ELECTROSTATIC CHUCK DEVICE

• US 20140376148A1
• Filed: 02/06/2013
• Published: 12/25/2014
• Est. Priority Date: 02/08/2012
• Status: Active Grant

• Current Assignee: Sumitomo Osaka Cement Company Limited, Tokyo Electron Limited
• Original Assignee: Sumitomo Osaka Cement Company Limited, Tokyo Electron Limited
• Inventors: Sasaki, Yasuharu, Kosakai, Mamoru, Maeta, Shinichi, Miura, Yukio, Sato, Takashi, Furuuchi, Kei, Oohashi, Kaoru, Takahashi, Tomoyuki, Aoto, Tadashi
• Granted Patent: US 9,412,635 B2
• Time in Patent Office: Days
• US Class Current: 361/234
• CPC Class Codes: B23Q 3/15 Devices for holding work using magnetic or electric force acting directly on the work
• CPC Class Codes: H01L 21/67109 mainly by convection
• CPC Class Codes: H01L 21/6831 using electrostatic chucks
• CPC Class Codes: H01L 21/6833 Details of electrostatic chucks

Abstract

An electrostatic chuck device includes an electrostatic chuck part that has an upper surface as a placement surface for placing a plate-shaped sample and has an internal electrode for electrostatic attraction built therein; and a cooling base part that cools the electrostatic chuck part. The electrostatic chuck part and the cooling base part are integrally adhered to each other via an adhesive layer. An insulator having a double pipe structure including an insulator and an insulator provided coaxially with an outer peripheral portion of the insulator is provided in a cooling gas hole, formed in the electrostatic chuck part and the cooling base part, so as to cover an exposed surface of the adhesive layer on the cooling gas hole side.

Claims

1. An electrostatic chuck device comprising:

an electrostatic chuck part that has a placement surface for placing a plate-shaped sample and has an internal electrode for electrostatic attraction built therein; and

a cooling base part that cools the electrostatic chuck part,

wherein the electrostatic chuck part and the cooling base part are integrally adhered to each other via a first adhesive layer,

wherein the electrostatic chuck part and the cooling base part are formed with a cooling gas hole passing through the electrostatic chuck part and the cooling base part and/or a pin-inserting hole allowing a pin for attaching/detaching the plate-shaped sample to be inserted thereinto, and

wherein an insulator having a double pipe structure including a first insulator and a second insulator provided coaxially with an outer peripheral portion of the first insulator is provided in any one or both of the cooling gas hole and the pin-inserting hole so as to cover at least an exposed surface of the first adhesive layer.

2. The electrostatic chuck device according to claim 1,

wherein an upper end portion of the first insulator is adhered to the electrostatic chuck part via a thin second adhesive layer.

3. The electrostatic chuck device according to claim 1 or 2,

wherein an upper end portion of the second insulator is located below an upper end portion of the first insulator and is covered with the first adhesive layer.

4. The electrostatic chuck device according to any one of claims 1 to 3,

wherein the first adhesive layer is formed by curing a thermosetting adhesive.

5. The electrostatic chuck device according to any one of claims 1 to 4,

wherein the first insulator is pressed against the electrostatic chuck part via the second adhesive layer by a stress caused by a thermal expansion difference between the cooling base part and the first adhesive layer.