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SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

  • US 20140374900A1
  • Filed: 04/01/2014
  • Published: 12/25/2014
  • Est. Priority Date: 06/21/2013
  • Status: Abandoned Application
First Claim
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1. A semiconductor package, comprising:

  • a package substrate;

    a first semiconductor chip on the package substrate; and

    at least one second semiconductor chip on the first semiconductor chip and including bumps,wherein the bumps comprise memory I/O bumps and power/ground voltage bumps, and wherein the memory I/O bumps are adjacent to a center of the first semiconductor chip.

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