Compact Broadband Antenna

• US 20140368407A1
• Filed: 09/03/2014
• Published: 12/18/2014
• Est. Priority Date: 01/03/2011
• Status: Abandoned Application

• Current Assignee: Galtronics Corporation Limited (Baylin Technologies (USA), Inc.)
• Original Assignee: Galtronics Corporation Limited (Baylin Technologies (USA), Inc.)
• Inventors: Azulay, Snir, Krupa, Steve
• Application Number:
  US14/475,793
• Publication Number:
  US 20140368407A1
• Time in Patent Office: Days
• US Class Current: 343/905
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 5/307 Individual or coupled radiating elements, each element being fed in an unspecified way
• CPC Class Codes: H01Q 5/335 at the feed, e.g. for impedance matching
• CPC Class Codes: H01Q 5/364 Creating multiple current paths
• CPC Class Codes: H01Q 9/045 with particular feeding means for circular polarisation H01Q9/0428
• CPC Class Codes: H01Q 9/0457 electromagnetically coupled to the feed line
• CPC Class Codes: H01Q 9/42 with folded element, the folded parts being spaced apart a small fraction of the operating wavelength

Abstract

An antenna including a substrate formed of a non-conductive material, a ground plane disposed on the substrate, a wideband element for coupling having one end connected to an edge of the ground plane and an elongate feed arm feeding the wideband element for coupling and having a maximum width of 1/100 of a predetermined wavelength, the predetermined wavelength being defined by formula (I) wherein λ_p is the predetermined wavelength, f is a lowest operating frequency of the wideband element for coupling, p is a permeability of the substrate, is a relative bulk permittivity of the substrate, W is a width of a conductive trace disposed above the substrate and H is a thickness of the substrate, wherein formula (II).

Claims

1-16. -16. (canceled)

17. A wireless communication device comprising:

a non-conductive substrate;

a ground plane located on the non-conductive substrate;

an element for coupling located in proximity to and offset from an edge of the ground plane with a gap therebetween;

wherein the gap has a maximum width less than 1/80 of a predetermined wavelength λ

, the wavelength λ

being associated with an operating frequency of the element for coupling.

18. The wireless communication device of claim 17, wherein the predetermined wavelength λ

is defined by an equation

19. The wireless communication device of claim 18, wherein D is further defined by an equation

20. The wireless communication device of claim 17, wherein an elongate feed arm is disposed in proximity to and offset from the element for coupling along the gap.

21. The wireless communication device of claim 20, wherein a substantial portion of the feed arm is less than 2.3 mm wide.

22. The wireless communication device of claim 20, wherein a substantial portion of the feed arm is less than approximately 1/100 of predetermined wavelength λ

.

23. The wireless communication device of claim 17, wherein at least a portion of the gap is free from conductive material.

24. The wireless communication device of claim 20, wherein the feed arm is not galvanically connected to the ground plane.

25. The wireless communication device of claim 20, wherein the feed arm is galvanically connected to the ground plane.

26. The wireless communication device of claim 17, wherein at least a portion of the element for coupling is generally parallel to the edge of the ground plane.

27. The wireless communication device of claim 20, wherein at least a portion of the elongate feed arm is generally parallel to an edge of the gap.

28. The wireless communication device of claim 20, wherein the feed arm is located on a first surface of the substrate and the ground plane is located on a second surface of the substrate opposite the first surface.

29. The wireless communication device of claim 20, wherein the feed arm is located on a same surface of the substrate as the ground plane.

30. The wireless communication device of claim 20, wherein the feed arm is disposed in a plane offset from the ground plane.

31. The wireless communication device of claim 17, wherein the element for coupling is a low band element, and wherein the wireless communication device further comprises a high-band element positioned at an edge of the substrate.

32. The wireless communication device of claim 17, wherein the element for coupling is configured activate the ground plane to radiate at at least one frequency in a range of 700 to 960 MHz.

33. The wireless communication device of claim 20, wherein the feed arm is configured to cause the element for coupling to radiate without touching the element for coupling.

34. The wireless communication device of claim 20, wherein the feed arm is configured to both capacitively couple and inductively couple to at least one of the element for coupling and the ground plane.

35. The wireless communication device of claim 17, wherein the element for coupling includes a first portion and a second portion, and wherein the second portion is folded relative to the first portion.

36. The wireless communication device of claim 29, wherein the edge of the ground plane, a portion of the element for coupling, and the feed arm are configured to function as a coupled transmission line when supplied with a radiofrequency signal.