WIRELESS COMMUNICATION ENABLING CAPACITIVE IMAGING SENSOR ASSEMBLY
First Claim
1. An input device, comprising:
- an array of capacitive sensing electrodes comprising a plurality of pairs of sensor electrodes that are separated by a first gap, wherein the first gaps between two or more pairs of sensor electrodes are aligned along a first direction; and
a coil having a planar loop that is disposed within a first plane, wherein the first plane is parallel to the first direction and a second direction, and the planar loop comprises;
a first conductive trace having a first length that is positioned over the first gaps formed between the two or more pairs of sensor electrodes.
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Accused Products
Abstract
Embodiments of the invention generally provide a touch sensing device that is integrated with one or more components that are configured to use a wireless communication technique, such as a near field communication (NFC) technique, to communicate with another wireless communication enabled device. Some embodiments of the invention include configurations in which the touch sensing components and one or more NFC enabling components are configured so that the close proximate positioning of these components will minimally affect each other'"'"'s performance during normal operation. Embodiments of the invention may also provide an integrated touch sensing electrode design and wireless communication coil design that has a reduced system complexity, small overall physical size, low production cost and reduced electrical interaction.
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Citations
20 Claims
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1. An input device, comprising:
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an array of capacitive sensing electrodes comprising a plurality of pairs of sensor electrodes that are separated by a first gap, wherein the first gaps between two or more pairs of sensor electrodes are aligned along a first direction; and a coil having a planar loop that is disposed within a first plane, wherein the first plane is parallel to the first direction and a second direction, and the planar loop comprises; a first conductive trace having a first length that is positioned over the first gaps formed between the two or more pairs of sensor electrodes. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. An input device, comprising:
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an array of capacitive sensing electrodes comprising a plurality of sensor electrodes that are arranged in columns and rows relative to a first plane, wherein a first gap is formed between each adjacently positioned sensor electrode in the columns and a second gap is formed between each adjacently positioned sensor electrode in the rows; and a coil having at least one planar loop that is disposed in a second plane, wherein the second plane is parallel to the first plane, and the at least one planar loop comprises a conductive trace comprising; a first length that is positioned over a plurality of the first gaps; and a second length that is positioned over a plurality of the second gaps. - View Dependent Claims (11, 12, 13, 14, 15, 16)
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17. An input device, comprising:
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an array of capacitive sensing electrodes comprising a plurality of first sensor electrodes and a plurality of second sensor electrodes, wherein each first sensor electrode comprises a body region that has one or more slots formed therein, and are aligned along a first direction; and a coil having at least one planar loop that is disposed in a first plane, wherein the first plane is parallel to the first direction and a second direction, and the at least one planar loop comprises a conductive trace that is positioned over each of the first sensor electrodes that are aligned along the first direction. - View Dependent Claims (18, 19)
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20. A method of forming an input device, comprising:
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receiving a substrate comprising an array of capacitive sensing electrodes that are disposed on a first surface of the substrate, wherein the array of capacitive sensing electrodes comprise a plurality of pairs of sensor electrodes that are separated by a first gap, wherein the first gaps between two or more pairs of sensor electrodes are aligned along a first direction; and bonding a coil having a planar loop to the first surface of the substrate, wherein the bonded planar loop is disposed parallel to the first surface, and bonding the coil further comprises aligning a conductive trace of the planar loop over the first gaps.
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Specification