ASIC ELEMENT INCLUDING A VIA
First Claim
Patent Images
1. An ASIC element, comprising:
- an active front side in which circuit functions are implemented; and
at least one via which establishes an electrical connection between the active front side and a rear side of the ASIC element;
wherein the front side of the via is defined by at least one front-side trench which is completely filled, and wherein the rear side of the via is defined by at least one rear-side trench which is not completely filled, the rear-side trench opening into the filled front-side trench.
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Abstract
In an ASIC element, vias are integrated into the CMOS processing of an ASIC substrate. The ASIC element includes an active front side in which the circuit functions are implemented. The at least one via is intended to establish an electrical connection between the active front side and the rear side of the element. The front side of the via is defined by at least one front-side trench which is completely filled, and the rear side is defined by at least one rear-side trench which is not completely filled. The rear-side trench opens into the filled front-side trench.
19 Citations
7 Claims
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1. An ASIC element, comprising:
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an active front side in which circuit functions are implemented; and at least one via which establishes an electrical connection between the active front side and a rear side of the ASIC element; wherein the front side of the via is defined by at least one front-side trench which is completely filled, and wherein the rear side of the via is defined by at least one rear-side trench which is not completely filled, the rear-side trench opening into the filled front-side trench. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A vertically integrated hybrid component, comprising:
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at least one ASIC element including; an active front side in which circuit functions are implemented; and at least one via which establishes an electrical connection between the active front side and a rear side of the ASIC element; wherein the front side of the via is defined by at least one front-side trench which is completely filled, and wherein the rear side of the via is defined by at least one rear-side trench which is not completely filled, the rear-side trench opening into the filled front-side trench; and at least one additional element, wherein the rear side of the ASIC element is installed on the additional element such that the rear-side trench of the at least one via is sealed and a conductive connection exists between the at least one via and the at least one additional element.
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Specification