PHOTOELECTRIC MIXED SUBSTRATE AND OPTICAL MODULE

• US 20140369642A1
• Filed: 06/05/2014
• Published: 12/18/2014
• Est. Priority Date: 06/12/2013
• Status: Active Grant

• Current Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Original Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Inventors: Yanagisawa, Kenji
• Granted Patent: US 9,014,520 B2
• Time in Patent Office: Days
• US Class Current: 385/14
• CPC Class Codes: G02B 6/12002 Three-dimensional structures
• CPC Class Codes: G02B 6/4214 the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device G02B6/4246 takes precedence
• CPC Class Codes: G02B 6/43 Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections

Abstract

A photoelectric mixed substrate includes a wiring substrate including a first ground wire, a signal wire arranged above the first ground wire and electrically connected to the photoelectric component and the electronic component, and a waveguide unit stacked on the wiring substrate to cover the signal wire. The waveguide unit includes a first clad layer formed on the wiring substrate, a second ground wire formed above the first clad layer, a core formed on the first clad layer and optically coupled to the photoelectric component, and a second clad layer formed on the first clad layer to cover the core.

Claims

1. A photoelectric mixed substrate on which a photoelectric component and an electronic component are mounted, the photoelectric mixed substrate comprising:

a wiring substrate including a first ground wire;

a signal wire arranged above the first ground wire, wherein the signal wire electrically connects the photoelectric component and the electronic component; and

a waveguide unit stacked on the wiring substrate, wherein the waveguide unit covers the signal wire, and the waveguide unit includes

a first clad layer formed on the wiring substrate,

a second ground wire formed above the first clad layer,

a core formed on the first clad layer and optically coupled to the photoelectric component, and

a second clad layer formed on the first clad layer, wherein the second clad layer covers the core.

2. The photoelectric mixed substrate according to claim 1, wherein

the signal wire is one of a plurality of signal wires arranged in parallel, and

the plurality of signal wires is sandwiched in a stacking direction between the first ground wire and the second ground wire.

3. The photoelectric mixed substrate according to claim 1, wherein

the wiring substrate includes an insulation layer that covers the first ground wire,

the signal wire is formed on the insulation layer,

the first clad layer covers the signal wire, and

the second ground wire is formed on the first clad layer.

4. The photoelectric mixed substrate according to claim 1, wherein

the first clad layer covers the first ground wire,

the signal wire is formed on the first clad layer, and

the second ground wire is formed on the second clad layer or the core.

5. An optical module comprising:

a photoelectric component;

an electronic component; and

a photoelectric mixed substrate on which the photoelectric component and the electronic component are mounted, wherein the photoelectric mixed substrate includes

a wiring substrate including a first ground wire,

a signal wire arranged above the first ground wire, wherein the signal wire electrically connects the photoelectric component and the electronic component, and

a waveguide unit stacked on the wiring substrate, wherein the waveguide unit covers the signal wire, and the waveguide unit includes

a first clad layer formed on the wiring substrate,

a second ground wire formed above the first clad layer,

a core formed on the first clad layer and optically coupled to the photoelectric component, and

a second clad layer formed on the first clad layer, wherein the second clad layer covers the core.