HYBRID INSULATION SHEET AND ELECTRONIC APPARATUS USING THE SAME

• US 20140376191A1
• Filed: 08/14/2014
• Published: 12/25/2014
• Est. Priority Date: 06/19/2013
• Status: Active Grant

• Current Assignee: Amogreentech Co., Ltd.
• Original Assignee: Amogreentech Co., Ltd.
• Inventors: HWANG, Seung Jae
• Granted Patent: US 9,374,932 B2
• Time in Patent Office: Days
• US Class Current: 361/720
• CPC Class Codes: B32B 15/08 of synthetic resin
• CPC Class Codes: B32B 15/14 next to a fibrous or filamentary layer
• CPC Class Codes: B32B 15/20 comprising aluminium or copper B32B15/016 and B32B15/017 take precedence
• CPC Class Codes: B32B 2255/02 on fibrous or filamentary layer
• CPC Class Codes: B32B 2255/102 synthetic resin or rubber layer being a foamed layer
• CPC Class Codes: B32B 2255/205 Metallic coating
• CPC Class Codes: B32B 2255/28 Multiple coating on one surface
• CPC Class Codes: B32B 2262/02 Synthetic macromolecular fibres
• CPC Class Codes: B32B 2264/10 Inorganic particles
• CPC Class Codes: B32B 2264/107 Ceramic
• CPC Class Codes: B32B 2307/202 Conductive
• CPC Class Codes: B32B 2307/30 having particular thermal properties
• CPC Class Codes: B32B 2307/302 Conductive
• CPC Class Codes: B32B 2307/304 Insulating
• CPC Class Codes: B32B 2307/402 Coloured
• CPC Class Codes: B32B 2457/00 Electrical equipment
• CPC Class Codes: B32B 2457/08 PCBs, i.e. printed circuit boards
• CPC Class Codes: B32B 2509/00 Household appliances
• CPC Class Codes: B32B 27/12 next to a fibrous or filamentary layer
• CPC Class Codes: B32B 27/286 comprising polysulphones; polysulfides
• CPC Class Codes: B32B 27/36 : comprising polyesters
• CPC Class Codes: B32B 5/022 : Non-woven fabric
• CPC Class Codes: B32B 5/26 : another layer next to it also being fibrous or filamentary relative arrangement of fibres or filaments of different layers B32B5/12
• CPC Class Codes: B32B 7/027 : Thermal properties
• CPC Class Codes: B32B 7/06 : permitting easy separation
• CPC Class Codes: B32B 7/12 : using interposed adhesives or interposed materials with bonding properties
• CPC Class Codes: B32B 9/007 : comprising carbon, e.g. graphite, composite carbon
• CPC Class Codes: B32B 9/047 : made of fibres or filaments
• CPC Class Codes: F28F 13/003 : by using permeable mass, perforated or porous materials F28F13/18 takes precedence
• CPC Class Codes: F28F 13/18 : by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
• CPC Class Codes: F28F 21/02 : of carbon, e.g. graphite
• CPC Class Codes: F28F 2270/00 : Thermal insulation; Thermal decoupling
• CPC Class Codes: H01L 23/36 : Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/3733 : having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures H01L23/3732, H01L23/3737 take precedence
• CPC Class Codes: H01L 23/3737 : Organic materials with or without a thermoconductive filler
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H04M 1/0202 : Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets constructional features of telephone transmitters or receivers, e.g. of speakers or microphones H04M1/03
• CPC Class Codes: H04M 1/026 : Details of the structure or mounting of specific components
• CPC Class Codes: H05K 1/028 : Bending or folding regions of flexible printed circuits H05K1/0283 takes precedence
• CPC Class Codes: H05K 7/2039 : characterised by the heat transfer by conduction from the heat generating element to a dissipating body arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00

Abstract

Provided are an insulation sheet and an electronic apparatus using the same. The insulation sheet includes: a radiating layer that spreads and radiates heat generated from a heat generating component of an electronic apparatus; and an insulating layer that suppresses the heat saturated in the radiating layer from being delivered to the outside of the electronic apparatus.

Claims

1. A hybrid insulation sheet comprising:

a radiating layer that spreads and radiates heat generated from a heat generating component of an electronic apparatus; and

an insulating layer that suppresses the heat saturated in the radiating layer from being delivered to the outside of the electronic apparatus.

2. The hybrid insulation sheet according to claim 1, wherein the radiating layer comprises a plate-like member having a conductivity of at least 200 W/mk.

3. The hybrid insulation sheet according to claim 1, wherein the insulating layer comprises a porous substrate having a large number of fine pores that form air pockets capable of trapping air.

