitions
Accused Products
Abstract
A charged particle beam device is described. In one aspect, the charged particle beam device includes a charged particle beam source, and a switchable multi-aperture for generating two or more beam bundles from a charged particle beam which includes: two or more aperture openings, wherein each of the two or more aperture openings is provided for generating a corresponding beam bundle of the two or more beam bundles; a beam blanker arrangement configured for individually blanking the two or more beam bundles; and a stopping aperture for blocking beam bundles. The device further includes a control unit configured to control the individual blanking of the two or more beam bundles for switching of the switchable multi-aperture and an objective lens configured for focusing the two or more beam bundles on a specimen or wafer.
-
Citations
19 Claims
-
1. A charged particle beam device, comprising:
-
a charged particle beam source for emitting a charged particle beam; a switchable multi-aperture for generating two or more beam bundles from the charged particle beam, wherein the switchable multi-aperture comprises; two or more aperture openings, wherein each of the two or more aperture openings is provided for generating a corresponding beam bundle of the two or more beam bundles; a beam blanker arrangement configured for individually blanking the two or more beam bundles; and a stopping aperture for blocking beam bundles, which are blanked off by the beam blanker arrangement; a control unit electrically connected to the beam blanker arrangement and configured to control the individual blanking of the two or more beam bundles for switching of the switchable multi-aperture; and an objective lens configured for focusing the two or more beam bundles on a specimen or wafer, wherein the two or more beam bundles are tilted with respect to the specimen or wafer depending on the position of each of the two or more beam bundles relative to an optical axis defined by the objective lens, and wherein the objective lens is configured for focusing the charged particle beam source, a virtual source provided by the charged particle beam source or a crossover. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
-
-
17. A method of generating a 3D image of a specimen or wafer, comprising:
-
imaging the specimen or wafer with a first group of beam bundles, wherein the first group of beam bundles includes one or more beam bundles; switching from the first group of beam bundles to a second group of beam bundles with a switchable multi-aperture, wherein the second group of beam bundles can include one or more beam bundles, and wherein at least one beam bundle differs in the second group of beam bundles as compared to the first group of beam bundles; and imaging the specimen or wafer with the second group of beam bundles, wherein the one or more beam bundles are tilted with respect to the specimen or wafer depending on the position of each of the one or more beam bundles relative to an optical axis defined by an objective lens. - View Dependent Claims (18, 19)
-
Specification