PEG ONLY NEAR-FIELD TRANSDUCER

• US 20140376340A1
• Filed: 11/01/2013
• Published: 12/25/2014
• Est. Priority Date: 06/24/2013
• Status: Abandoned Application

• Current Assignee: Seagate Technology LLC (Seagate Technology Holdings Plc)
• Original Assignee: Seagate Technology LLC (Seagate Technology Holdings Plc)
• Inventors: Cheng, Yuhang, Peng, Chubing
• Application Number:
  US14/069,960
• Publication Number:
  US 20140376340A1
• Time in Patent Office: Days
• US Class Current: 369/13.33
• CPC Class Codes: G11B 13/08 using near-field interactions or transducing means and at least one other method or means for recording or reproducing
• CPC Class Codes: G11B 2005/0021 Thermally assisted recording using an auxiliary energy source for heating the recording layer locally to assist the magnetization reversal
• CPC Class Codes: G11B 5/127 Structure or manufacture of heads, e.g. inductive
• CPC Class Codes: G11B 5/1278 specially adapted for magnetisations perpendicular to the surface of the record carrier
• CPC Class Codes: G11B 5/187 Structure or manufacture of the surface of the head in physical contact with, or immediately adjacent to the recording medium; Pole pieces; Gap features G11B5/265, G11B5/29 , G11B5/31 take precedence
• CPC Class Codes: G11B 5/1871 Shaping or contouring of the transducing or guiding surface
• CPC Class Codes: G11B 5/3133 including layers not usually being a part of the electromagnetic transducer structure and providing additional features, e.g. for improving heat radiation, reduction of power dissipation, adaptations for measurement or indication of gap depth or other properties of the structure G11B5/3106 takes precedence
• CPC Class Codes: G11B 5/314 where the layers are extra layers normally not provided in the transducing structure, e.g. optical layers G11B5/3196 takes precedence
• CPC Class Codes: G11B 5/3163 Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
• CPC Class Codes: G11B 5/4866 the arm comprising an optical waveguide, e.g. for thermally-assisted recording
• CPC Class Codes: G11B 5/6088 Optical waveguide in or on flying head
• CPC Class Codes: Y10T 29/49025 Making disc drive
• CPC Class Codes: Y10T 29/49032 Fabricating head structure or component thereof

Abstract

An apparatus for a heat assisted magnetic recording device that includes a write pole, a near-field transducer, and a heat sink. The near-field transducer is comprised only of a peg disposed adjacent the write pole. The heat sink is disposed between the write pole and at least a portion of the near-field transducer.

Claims

1. An apparatus for a heat assisted magnetic recording device, comprising:

a write pole;

a near-field transducer comprised only of a peg disposed adjacent the write pole; and

a heat sink disposed between the write pole and at least a portion of the near-field transducer.

2. The apparatus of claim 1, wherein the near-field transducer has a uniform cross-sectional area.

3. The apparatus of claim 1, wherein the near-field transducer has a length of between 50 nm and half of a wavelength of light used by a laser diode.

4. The apparatus of claim 1, wherein the heat sink extends with the near-field transducer along a length thereof from between 10 percent to 100 percent of a total length of the near-field transducer.

5. The apparatus of claim 1, wherein the heat sink interfaces with one or more non-media interfacing end surfaces of the near-field transducer.

6. The apparatus of claim 1, wherein the heat sink comprises an electrically insulating material having a thermal conductivity above 4 W/(m*K).

7. The apparatus of claim 6, wherein the heat sink directly contacts at least a portion of the near-field transducer.

8. The apparatus of claim 1, wherein the heat sink comprises at least one of diamond, AlN, MgO, AlO, MgO, BeO, CrO, SiO, BN, Si, SiC, carbide, and nitride.

9. The apparatus of claim 1, further comprising one or more layers of insulating material disposed between the heat sink and at least a portion of the near-field transducer.

10. The apparatus of claim 9, wherein the heat sink comprises at least one of a metallic material.

11. The apparatus of claim 9, wherein the one or more layers of insulating material has a thickness between 0.5 nm and 10.0 nm.

12. The apparatus of claim 1, further comprising one or more coupling layers disposed along a non-media interfacing surface of the near-field transducer.

13. The apparatus of claim 12, wherein the one or more coupling layers have refractive index less than 2.4

14. A system comprising:

a write pole;

a near-field transducer comprised of only a peg disposed adjacent the write pole;

a heat sink disposed between the write pole and at least a portion of the near-field transducer; and

one or more layers of insulating material disposed along the near-field transducer between the heat sink and the near-field transducer.

15. The system of claim 14, further comprising one or more coupling layers disposed along a non-media interfacing surface of the near-field transducer.

16. The system of claim 15, wherein the one or more coupling layers comprise at least one of SiO₂, Al₂O₃, MgO, AN, BN, and BeO.

17. The apparatus of claim 14, wherein the one or more layers of insulating material have a thickness between 0.5 nm and 10.0 nm.

18. A method of fabricating an apparatus for a heat assisted magnetic recording device, comprising:

forming a near-field transducer comprised of only a peg along a substrate of a heat assisted magnetic recording head, wherein the near-field transducer interfaces with and extends away from an air bearing surface;

forming a write pole adjacent the near-field transducer, wherein the write pole interfaces with and extends away from the air bearing surface; and

disposing a heat sink between at least a portion of the near-field transducer and the write pole.

19. The method of claim 18, further comprising depositing one or more layers of insulating material between the heat sink and at least a portion of the near-field transducer.

20. The method of claim 19, further comprising depositing one or more coupling layers along a non-media interfacing surface of the insulating material.