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COMPONENT IN THE FORM OF A WAFER LEVEL PACKAGE AND METHOD FOR MANUFACTURING SAME

  • US 20140374917A1
  • Filed: 06/17/2014
  • Published: 12/25/2014
  • Est. Priority Date: 06/20/2013
  • Status: Active Grant
First Claim
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1. A component in the form of a wafer level package, comprising:

  • at least two element substrates assembled one above the other;

    a molded upper sealing layer of an electrically insulating casting compound; and

    at least one contact stamp via which an external electrical contacting of the component on the top side of the component is implement, the at least one contact stamp being embedded in the molded upper sealing layer such that (i) a lower end of the at least one contact stamp is connected to a wiring level of one of the element substrates and (ii) an upper end of the at least one contact stamp is exposed on the surface of the sealing layer.

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