DIE-TO-DIE INDUCTIVE COMMUNICATION DEVICES AND METHODS
First Claim
1. A device comprising:
- a first integrated circuit (IC) die that includes a first coil proximate to a first surface of the first IC die, and a plurality of first bond pads proximate to the first surface of the first IC die, wherein the plurality of first bond pads are electrically coupled to the first coil;
a second IC die that includes a second coil proximate to a first surface of the second IC die, and a plurality of second bond pads proximate to the first surface of the second IC die, wherein the plurality of second bond pads are electrically coupled to the second coil, wherein the first IC die and the second IC die are arranged within the device so that the first surface of the first IC die faces the first surface of the second IC die, and the first coil and the second coil are aligned with each other across a gap between the first IC die and the second IC die, and wherein the first IC die and the second IC die are galvanically isolated from each other;
a dielectric structure within the gap, wherein the dielectric structure has a first surface and an opposing second surface, wherein the first surface of the dielectric structure faces the first surface of the first IC die, the second surface of the dielectric structure faces the first surface of the second IC die, and the dielectric structure includes a portion that extends beyond a lateral extent of the second IC die; and
a plurality of conductive structures on the second surface of the dielectric structure, wherein first ends of the plurality of conductive structures are aligned with and electrically coupled with the second bond pads, and second ends of the plurality of conductive structures are configured to function as a plurality of third bond pads.
20 Assignments
0 Petitions
Accused Products
Abstract
Embodiments of inductive communication devices include first and second galvanically isolated IC die and a dielectric structure. Each IC die has a coil proximate to a first surface of the IC die. The IC die are arranged so that the first surfaces of the IC die face each other, and the first coil and the second coil are aligned across a gap between the first and second IC die. The dielectric structure is positioned within the gap directly between the first and second coils, and a plurality of conductive structures are positioned in or on the dielectric structure and electrically coupled with the second IC die. The conductive structures include portions configured to function as bond pads, and the bond pads may be coupled to package leads using wirebonds. During operation, signals are conveyed between the IC die through inductive coupling between the coils.
14 Citations
16 Claims
-
1. A device comprising:
-
a first integrated circuit (IC) die that includes a first coil proximate to a first surface of the first IC die, and a plurality of first bond pads proximate to the first surface of the first IC die, wherein the plurality of first bond pads are electrically coupled to the first coil; a second IC die that includes a second coil proximate to a first surface of the second IC die, and a plurality of second bond pads proximate to the first surface of the second IC die, wherein the plurality of second bond pads are electrically coupled to the second coil, wherein the first IC die and the second IC die are arranged within the device so that the first surface of the first IC die faces the first surface of the second IC die, and the first coil and the second coil are aligned with each other across a gap between the first IC die and the second IC die, and wherein the first IC die and the second IC die are galvanically isolated from each other; a dielectric structure within the gap, wherein the dielectric structure has a first surface and an opposing second surface, wherein the first surface of the dielectric structure faces the first surface of the first IC die, the second surface of the dielectric structure faces the first surface of the second IC die, and the dielectric structure includes a portion that extends beyond a lateral extent of the second IC die; and a plurality of conductive structures on the second surface of the dielectric structure, wherein first ends of the plurality of conductive structures are aligned with and electrically coupled with the second bond pads, and second ends of the plurality of conductive structures are configured to function as a plurality of third bond pads. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
-
-
12. An inductive communication method comprising the steps of:
-
receiving an input signal at a bond pad of a first integrated circuit (IC) die; converting the input signal to a first signal by transmitter circuitry of the first IC die; providing the first signal to a first coil of the first IC die, wherein the first coil is proximate to a first surface of the first IC die, and the first coil converts the first signal into a time-varying magnetic field around the first coil; receiving a second signal by a second coil of a second IC die as a result of the time-varying magnetic field coupling with the second coil, wherein the second coil is proximate to a first surface of the second IC die, and wherein the first IC die and the second IC die are arranged within an integrated circuit package so that the first surface of the first IC die faces the first surface of the second IC die, and the first coil and the second coil are aligned with each other across a gap between the first IC die and the second IC die so that the first IC die and the second IC die are galvanically isolated from each other, wherein a dielectric structure is present in the gap between the first IC die and the second IC die, and the time-varying magnetic field extends across the gap through the dielectric structure; producing, by receiver circuitry of the second IC die, a reconstructed version of the input signal from the second signal; providing the reconstructed version of the input signal to a second bond pad of the second IC die; and conveying the reconstructed version of the input signal from the second bond pad to a third bond pad located on a top surface of the dielectric structure.
-
-
13. A method of manufacturing an inductive communication device, the method comprising the steps of:
-
coupling together a first integrated circuit (IC) die, a dielectric structure, and a second IC die, wherein the first IC die includes a first coil proximate to a first surface of the first IC die, and a plurality of first bond pads proximate to the first surface of the first IC die, wherein the plurality of first bond pads are electrically coupled to the first coil, the second IC die includes a second coil proximate to a first surface of the second IC die, and a plurality of second bond pads proximate to the first surface of the second IC die, wherein the plurality of second bond pads are electrically coupled to the second coil, the first IC die and the second IC die are arranged within the device so that the first surface of the first IC die faces the first surface of the second IC die, and the first coil and the second coil are aligned with each other across a gap between the first IC die and the second IC die, the first IC die and the second IC die are galvanically isolated from each other, the dielectric structure is positioned within the gap, and the dielectric structure has a first surface and an opposing second surface, wherein the first surface of the dielectric structure faces the first surface of the first IC die, the second surface of the dielectric structure faces the first surface of the second IC die, and the dielectric structure includes a portion that extends beyond a lateral extent of the second IC die, and a plurality of conductive structures are positioned on the second surface of the dielectric structure, wherein first ends of the plurality of conductive structures are aligned with and electrically coupled with the second bond pads, and second ends of the plurality of conductive structures are configured to function as a plurality of third bond pads; electrically connecting the plurality of first bond pads to first package leads; and electrically connecting the plurality of third bond pads to second package leads. - View Dependent Claims (14, 15, 16)
-
Specification