4. The hybrid insulation sheet according to claim 3, wherein the fine pores are less than 5 μ

m in size.

5. The hybrid insulation sheet according to claim 3, wherein the porous substrate is formed of one selected from a nano-fiber web, a non-woven fabric, and a laminate structure of these nano-fiber web and non-woven fabric, having a number of pores that are formed by accumulating nano-fibers.

6. The hybrid insulation sheet according to claim 5, wherein the nano-fiber web comprises one selected from the group consisting of oligomer polyurethane, polymer polyurethane, PS (polystylene), PVA (polyvinylalchol), PMMA (polymethyl methacrylate), PLA (polylacticacid), PEO (polyethyleneoxide), PVAc (polyvinylacetate), PAA (polyacrylic acid), PCL (polycaprolactone), PAN (polyacrylonitrile), PMMA (polymethyl methacrylate), PVP (polyvinylpyrrolidone), PVC (polyvinylchloride), nylon, PC (polycarbonate), PEI (polyetherimide), PVdF (polyvinylidene fluoride), PEI (polyetherimide), PES (polyesthersulphone) or a mixture thereof.

7. The hybrid insulation sheet according to claim 1, wherein the radiating layer comprises a thin film member formed of one selected from Cu, Al, Ni, Ag, and graphite.

8. The hybrid insulation sheet according to claim 1, further comprising an adhesive layer that bonds the radiating layer and the insulating layer.

9. The hybrid insulation sheet according to claim 8, wherein the adhesive layer comprises one of acrylic, epoxy, aramid-based, urethane-based, polyamide-based, polyethylen-based, EVA-based, polyester-based, and PVC-based adhesives.

10. The hybrid insulation sheet according to claim 8, wherein the adhesive layer comprises a hot melt web or a hot melt powder having a large number of pores formed by accumulating fibers capable of being thermally bonded.

11. The hybrid insulation sheet according to claim 9, wherein the adhesive layer comprises a conductive filler for thermal spreading of an aspect ratio of 1:

100, and a spherical conductive filler for thermal transfer.

12. The hybrid insulation sheet according to claim 1, wherein the radiating layer comprises a first radiating layer having a first conductivity;

and a second radiating layer having a second conductivity bonded on the first radiating layer.

13. The hybrid insulation sheet according to claim 12, wherein the first conductivity of the first radiating layer is lower than the second conductivity of the second radiating layer, and the first radiating layer is attached to, contacts or approaches the heat generating component.

14. The hybrid insulation sheet according to claim 12, wherein the first radiating layer and the second radiating layer are diffusedly bonded or adhesively bonded.

15. The hybrid insulation sheet according to claim 1, further comprising a thermal radiation thin film formed on the radiating layer.

16. The hybrid insulation sheet according to claim 15, wherein the thermal radiation thin film is one of a coating film containing a graphene powder, a graphene thin film, and a film that is obtained by being coated with a nano-sol form which heat radiation particles are dispersed and being gelated and heat-treated.

17. The hybrid insulation sheet according to claim 1, further comprising an oxidation preventing film on the surface of the radiating layer.

18. The hybrid insulation sheet according to claim 17, wherein the oxidation preventing film comprises a Ni coated film.

20. An electronic apparatus comprising:

a bracket;

a display panel mounted on the bracket;

a cushion layer that positioned between the bracket and the display panel;

a flexible printed circuit board (FPCB) in which an AP (Application Processor) IC and a PM (Power Management) IC are mounted;

a removable back cover;

an inner cover that is positioned between the FPCB and the back cover and covers the bracket and the FPCB; and

a case containing a USIM (universal subscriber identity module card) chip and a micro memory that are mounted in the inner cover, wherein the electronic apparatus further comprises a hybrid insulation sheet claimed in claim 1, wherein the hybrid insulation sheet is mounted in at least one selected from a region of the cushion layer facing the bracket, a region between the FPCB and the inner cover, a region of the case where a USIM chip and micro memory are mounted, and a region of the back cover, to thus spread and radiate heat generated from heat generating components and suppress the heat from being delivered to the outside of the electronic apparatus and maintain an external temperature of the electronic apparatus to be at a certain temperature or below.

19. A hybrid insulation sheet comprising:

a first radiating layer that spreads heat generated from a heat generating component of an electronic apparatus in the horizontal direction and radiates the heat primarily;

an insulating layer that suppresses the heat saturated in the first radiating layer from being delivered in the vertical direction; and

a second radiating layer that spreads the heat delivered from the insulating layer in the horizontal direction and radiates the heat secondarily.