SEMICONDUCTOR DEVICE AND SEMICONDUCTOR SYSTEM

• US 20150003016A1
• Filed: 03/19/2012
• Published: 01/01/2015
• Est. Priority Date: 03/19/2012
• Status: Abandoned Application

• Current Assignee: Mitsubishi Electric Corporation
• Original Assignee: Mitsubishi Electric Corporation
• Inventors: Miyamoto, Noboru, Shirasawa, Takaaki
• Application Number:
  US14/361,757
• Publication Number:
  US 20150003016A1
• Time in Patent Office: Days
• US Class Current: 361/701
• CPC Class Codes: H01L 23/16 Fillings or auxiliary members in containers or encapsulations, e.g. centering rings H01L23/42, H01L23/552 take precedence
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

It is an object of the present invention to provide a semiconductor device which is easily replaceable and a semiconductor system using the semiconductor device. The semiconductor device of the present invention includes a semiconductor chip, a cooler that cools the semiconductor chip, a housing that houses the semiconductor chip and the cooler, a transfer resin that seals the semiconductor chip and the cooler inside the housing, electrodes connected to the semiconductor chip, and a joining pipe attached to the cooler, the joining pipe letting in and out a flow of a refrigerant from and to the cooler. The electrodes and the joining pipe are formed to protrude from the same surface of the housing in substantially the same direction.

Claims

1. A semiconductor device, comprising:

a semiconductor chip;

a cooler that cools said semiconductor chip;

a housing that houses said semiconductor chip and said cooler;

a sealing resin that seals said semiconductor chip and said cooler inside said housing;

an electrode connected to said semiconductor chip; and

a joining pipe attached to said cooler, said joining pipe letting in and out a flow of a refrigerant from and to said cooler,

wherein said electrode and said joining pipe are formed to protrude from the same surface of said housing in substantially the same direction.

2. The semiconductor device according to claim 1, wherein said joining pipe of said cooler is formed of a resin or a surface thereof is coated with a resin layer.

3. The semiconductor device according to claim 1, further comprising a communication cable for communication of a control signal between an external source and said semiconductor chip,

wherein said communication cable is formed to protrude from a surface facing the same surface of said housing, from which said electrode and said joining pipe protrude.

4. The semiconductor device according to claim 1 which is configured to be removable from a semiconductor container formed of a connection electrode and a cooling channel integrally formed with each other,

wherein in a state of being mounted to said semiconductor container, said electrode and said joining pipe are connected to said connection electrode and said cooling channel, respectively.

5. The semiconductor device according to claim 1, wherein said cooler is provided on both surface sides of said semiconductor chip.

6. The semiconductor device according to claim 1, further comprising an indicator that emits light in a pattern corresponding to a degree of deterioration or failure of said semiconductor chip,

wherein said indicator has light emitting surfaces along at least two or more surfaces of said housing.

7. The semiconductor device according to claim 6, wherein said indicator also functions as a light emitting element for light communication with an external device.

8. The semiconductor device according to claim 6, wherein said indicator has a function of holding electric power to emit light for a period of time.

9. A semiconductor system, comprising:

a plurality of semiconductor devices according to claim 1; and

drive control signal generation means that generates signals for controlling driving of the semiconductor chips of said semiconductor devices in a feedback process and outputs said signals to said semiconductor devices,

wherein said drive control signal generation means bundles commands to said plurality of semiconductor devices into a piece of data at time intervals shorter than cycles of said feedback process and transmits said piece of data.