PACKAGE MOUNTING STRUCTURE

• US 20140376187A1
• Filed: 05/05/2014
• Published: 12/25/2014
• Est. Priority Date: 06/19/2013
• Status: Active Grant

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Baba, Shunji, Koide, Masateru, Watanabe, Manabu, Kanda, Takashi, Fukuzono, Kenji, Suwada, Makoto, Hoshino, Yuki
• Granted Patent: US 9,515,005 B2
• Time in Patent Office: Days
• US Class Current: 361/699
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/021 Components thermally connected to metal substrates or heat-sinks by insert mounting
• CPC Class Codes: H05K 1/181 associated with surface mounted components

Abstract

A package mounting structure includes: a first substrate having wiring; a second substrate having wiring; at least one cooling unit having a first face and a second face different from the first face; at least one power supply unit that is mounted on the first substrate and is joined to the first face of the cooling unit; and at least one electronic component that is mounted on the second substrate and is joined to the second face of the cooling unit, wherein the power supply unit supplies power to the electronic component through the wiring of the first substrate, the cooling unit, and the wiring of the second substrate.

Claims

1. A package mounting structure comprising:

a first substrate having wiring;

a second substrate having wiring;

at least one cooling unit having a first face and a second face different from the first face;

at least one power supply unit that is mounted on the first substrate and is joined to the first face of the cooling unit; and

at least one electronic component that is mounted on the second substrate and is joined to the second face of the cooling unit, wherein

the power supply unit supplies power to the electronic component through the wiring of the first substrate, the cooling unit, and the wiring of the second substrate.

2. The package mounting structure according to claim 1, wherein

a plurality of the power supply units are provided,

the cooling unit has at least one flow path through which a refrigerant flows and a side wall which surrounds the flow path,

the side wall of the cooling unit is electrically divided by an insulating portion to form a plurality of power paths in the cooling unit, and

the plurality of the power supply units supply power to the electronic component through a plurality of power supply channels including the wiring of the first substrate, the plurality of the power paths, and the wiring of the second substrate.

3. The package mounting structure according to claim 1, wherein

a plurality of the cooling units and a plurality of the power supply units are provided, and

the plurality of the power supply units supply power to the electronic component through a plurality of power supply channels including the wiring of the first substrate, the plurality of the cooling units, and the wiring of the second substrate.

4. The package mounting structure according to claim 1, wherein

a plurality of the power supply units and a plurality of the cooling units are provided,

each of the plurality of the cooling units has a flow path through which a refrigerant flows and a side wall which surrounds the flow path,

the side walls of the plurality of the cooling units are electrically divided by an insulating portion to form a plurality of power paths in the plurality of the cooling units, and

the plurality of the power supply units supply power to the electronic component, through a plurality of power supply channels including the wiring of the first substrate, the plurality of the power paths in the plurality of the cooling units, and the wiring of the second substrate.

5. The package mounting structure according to claim 2,

wherein plural types of the electronic components are provided.

6. The package mounting structure according to claim 2,

wherein the cooling unit has a plurality of the flow paths.