MEMS STRUCTURE WITH IMPROVED SHIELDING AND METHOD
First Claim
1. A method for fabricating an integrated MEMS-CMOS device comprising:
- providing a substrate member having a surface region;
forming a CMOS IC layer overlying the surface region, the CMOS IC layer having at least one CMOS device;
forming a bottom isolation layer overlying the CMOS IC layer;
forming a shielding layer overlying a portion of the bottom isolation layer;
forming a top isolation layer overlying a portion of the bottom isolation layer, wherein the bottom isolation layer comprises an isolation region between the top isolation layer and the shielding layer;
forming a MEMS layer overlying the top isolation layer, the shielding layer, and the bottom isolation layer; and
etching the MEMS layer to form at least one MEMS structure having at least one movable structure and at least one anchored structure, wherein the at least one anchored structure is coupled to a portion of the top isolation layer, wherein the at least one movable structure is formed overlying the shielding layer.
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Abstract
A method for fabricating an integrated MEMS-CMOS device. The method can include providing a substrate member having a surface region and forming a CMOS IC layer having at least one CMOS device overlying the surface region. A bottom isolation layer can be formed overlying the CMOS IC layer and a shielding layer and a top isolation layer can be formed overlying a portion of bottom isolation layer. The bottom isolation layer can include an isolation region between the top isolation layer and the shielding layer. A MEMS layer overlying the top isolation layer, the shielding layer, and the bottom isolation layer, and can be etched to form at least one MEMS structure having at least one movable structure and at least one anchored structure.
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Citations
20 Claims
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1. A method for fabricating an integrated MEMS-CMOS device comprising:
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providing a substrate member having a surface region; forming a CMOS IC layer overlying the surface region, the CMOS IC layer having at least one CMOS device; forming a bottom isolation layer overlying the CMOS IC layer; forming a shielding layer overlying a portion of the bottom isolation layer; forming a top isolation layer overlying a portion of the bottom isolation layer, wherein the bottom isolation layer comprises an isolation region between the top isolation layer and the shielding layer; forming a MEMS layer overlying the top isolation layer, the shielding layer, and the bottom isolation layer; and etching the MEMS layer to form at least one MEMS structure having at least one movable structure and at least one anchored structure, wherein the at least one anchored structure is coupled to a portion of the top isolation layer, wherein the at least one movable structure is formed overlying the shielding layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method for fabricating an integrated MEMS-CMOS device comprising:
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providing a substrate member having a surface region; forming a CMOS IC layer overlying the surface region, the CMOS IC layer having at least one CMOS device; forming a bottom isolation layer overlying the CMOS IC layer; forming a shielding layer overlying a portion of the bottom isolation layer; forming a top isolation layer overlying a portion of the bottom isolation layer, wherein the bottom isolation layer comprises an isolation region between the top isolation layer and the shielding layer, the isolation region being an exposed portion of the bottom isolation layer free from contact with the top isolation layer and the shielding layer; forming a MEMS layer overlying the top isolation layer, the shielding layer, and the bottom isolation layer; and etching the MEMS layer to form at least one MEMS structure having at least one movable structure and at least one anchored structure, wherein the at least one anchored structure is coupled to a portion of the top isolation layer, wherein the at least one movable structure is formed overlying the shielding layer. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. A method for fabricating a MEMS device comprising:
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forming a shielding structure overlying a substrate, the forming of the shielding structure comprising; forming a bottom isolation layer overlying the substrate; forming a shielding layer overlying the bottom isolation layer; and forming a top isolation layer the bottom isolation layer, wherein the bottom isolation layer comprises an isolation region between the top isolation layer and the shielding layer; and forming a MEMS structure overlying the shielding structure, the forming of the MEMS structure comprising; forming a MEMS layer overlying the top isolation layer, the shielding layer, and the bottom isolation layer; and etching the MEMS layer to form at least one MEMS structure having at least one movable structure and at least one anchored structure, wherein the at least one anchored structure is coupled to a portion of the top isolation layer, wherein the at least one movable structure is formed overlying the shielding layer. - View Dependent Claims (18, 19, 20)
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Specification