Please download the dossier by clicking on the dossier button x
×

PACKAGE MOUNTING STRUCTURE

  • US 20140376187A1
  • Filed: 05/05/2014
  • Published: 12/25/2014
  • Est. Priority Date: 06/19/2013
  • Status: Active Grant
First Claim
Patent Images

1. A package mounting structure comprising:

  • a first substrate having wiring;

    a second substrate having wiring;

    at least one cooling unit having a first face and a second face different from the first face;

    at least one power supply unit that is mounted on the first substrate and is joined to the first face of the cooling unit; and

    at least one electronic component that is mounted on the second substrate and is joined to the second face of the cooling unit, whereinthe power supply unit supplies power to the electronic component through the wiring of the first substrate, the cooling unit, and the wiring of the second substrate.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×