LED LIGHT AND FILAMENT THEREOF

• US 20140369036A1
• Filed: 09/30/2013
• Published: 12/18/2014
• Est. Priority Date: 06/17/2013
• Status: Abandoned Application

• Current Assignee: Shenzhen Runlite Technology Co. Ltd. (Fujian FURI Electronics Company Limited)
• Original Assignee: Shenzhen Runlite Technology Co. Ltd. (Fujian FURI Electronics Company Limited)
• Inventors: FENG, Yunlong
• Application Number:
  US14/040,753
• Publication Number:
  US 20140369036A1
• Time in Patent Office: Days
• US Class Current: 362/223
• CPC Class Codes: F21K 9/23 Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• CPC Class Codes: F21Y 2103/10 comprising a linear array of point-like light-generating elements
• CPC Class Codes: F21Y 2107/90 on two opposite sides of supports or substrates
• CPC Class Codes: F21Y 2113/13 comprising an assembly of point-like light sources
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/0756 Stacked arrangements of devices
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The invention discloses a LED lamp and filament thereof. The LED filament includes a substrate, a light emitting unit secured onto at least one side surface of the substrate, and a package adhesive layer surrounded on the periphery of the light emitting unit; the substrate is configured to be of an elongated bar construction; the light emitting unit comprises a plurality of blue light chips and red light chips regularly distributed on the substrate and sequentially connected to one another in series. For the LED filament of the invention, as the light emitting unit composed of blue and red light chips is disposed on the substrate, the LED filament has high color rendering and large light radiation angle.

Claims

1. A LED filament comprising a substrate, a light emitting unit secured onto at least one side surface of the substrate, and a package adhesive layer surrounded on the periphery of the light emitting unit;

the substrate being configured to be of an elongated bar construction;

the light emitting unit comprising a plurality of blue light chips and red light chips regularly distributed on the substrate and sequentially connected to one another in series.

2. The LED filament as recited in claim 1, wherein one red light chip is disposed between at least every two said blue light chips.

3. The LED filament as recited in claim 1, wherein the substrate is 5.00 mm-200.00 mm long, 0.50-10.00 mm wide, and 0.10 mm-5.00 mm high.

4. The LED filament as recited in claim 1, wherein two side surfaces of the substrate are provided with the light emitting unit.

5. The LED filament as recited in claim 1, wherein the package adhesive layer is circular in cross section and has a diameter of 1.00 mm-10.00 mm.

6. The LED filament as recited in claim 1, wherein the package adhesive layer is made of transparent colloid material mixed with fluorescent powder.

7. The LED filament as recited in claim 1, wherein the substrate is configured to be transparent.

8. The LED filament as recited in claim 1, wherein the package adhesive layer is formed by molding process.

9. The LED filament as recited in claim 1, wherein the blue and red light chips are connected to one another in series by a metal conductive cable, and the two ends of the substrates are provided with electrode pins connected respectively to the two ends of the metal conductive cable.

10. A LED lamp comprising a LED filament, the LED filament comprising a substrate, a light emitting unit secured onto at least one side surface of the substrate, and a package adhesive layer surrounded on the periphery of the light emitting unit;

the substrate being configured to be of an elongated bar construction;

the light emitting unit comprising a plurality of blue light chips and red light chips regularly distributed on the substrate and sequentially connected to one another in series.

11. The LED lamp as recited in claim 10, wherein one red light chip is disposed between at least every two said blue light chips.

12. The LED lamp as recited in claim 10, wherein the substrate is 5.00 mm-200.00 mm long, 0.50-10.00 mm wide, and 0.10 mm-5.00 mm high.

13. The LED lamp as recited in claim 10, wherein two side surfaces of the substrate are provided with the light emitting unit.

14. The LED lamp as recited in claim 10, wherein the package adhesive layer is circular in cross section and has a diameter of 1.00 mm-10.00 mm.

15. The LED lamp as recited in claim 10, wherein the package adhesive layer is made of transparent colloid material mixed with fluorescent powder.

16. The LED lamp as recited in claim 10, wherein the substrate is configured to be transparent.

17. The LED lamp as recited in claim 10, wherein the package adhesive layer is formed by molding process.

18. The LED filament as recited in claim 10, wherein the blue and red light chips are connected to one another in series by a metal conductive cable, and the two ends of the substrates are provided with electrode pins connected respectively to the two ends of the metal conductive cable.